Nexperia USA Inc. PMEG3002AESFYL

Overview

PMEG3002AESFYL from Nexperia is a 30 V, 0.2 A planar MEGA Schottky barrier rectifier in a DSN0603-2 (SOD962-2) leadless chip-scale package, featuring typ. 250 mV forward voltage, 4 µA reverse current at 10 V, and 1.37 ns reverse recovery time - optimized for ultra-low-loss rectification in space-constrained DC-DC converters and mobile LED backlight circuits.

For engineers reviewing the PMEG3002AESFYL datasheet, PMEG3002AESFYL pinout, PMEG3002AESFYL application, or PMEG3002AESFYL equivalent, this device is selected for high-efficiency low-voltage power conversion where minimal VF, ultra-fast switching, and sub-0.3 mm profile are critical design requirements.

Technical Context

This Schottky diode employs a planar MEGA structure with integrated guard ring for enhanced surge robustness and thermal stability. Its ultra-low VF stems from optimized metal-semiconductor interface engineering, enabling efficient conduction at IF = 10 mA with Tj = 25 °C.

The device achieves nanosecond-scale trr due to minimized minority carrier storage and low junction capacitance (8 pF at VR = 10 V), making it suitable for >1 MHz switching topologies. Thermal performance is defined by Rth(j-sp) = 40 K/W when soldered to ceramic PCBs, supporting high ambient operation up to 150 °C.

Key Specifications

Pinout & Package

DSN0603-2 (SOD962-2) is a 2-terminal leadless chip-scale package with 0.3 mm nominal height, 0.6 mm × 0.3 mm body, and cathode marked by a visible bar on the top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with RB521S-30T2R and NSR0230P2T5G, PMEG3002AESFYL delivers the lowest VF and smallest footprint among 30 V Schottkys, enabling highest power density and longest battery life in ultra-thin portable designs - but requires reflow process validation for DSN0603-2 geometry.

Availability

PMEG3002AESFYL is available at Aetrix Electronics and suitable for mobile LED backlighting, USB-C power delivery systems, and wearable sensor power supplies requiring stable component supply with guaranteed long-term sourcing.

Supply support for PMEG3002AESFYL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

This device belongs to Nexperia's MEGA Schottky rectifier product line, engineered specifically for ultra-low VF and ultra-small packaging in battery-powered portable electronics and high-frequency DC-DC conversion.

FAQ

What is the maximum allowable soldering temperature profile for PMEG3002AESFYL?

The DSN0603-2 package is qualified for standard lead-free reflow per JEDEC J-STD-020, with peak temperature ≤ 260 °C for ≤ 30 seconds. Preheat ramp rate must not exceed 3 °C/s, and time above 217 °C shall be 60–150 seconds. Exceeding these limits risks solder joint voiding or die attach delamination due to thermal mismatch in the ultra-thin CSP structure.

Does PMEG3002AESFYL require external reverse polarity protection?

No - its 30 V reverse voltage rating and integrated guard ring provide inherent reverse-blocking capability up to VR = 30 V. When used in USB-C PD applications with ±20 V transients, it must be paired with a TVS diode (e.g., PESD5V0S1BA) clamping at ≤ 24 V to prevent junction breakdown, as the device lacks built-in transient suppression beyond steady-state VR.

How does thermal resistance change when mounted on FR4 vs. ceramic PCB?

Rth(j-a) is 310 K/W on standard FR4 but improves to 105 K/W on Al₂O₃ ceramic PCB. This 3× reduction enables 0.2 A continuous operation at 85 °C ambient on ceramic versus 55 °C on FR4 - critical for sealed enclosures where forced airflow is unavailable and thermal dissipation relies solely on board conduction.

Can PMEG3002AESFYL replace a standard 1N5817 in an existing design?

No - direct replacement is not feasible due to incompatible packages (DSN0603-2 vs. DO-41), different pinouts (cathode/anode orientation), and significantly lower IF(AV) rating (0.2 A vs. 1 A). Layout redesign, solder paste stencil revision, and thermal validation are required; however, its 250 mV VF offers superior efficiency in new compact designs where space and loss budget are constrained.