Nexperia USA Inc. PMEG3002AEB,115

Overview

PMEG3002AEB from Nexperia is a planar Schottky barrier diode with integrated guard ring for stress protection, rated at 30 V reverse voltage and 200 mA forward current, featuring a typical forward voltage of 420 mV at 200 mA. It is used in ultra-high-speed switching and low-voltage rectification within space-constrained portable electronics and DC/DC converters.

For engineers reviewing the PMEG3002AEB datasheet, PMEG3002AEB pinout, PMEG3002AEB application, or PMEG3002AEB equivalent, key selection criteria include its ultra-low VF performance at low currents (130–480 mV), 25 pF diode capacitance at 1 V, 300 mA repetitive peak forward current, thermal resistance of 450 K/W on FR4, and SOD523 package compatibility with high-density PCB layouts.

Technical Context

This Schottky diode employs a planar silicon structure with an integrated guard ring to suppress edge breakdown and improve reliability under transient stress. Its low forward voltage stems from optimized metal-semiconductor junction design, enabling efficient conduction down to 0.1 mA (130 mV typ).

Thermal behavior is defined by junction-to-ambient resistance of 450 K/W on standard FR4 with single-sided copper, and operation is limited to 125 °C maximum junction temperature. Reverse leakage remains below 10 µA at 10 V and 25 °C, supporting stable clamping and polarity protection functions.

Key Specifications

Pinout & Package

Encapsulated in SOD523 (SC-79) ultra-small surface-mount package: 1.2 mm × 0.8 mm × 0.6 mm body, flat lead profile, cathode marked by bar on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Compared with RB520S-30T1G and NSR0230HT1G, PMEG3002AEB delivers the lowest verified VF (420 mV) at full 200 mA rating in SOD523, making it optimal for thermally constrained, high-efficiency 24 V and 12 V subsystems where every millivolt of conduction loss matters.

Availability

PMEG3002AEB is available at Aetrix Electronics and suitable for USB port protection, DC/DC converter rectification, low-voltage signal clamping, and Li-ion battery charger feedback isolation requiring stable component supply and consistent SOD523 footprint availability.

Supply support for PMEG3002AEB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a leading global semiconductor manufacturer headquartered in Nijmegen, Netherlands, specializing in high-performance, energy-efficient logic, discrete, and MOSFET devices for automotive, industrial, and consumer markets.

PMEG3002AEB belongs to Nexperia's low-VF Schottky diode product line, engineered specifically for space- and power-sensitive applications including portable electronics, wearables, and high-frequency power conversion where minimal forward voltage and ultra-small packaging are critical.

FAQ

What is the maximum allowable junction temperature for PMEG3002AEB?

The absolute maximum junction temperature (Tj) is 125 °C per IEC 60134 limiting values. Operation beyond this threshold risks permanent parametric shift or failure. Derating is required above 25 °C ambient based on Rth(j-a) = 450 K/W; for example, at 60 °C ambient, max continuous power must be limited to ~70 mW to maintain Tj ≤ 125 °C.

Is PMEG3002AEB suitable for automotive applications?

No-PMEG3002AEB is not automotive-qualified. Nexperia explicitly states in its legal disclaimers that unless otherwise specified, products are not tested or warranted for automotive use. It lacks AEC-Q101 qualification, extended temperature validation, and automotive-grade traceability required for under-hood or safety-critical systems.

How does the integrated guard ring affect reliability?

The integrated guard ring mitigates electric field crowding at the silicon periphery, suppressing premature edge breakdown under high dv/dt or reverse-biased transients. This improves long-term reliability in clamping and inverse-polarity protection roles without degrading forward conduction characteristics or increasing capacitance.

What is the recommended reflow soldering footprint for SOD523?

The official Nexperia reflow footprint specifies 0.5 mm pad width, 0.6 mm pad length, 0.4 mm solder mask opening, and 2.15 mm center-to-center spacing. Pad dimensions match Figure 6 in the datasheet; using this layout ensures reliable wetting, minimizes tombstoning, and maintains thermal performance consistent with the 450 K/W Rth(j-a) rating.