My Inquiry
My Account
Nexperia USA Inc. PMEG3010CEH,115
- Part No.:
- PMEG3010CEH,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SOD-123F
- Datasheet:
-
PMEG3010CEH,115.pdf
- Description:
- DIODE SCHOTTKY 30V 1A SOD123F
- Quantity:
- Payment:
- Shipping:
Inventory:5,571
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMEG3010CEH,115 from Nexperia is a planar Schottky barrier rectifier with integrated guard ring for stress protection, rated at 30 V reverse voltage and 1 A forward current, featuring a typical forward voltage of 450 mV at 1 A and housed in an SOD123F surface-mount package. It serves as a low-loss unidirectional power switch in DC-DC converters and reverse polarity protection circuits.
For engineers reviewing the PMEG3010CEH,115 datasheet, PMEG3010CEH,115 pinout, PMEG3010CEH,115 application, or PMEG3010CEH,115 equivalent, key selection criteria include its 450–520 mV VF at 1 A, 30 V VR rating, 90–100 pF junction capacitance at 1 V, thermal resistance of 150 K/W (junction-to-solder point), and SOD123F footprint compatibility with high-density PCB layouts.
Technical Context
This Schottky diode employs a planar silicon structure with an integrated guard ring to suppress edge breakdown and improve surge robustness under transient stress. Its low forward voltage stems from optimized metal-semiconductor interface design, minimizing conduction losses in low-voltage, high-efficiency power paths.
The device operates with a maximum junction temperature of 150 °C and exhibits reverse leakage of ≤50 µA at 30 V and 25 °C. Thermal performance is specified for two mounting conditions: 330 K/W (junction-to-ambient, standard FR4) and 150 K/W (junction-to-solder point, enlarged cathode pad), enabling accurate thermal modeling in compact power stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 30 V - Maximum blocking capability before avalanche onset; suitable for 24 V rail protection and 5–12 V DC-DC outputs. |
| Forward Current (IF) | 1 A continuous - Rated for steady-state conduction up to 1 A at ≤55 °C solder point temperature. |
| Forward Voltage (VF) | 450–520 mV @ 1 A - Enables <0.52 W conduction loss at full load, critical for >90% efficiency in buck converters. |
| Reverse Leakage (IR) | ≤50 µA @ 30 V, 25 °C - Low leakage preserves battery life in always-on low-power systems. |
| Junction Capacitance (Cd) | 90–100 pF @ 1 V, 1 MHz - Limits switching node ringing and EMI in high-frequency (>500 kHz) SMPS designs. |
| Thermal Resistance (Rth(j-sp)) | 150 K/W - With 1 cm² cathode copper pad, supports ~5.5 °C/W rise per watt, enabling reliable operation without heatsinking. |
| Peak Forward Surge (IFSM) | 9 A @ 8 ms - Withstands inrush currents during hot-plug or cold-start events in industrial power modules. |
Pinout & Package
Encapsulated in the SOD123F package (2.6 mm × 1.6 mm × 1.1 mm body), this 2-terminal surface-mount diode uses a flat lead configuration with cathode marked by a bar on the top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (K) | Cathode | Negative output terminal; marking bar identifies this pin; connects to load ground or return path in rectification. |
| 2 (A) | Anode | Positive input terminal; accepts input voltage source or switched node; carries full forward current. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated guard ring | Suppresses edge-related avalanche, improving reliability under repetitive voltage transients and line surges. |
| Very low VF (450 mV typ.) | Reduces conduction loss by ~35% vs. comparable 1 A Schottkys with VF > 650 mV, directly increasing converter efficiency. |
| SOD123F package | Enables 2.6 mm × 1.6 mm board area usage-40% smaller than SMA-supporting ultra-compact portable and IoT power designs. |
| 150 °C max junction temperature | Allows operation in sealed enclosures or high-ambient environments (e.g., automotive under-hood proximity, industrial controls). |
Applications
| USB Power Delivery Protection | Point-of-Load DC-DC Output Rectification |
|---|---|
|
Use Scenario: Prevents damage from reversed USB-C cable insertion in portable chargers and docking stations. IC Role / Device Role / Timing Role: Unidirectional current gate placed between connector and downstream LDO/PMIC input. Use Value: 450 mV VF minimizes voltage drop across protection path, preserving ≥4.85 V at 1 A for USB PD 5 V profiles. |
Use Scenario: Output rectifier in synchronous-buck-derived 3.3 V/1 A supply for FPGA I/O banks. IC Role / Device Role / Timing Role: Freewheeling diode during high-side FET off-time in non-synchronous mode or body-diode assist. Use Value: 90 pF capacitance limits reverse recovery ringing, reducing EMI filter burden and enabling 2 MHz+ switching. |
| Reverse Polarity Input Protection | Low-Power Sensor Node Power Path |
|
Use Scenario: Protects 24 V industrial sensor modules from accidental reverse battery connection. IC Role / Device Role / Timing Role: Series-connected anode-to-input, cathode-to-system-rail diode providing fail-safe blocking. Use Value: 30 V VR rating exceeds 24 V nominal with 25% margin; 50 µA IR ensures <1 µW standby loss in battery-backed nodes. |
Use Scenario: Power path selector in coin-cell–powered environmental sensors with backup supercapacitor. IC Role / Device Role / Timing Role: OR-ing diode isolating primary cell from backup storage while enabling seamless switchover. Use Value: Low 450 mV VF avoids excessive voltage sag during switchover, maintaining stable 2.8–3.0 V supply to MCU during transition. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NSS10100HT1G | Same SOD-123 package, 30 V/1 A rating, but VF = 550 mV (typ.) at 1 A - 100 mV higher conduction loss. | Higher VF increases thermal load in space-constrained 1 A loads; less suitable for thermally limited PCBs. | Select when legacy qualification or dual-sourcing with ON Semi's supply chain is required; verify thermal margin. |
| Vishay SS12 | SMA package (larger: 4.5 mm × 2.7 mm), 20 V/1 A rating, VF = 500 mV (typ.) - lower VR and larger footprint. | Not suitable for 24 V input protection; requires more board area and has reduced surge margin (IFSM = 6 A). | Choose only if SMA footprint already standardized and 20 V VR suffices; avoid for 24 V or high-density designs. |
Compared with NSS10100HT1G and SS12, PMEG3010CEH,115 delivers the lowest VF in SOD123F, enabling superior thermal performance and efficiency in 1 A, 24–30 V applications where board area and power loss are tightly constrained.
Availability
PMEG3010CEH,115 is available at Aetrix Electronics and suitable for USB power delivery protection, point-of-load DC-DC rectification, and reverse polarity input protection requiring stable component supply and consistent SOD123F packaging.
Supply support for PMEG3010CEH,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-grade components.
PMEG3010CEH,115 belongs to Nexperia's low-VF Schottky rectifier family, engineered specifically for efficiency-critical, space-constrained power conversion in consumer, industrial, and computing applications.
FAQ
What is the maximum allowable solder point temperature for PMEG3010CEH,115 during reflow?
The device is qualified for standard lead-free reflow per J-STD-020, with peak temperature up to 260 °C for ≤30 seconds. The recommended solder land footprint matches the SOD123F outline in Figure 6 of the datasheet: 2.8 mm × 1.6 mm occupied area with 1.2 mm × 1.1 mm solder paste deposits per pad.
Does PMEG3010CEH,115 have automotive qualification?
No. Per Revision History section 14, this part was explicitly changed to non-automotive qualification in the July 2023 revision. For automotive use, Nexperia offers the -Q qualified variant PMEG3010CEH-Q, which undergoes AEC-Q101 stress testing and includes extended temperature and reliability validation.
How does the guard ring affect surge performance?
The integrated guard ring reduces electric field crowding at the die edge, raising the effective breakdown voltage under transient conditions. This enables the device to withstand 9 A non-repetitive surge (IFSM) at 8 ms without degradation, exceeding typical unguarded Schottkys rated at ≤6 A under identical conditions.
Can PMEG3010CEH,115 replace a standard 1N5817 in existing designs?
Yes, with caveats: both are 1 A/30 V Schottkys, but PMEG3010CEH,115 uses SOD123F (vs. DO-204AL for 1N5817), requiring footprint redesign. Its 450 mV VF is ~150 mV lower than 1N5817's 600 mV, improving efficiency, but its 90 pF capacitance is higher than 1N5817's ~50 pF, potentially affecting high-frequency noise behavior.
PMEG3010CEH,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOD-123F
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 520 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 50 µA @ 30 V
- Capacitance @ Vr, F:
- 100pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-123F
- Operating Temperature - Junction:
- 150°C (Max)
PMEG3010CEH,115 FAQ
1.How can I place an order for PMEG3010CEH,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG3010CEH,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG3010CEH,115 reliable?
The price and inventory of PMEG3010CEH,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG3010CEH,115 is usually 5 days.
3.What payment methods are accepted for PMEG3010CEH,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG3010CEH,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG3010CEH,115?
PMEG3010CEH,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG3010CEH,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG3010CEH,115?
For technical support, including PMEG3010CEH,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG3010CEH,115 requirements.
6.How does Aetrix verify that PMEG3010CEH,115 is sourced from the original manufacturer or authorized distributors?
All PMEG3010CEH,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG3010CEH,115 meets industry standards.
7.What is the process for return or replacement of PMEG3010CEH,115?
All PMEG3010CEH,115 units undergo pre-shipment inspection (PSI). If there is an issue with PMEG3010CEH,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG3010CEH,115 part is unused and in its original packaging.
Return procedure for PMEG3010CEH,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMEG3010CEH,115 Tags
-
1N4448X-TP
Micro Commercial Co
-
1N4148WX-TP
Micro Commercial Co
-
1N4148TR
onsemi
-
MMSD4148T1G
onsemi
-
MMBD914LT3G
onsemi
-
BAS16HT1G
onsemi
-
1N914BWT
onsemi
-
BAS21LT1G
onsemi
-
LL4148
onsemi
-
BAS16LT1G
onsemi
-
MMSD914T1G
onsemi
-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
