Nexperia USA Inc. PMEG3005AESFYL

Overview

PMEG3005AESFYL from Nexperia is a 30 V, 0.5 A planar MEGA Schottky barrier rectifier in a leadless DSN0603-2 (SOD962-2) chip-scale package, featuring typ. 405 mV forward voltage at 200 mA, 20 µA reverse leakage at 30 V, and 1.37 ns reverse recovery time - deployed for ultra-low-loss DC-to-DC conversion in space-constrained mobile power rails.

For engineers reviewing the PMEG3005AESFYL datasheet, PMEG3005AESFYL pinout, PMEG3005AESFYL application, or PMEG3005AESFYL equivalent, key selection criteria include forward voltage drop under pulsed 200 mA load, thermal resistance to solder point (40 K/W), junction temperature limit (150 °C), and compatibility with reflow-soldered 0.6 × 0.3 mm footprints in high-density portable designs.

Technical Context

This Schottky diode uses a planar silicon structure with integrated guard ring for enhanced ESD and surge robustness. Its low VF stems from optimized metal-semiconductor interface design, enabling efficient unidirectional conduction in synchronous buck converter freewheeling paths.

It operates without minority-carrier storage, delivering sub-1.4 ns trr and negligible reverse recovery charge - critical for minimizing switching losses in 1–3 MHz DC/DC converters powering AMOLED displays and RF front-end bias rails.

Key Specifications

Pinout & Package

DSN0603-2 (SOD962-2) is a 2-terminal, leadless chip-scale package with 0.6 mm × 0.3 mm body and 0.3 mm height. The cathode is marked by a visible bar on the top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with RB521S-30T2R and NSR0330P2T5G, PMEG3005AESFYL delivers the lowest VF and shortest trr in its 0.5 A/30 V class while maintaining the smallest Z-height - making it optimal for high-efficiency, ultra-thin mobile power stages where thermal and spatial constraints dominate.

Availability

PMEG3005AESFYL is available at Aetrix Electronics and suitable for mobile display power, USB-C PD auxiliary rails, wearable sensor hubs, and IoT edge node PMICs requiring stable component supply across high-mix, low-volume production runs.

Supply support for PMEG3005AESFYL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete and logic devices for automotive, industrial, and consumer markets.

This device belongs to Nexperia's MEGA Schottky rectifier product line, engineered specifically for ultra-low VF and ultra-fast switching in space- and power-constrained portable electronics power conversion.

FAQ

What is the maximum allowable solder point temperature for PMEG3005AESFYL during reflow?

The absolute maximum solder point temperature is 150 °C, with recommended reflow profile peaking at ≤260 °C for ≤10 seconds. Thermal resistance from junction to solder point is 40 K/W, so sustained 150 °C solder point implies ~110 °C junction temperature at 1 W dissipation - well within the 150 °C Tj limit.

Can PMEG3005AESFYL be used in place of a standard 1N5817 in a 5 V buck converter?

No - PMEG3005AESFYL is rated for 30 V reverse voltage but only 0.5 A average forward current and requires precise DSN0603-2 footprint alignment. The 1N5817 handles 1 A and uses DO-214AC packaging; direct substitution would require PCB redesign and thermal validation due to differing Rth(j-a) and mounting geometry.

Does the "YL" suffix indicate tape-and-reel packaging or a different electrical variant?

The "YL" suffix denotes the standard tape-and-reel packaging option (3000 pcs/reel) per ordering code PMEG3005AESFYL,115. Electrical specifications, package dimensions, and marking remain identical to base part PMEG3005AESF; no parametric or functional differentiation exists.

How does the guard ring affect layout requirements on the PCB?

The integrated guard ring requires ≥0.15 mm clearance between cathode/anode solder lands and adjacent copper features to prevent field crowding. The recommended footprint (Fig. 16) specifies 0.256 mm land width and 0.2 mm solder mask opening - deviations may compromise ESD robustness and long-term reliability under humidity bias stress.