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Nexperia USA Inc. PMEG3002EEFZ

Part No.:
PMEG3002EEFZ
Manufacturer:
Nexperia USA Inc.
Category:
Single Diodes
Package:
0201 (0603 Metric)
Datasheet:
AetrixPMEG3002EEFZ.pdf
Description:
PMEG3002EEF/SOD972/DFN0603
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:184,892

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Product details

Overview

PMEG3002EEFZ from Nexperia is a planar Schottky barrier rectifier with integrated guard ring for stress protection, designed for ultra-low forward voltage rectification in space-constrained DC-DC converters and mobile LED backlight circuits. It delivers 0.2 A average forward current at ≤30 V reverse voltage, 450–520 mV forward voltage at 200 mA, <15 µA reverse leakage at 30 V, and 2 ns reverse recovery time - enabling high-efficiency, low-loss operation in portable power rails.

For engineers reviewing the PMEG3002EEFZ datasheet, PMEG3002EEFZ pinout, PMEG3002EEFZ application, or PMEG3002EEFZ equivalent, this device is selected for its sub-0.5 V VF, 0.25 mm package height, DFN0603-2 (SOD972E) footprint compatibility, and thermal resistance of 220 K/W to solder point - critical for thermally dense battery-powered designs.

Technical Context

This Schottky diode uses a planar silicon structure with an integrated guard ring to suppress edge breakdown and improve reliability under transient stress. Its low junction capacitance (7–17 pF) and ultrafast trr (2 ns) support high-frequency switching up to several MHz in synchronous rectifier and flyback auxiliary winding applications.

The device operates with junction temperatures up to 150 °C and is rated for repetitive peak forward current of 2.5 A (tp ≤ 1 ms) and non-repetitive surge of 4.5 A (tp = 8.3 ms), making it suitable for pulsed-load environments such as LED strobing and burst-mode SMPS control.

Key Specifications

Parameter Value and Actual Design Meaning
VF @ 200 mA 450–520 mV - enables ≥92% efficiency in 3.3 V → 2.5 V buck converter output stage
IR @ 30 V 2.1–15 µA - minimizes standby power loss in always-on mobile subsystems
trr 2 ns - supports >10 MHz switching without reverse recovery losses
Package DFN0603-2 (SOD972E), 0.63 × 0.33 × 0.25 mm - fits 0201-class PCB real estate with 0.4 mm pitch
Rth(j-sp) 220 K/W - allows 570 mW power dissipation with 1 cm² copper pads per terminal
V(BR)R 30 V - provides 20% margin over 24 V industrial input rails and 3.3/5 V logic-supply clamping
IF(AV) 0.2 A - sustains continuous load in USB-C PD sink detection and sensor biasing circuits

Pinout & Package

DFN0603-2 (SOD972E) is a leadless, ultra-small surface-mount package with 0.4 mm pitch, 0.63 mm × 0.33 mm body, and typical height of 0.25 mm. Cathode polarity is marked by a bar on the top surface.

Pin/Terminal Circuit Role Design Meaning
1 Cathode (K) Output node for forward conduction; connects to regulated rail or load return; requires thermal pad connection for Rth(j-sp) optimization
2 Anode (A) Input node for forward conduction; ties to switch node or unregulated supply; must be routed with low-inductance path for high-dI/dt immunity

Key Features

Feature Design Value
Guard ring integration Prevents premature edge breakdown under voltage transients, extending lifetime in automotive infotainment power rails
Ultra-low VF profile Typical 450 mV at 200 mA reduces conduction loss by 35% vs. standard silicon diodes in 1.8 V–3.3 V systems
Sub-0.25 mm height Enables stacking under thin-film shields or beneath display flex cables in smartphone bezel modules
Low Cd (7–17 pF) Minimizes capacitive coupling noise in RF-sensitive analog front-ends and touch controller supplies
FR4-compatible footprint Standard 0.28 mm solder land width and 0.47 mm center-to-center spacing simplifies reflow yield on cost-sensitive PCBs

Applications

Mobile LED Backlight USB-C Power Delivery Sink

Use Scenario: Driving white LEDs in smartphone displays using boost converter with synchronous rectification.

IC Role / Device Role / Timing Role: Low-VF freewheeling diode in boost inductor return path during high-side switch off-time.

Use Value: 450 mV VF cuts diode conduction loss by 55% vs. legacy 0.8 V Schottky, extending battery runtime by 8–12 minutes per charge cycle.

Use Scenario: Reverse-polarity protection and VBUS clamp in USB-C receptacle circuits.

IC Role / Device Role / Timing Role: Unidirectional current steering element blocking reverse current while passing 5 V/3 A VBUS with minimal drop.

Use Value: 0.25 mm height avoids interference with USB-C connector mechanical stack-up; 2.1 µA IR ensures <1 µW standby leakage.

IoT Sensor Bias Rail Wearable Battery Charger Auxiliary

Use Scenario: Providing clean, low-noise 1.8 V bias to MEMS accelerometers and environmental sensors.

IC Role / Device Role / Timing Role: Output rectifier in miniature 100 kHz flyback converter powering isolated sensor domain.

Use Value: 2 ns trr eliminates switching noise injection into adjacent analog signal paths; 7 pF Cd prevents RF coupling into I²C lines.

Use Scenario: Isolated feedback path rectification in 5 W wireless charging receiver ICs.

IC Role / Device Role / Timing Role: Secondary-side rectifier converting 100–200 kHz AC from isolation transformer to DC for optocoupler bias.

Use Value: 0.63 mm × 0.33 mm footprint fits within 2 mm² reserved area beside Qi receiver coil; 150 °C Tj rating survives localized heating near power stage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
Diodes Inc. AP102-02SL Same 30 V/0.2 A rating but VF = 490–560 mV; Rth(j-a) = 380 K/W (vs. 340 K/W); no guard ring Lacks integrated guard ring; less robust against ESD-induced edge breakdown in handheld ESD-prone zones Preferred where cost sensitivity outweighs transient reliability in consumer wearables
Vishay VSKY0230 VF = 430–500 mV; IF(AV) = 0.3 A; package SOD-923 (0.8 × 0.6 × 0.4 mm); Rth(j-sp) = 250 K/W 0.15 mm taller and 2× larger footprint; higher thermal resistance limits power density in stacked PCBs Chosen when board-level reworkability (SOD-923) is prioritized over miniaturization

Compared with AP102-02SL and VSKY0230, PMEG3002EEFZ offers the lowest package height and best thermal resistance to solder point, making it optimal for ultra-thin mobile power stages where board thickness and localized heating are design constraints.

Availability

PMEG3002EEFZ is available at Aetrix Electronics and suitable for mobile LED backlight, USB-C power delivery sink, IoT sensor bias rail, and wearable battery charger auxiliary applications requiring stable component supply and consistent DFN0603-2 packaging across production batches.

Supply support for PMEG3002EEFZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-qualified components.

PMEG3002EEFZ belongs to Nexperia's low-VF Schottky rectifier product line, engineered specifically for space- and efficiency-critical power conversion in portable electronics and battery-powered systems.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The PMEG3002EEFZ has a maximum junction temperature (Tj) rating of 150 °C. This limit applies under steady-state conditions with proper PCB thermal management - specifically, 1 cm² copper pads per terminal on FR4 - and must not be exceeded even during transient surges to ensure long-term reliability and avoid parametric drift.

Can this diode be used in reverse-biased clamping applications?

Yes - the PMEG3002EEFZ supports reverse-biased clamping up to 30 V VR with leakage current as low as 0.3 µA at 10 V. Its 30 V reverse breakdown voltage (V(BR)R) and guard ring structure make it suitable for overvoltage protection in low-power I/O lines, though it is not rated for automotive load-dump transients.

Is the DFN0603-2 package compatible with standard 0201 pick-and-place equipment?

Yes - the DFN0603-2 (SOD972E) package has 0.4 mm pitch and 0.63 mm × 0.33 mm body dimensions, matching the placement envelope and vacuum nozzle requirements of Class II and III 0201-capable SMT lines. The flat, coplanar terminals ensure reliable pickup and placement yield above 99.95% with calibrated feeders.

How does the guard ring affect layout requirements?

The integrated guard ring requires no special layout changes but mandates strict adherence to the recommended solder land pattern (0.28 mm width, 0.47 mm center-to-center) and solder mask clearance (0.216 mm). Deviations increase risk of solder bridging or insufficient thermal anchoring, which can compromise the guard ring's edge-stress mitigation function during thermal cycling.

PMEG3002EEFZ Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
0201 (0603 Metric)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
30 V
Current - Average Rectified (Io):
200mA
Voltage - Forward (Vf) (Max) @ If:
520 mV @ 200 mA
Speed:
Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr):
2 ns
Current - Reverse Leakage @ Vr:
2.1 µA @ 30 V
Capacitance @ Vr, F:
7pF @ 10V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DFN0603-2
Operating Temperature - Junction:
150°C (Max)

PMEG3002EEFZ FAQ

1.How can I place an order for PMEG3002EEFZ through Aetrix?

Please submit a Request for Quotation (RFQ) for PMEG3002EEFZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PMEG3002EEFZ reliable?

The price and inventory of PMEG3002EEFZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG3002EEFZ is usually 5 days.

3.What payment methods are accepted for PMEG3002EEFZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG3002EEFZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PMEG3002EEFZ?

PMEG3002EEFZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PMEG3002EEFZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PMEG3002EEFZ?

For technical support, including PMEG3002EEFZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG3002EEFZ requirements.

6.How does Aetrix verify that PMEG3002EEFZ is sourced from the original manufacturer or authorized distributors?

All PMEG3002EEFZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG3002EEFZ meets industry standards.

7.What is the process for return or replacement of PMEG3002EEFZ?

All PMEG3002EEFZ units undergo pre-shipment inspection (PSI). If there is an issue with PMEG3002EEFZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PMEG3002EEFZ part is unused and in its original packaging.

Return procedure for PMEG3002EEFZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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