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Nexperia USA Inc. PMEG2010EPAS-QX

Part No.:
PMEG2010EPAS-QX
Manufacturer:
Nexperia USA Inc.
Category:
Single Diodes
Package:
3-UDFN Exposed Pad
Datasheet:
AetrixPMEG2010EPAS-QX.pdf
Description:
PMEG2010EPAS-Q/SOT1061/HUSON3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,987

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Product details

Overview

PMEG2010EPAS-QX from Nexperia is a 20 V, 1 A AEC-Q101-qualified MEGA Schottky barrier rectifier in DFN2020D-3 (SOT1061D) package, featuring 320–375 mV forward voltage at 1 A, ≤1900 µA reverse leakage at 20 V, and integrated guard ring for stress protection-used in mobile battery chargers, LED backlighting, and automotive DC-DC converters.

For engineers reviewing the PMEG2010EPAS-QX datasheet, PMEG2010EPAS-QX pinout, PMEG2010EPAS-QX application, or PMEG2010EPAS-QX equivalent, key selection criteria include low VF performance under pulsed 1 A load, thermal resistance to solder point (12 K/W), AEC-Q101 qualification, ultra-thin 0.65 mm profile, and dual-anode cathode-tab thermal design for high-density power management.

Technical Context

This Schottky rectifier uses planar MEGA technology with an integrated guard ring to suppress edge breakdown and improve surge robustness. Its dual-anode configuration (Pins 1 & 2) shares current while Pin 3 (cathode) serves as both electrical return and exposed thermal pad.

Designed for low-voltage, high-efficiency operation, it delivers fast switching (50 ns trr) and low capacitance (65 pF at 10 V), enabling use in high-frequency SMPS and reverse polarity protection where minimal conduction loss and compact footprint are critical.

Key Specifications

Parameter Value and Actual Design Meaning
VF @ 1 A 320–375 mV - enables <150 mW conduction loss at full rated current, reducing heat generation in space-constrained mobile power rails
VR 20 V - supports input stages of 12 V automotive systems and 5–12 V portable DC-DC converters with margin
IR @ 20 V 335–1900 µA - low leakage preserves battery standby time in always-on mobile and telematics applications
trr 50 ns - minimizes switching losses and EMI in >500 kHz buck/boost topologies
Rth(j-sp) 12 K/W - direct thermal path from junction to solder point enables >1.4 A peak current handling on FR4 with 1 cm² cathode pad
Package DFN2020D-3 (SOT1061D), 2.0 × 2.0 × 0.65 mm - ultra-thin leadless package with side-wettable flanks for AOI-compatible reflow and PCB area reduction
AEC-Q101 Qualified - validated for automotive temperature range (−40 °C to +150 °C) and mechanical stress per discrete semiconductor standard

Pinout & Package

Encapsulated in DFN2020D-3 (SOT1061D): ultra-thin 2.0 × 2.0 × 0.65 mm leadless plastic package with visible, solderable side pads and exposed cathode thermal pad (Pin 3).

Pin/Terminal Circuit Role Design Meaning
1 Anode Primary anode connection; electrically tied to Pin 2; used for parallel current sharing and layout symmetry
2 Anode Secondary anode; identical to Pin 1-both must be routed with equal impedance for balanced current distribution
3 Cathode Exposed copper thermal pad; serves as main current return and primary heat dissipation path to PCB

Key Features

Feature Design Value
Guard ring integration Suppresses edge breakdown under transient overvoltage, improving reliability in automotive load-dump conditions
Exposed cathode pad Reduces Rth(j-sp) to 12 K/W-enables >1 W power dissipation on standard FR4 with 1 cm² copper area
Side-wettable flanks Enables automated optical inspection (AOI) of solder joints without X-ray, supporting high-yield SMT assembly
Low-profile packaging 0.65 mm max height allows stacking under thin bezels in smartphones and automotive displays
Pulsed IFRM rating 7 A (tp ≤ 1 ms)-supports inrush current limiting in USB-C PD and wireless charging receiver circuits

Applications

Mobile Battery Charging Automotive Telematics Power Rail

Use Scenario: Input rectification and reverse polarity protection in single-cell Li-ion charger IC front-end.

IC Role / Device Role / Timing Role: Schottky rectifier providing low-loss 5–9 V input path and blocking reverse current during adapter hot-swap.

Use Value: 320 mV VF at 1 A cuts conduction loss by >40% vs. standard Schottky diodes, extending runtime and reducing thermal stress on PMIC.

Use Scenario: Output rectification in 5 V/1 A buck converter powering GPS, CAN transceiver, and MCU in vehicle infotainment head unit.

IC Role / Device Role / Timing Role: High-frequency synchronous rectifier replacement with zero gate-drive complexity.

Use Value: 50 ns trr and 65 pF capacitance minimize switching node ringing and EMI, easing EMC compliance in crowded automotive PCBs.

LED Backlight Driver Industrial Sensor Node Power

Use Scenario: Freewheeling path in boost-based white LED driver for smartphone display backlight.

IC Role / Device Role / Timing Role: Fast-recovery freewheeling diode conducting during MOSFET off-time in 1–2 MHz boost topology.

Use Value: Low VF and low Cd reduce energy loss per cycle, increasing driver efficiency from 82% to 87% at 20 mA per string.

Use Scenario: Reverse polarity and surge protection for 3.3 V rail supplying ultra-low-power IoT sensor nodes with coin-cell backup.

IC Role / Device Role / Timing Role: Fail-safe input protection diode placed before LDO regulator.

Use Value: AEC-Q101 qualification and −40 °C to +125 °C operation ensure long-term reliability in uncontrolled industrial environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
RB050M-30 Higher VF (450 mV @ 1 A), larger SOD-123FL package (3.5 × 1.6 × 1.0 mm), no AEC-Q101 qualification Suitable for cost-sensitive consumer power supplies but not automotive or high-density mobile designs Select when board space and qualification are non-critical, and lower VF is not required
SS12-A Same 20 V VR, but higher IR (5000 µA @ 20 V), TO-277 package (5.5 × 2.7 × 0.9 mm), no side-wettable flanks Acceptable for industrial SMPS where thermal pad access and AOI are not needed Choose only if legacy TO-277 footprint compatibility is mandatory and leakage tolerance >3× higher

Compared with RB050M-30 and SS12-A, PMEG2010EPAS-QX delivers superior thermal performance (12 K/W vs. >40 K/W), tighter leakage control, and automotive-grade reliability in half the PCB area-making it optimal for next-gen mobile and ADAS power modules.

Availability

PMEG2010EPAS-QX is available at Aetrix Electronics and suitable for automotive telematics, mobile battery charging, LED backlighting, and industrial sensor node power applications requiring stable component supply, AEC-Q101 compliance, and ultra-thin thermal management.

Supply support for PMEG2010EPAS-QX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies-delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and mobile markets.

PMEG2010EPAS-QX belongs to Nexperia's MEGA Schottky rectifier product line, engineered specifically for high-efficiency, space-constrained power conversion in automotive and portable electronics where low VF, small size, and AEC-Q101 reliability are mandatory.

FAQ

What is the maximum continuous forward current for PMEG2010EPAS-QX at 125 °C ambient?

At Tamb = 125 °C on a standard FR4 PCB, the average forward current IF(AV) is rated at 1 A with 0.5 duty cycle and 20 kHz square wave. Derating applies above this temperature: Fig. 10 shows ~0.75 A at 125 °C for DC operation on FR4 with standard footprint.

Does PMEG2010EPAS-QX support reflow soldering with standard lead-free profiles?

Yes-Nexperia specifies compatibility with JEDEC J-STD-020D reflow profiles. The DFN2020D-3 package supports peak temperatures up to 260 °C, and the side-wettable flanks enable reliable solder joint formation verified by AOI without X-ray inspection.

How does the dual-anode configuration affect PCB layout?

Pins 1 and 2 are internally connected anodes and must be routed with matched trace length and width to ensure current balancing. Unequal impedance causes thermal imbalance and premature failure; symmetric fanout to the input net is required per Nexperia layout guidelines.

Is the cathode pad (Pin 3) required to be soldered for functional operation?

Yes-Pin 3 is the sole cathode terminal and primary thermal path. Leaving it unsoldered violates Absolute Maximum Ratings: junction temperature exceeds 150 °C within milliseconds at 1 A, causing irreversible degradation. Full solder coverage of the exposed pad is mandatory.

PMEG2010EPAS-QX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
3-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
20 V
Current - Average Rectified (Io):
1A
Voltage - Forward (Vf) (Max) @ If:
375 mV @ 1 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
50 ns
Current - Reverse Leakage @ Vr:
1.9 mA @ 20 V
Capacitance @ Vr, F:
175pF @ 1V, 1MHz
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
DFN2020D-3
Operating Temperature - Junction:
150°C

PMEG2010EPAS-QX FAQ

1.How can I place an order for PMEG2010EPAS-QX through Aetrix?

Please submit a Request for Quotation (RFQ) for PMEG2010EPAS-QX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PMEG2010EPAS-QX reliable?

The price and inventory of PMEG2010EPAS-QX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG2010EPAS-QX is usually 5 days.

3.What payment methods are accepted for PMEG2010EPAS-QX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG2010EPAS-QX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PMEG2010EPAS-QX?

PMEG2010EPAS-QX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PMEG2010EPAS-QX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PMEG2010EPAS-QX?

For technical support, including PMEG2010EPAS-QX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG2010EPAS-QX requirements.

6.How does Aetrix verify that PMEG2010EPAS-QX is sourced from the original manufacturer or authorized distributors?

All PMEG2010EPAS-QX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG2010EPAS-QX meets industry standards.

7.What is the process for return or replacement of PMEG2010EPAS-QX?

All PMEG2010EPAS-QX units undergo pre-shipment inspection (PSI). If there is an issue with PMEG2010EPAS-QX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PMEG2010EPAS-QX part is unused and in its original packaging.

Return procedure for PMEG2010EPAS-QX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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