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Nexperia USA Inc. PMEG3010ESBCYL

Part No.:
PMEG3010ESBCYL
Manufacturer:
Nexperia USA Inc.
Category:
Single Diodes
Package:
2-XDFN
Datasheet:
AetrixPMEG3010ESBCYL.pdf
Description:
PMEG3010ESB - 30V, 1A LOW VF MEG
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:18,888

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Product details

Overview

PMEG3010ESBCYL from Nexperia is a 30 V, 1 A low forward voltage Schottky barrier rectifier in a DSN1006-2 (SOD993) ultra-small surface-mount package, designed for high-efficiency DC-to-DC conversion and low-voltage rectification with VF = 495 mV at IF = 1 A and IR = 12 µA at VR = 30 V, commonly deployed in mobile LED backlighting and space-constrained power rails.

For engineers reviewing the PMEG3010ESBCYL datasheet, PMEG3010ESBCYL pinout, PMEG3010ESBCYL application, or PMEG3010ESBCYL equivalent, this page delivers verified electrical parameters, thermal performance under FR4 and ceramic PCB mounting, junction-to-solder-point thermal resistance (15 K/W), and real-world use cases in ultra-thin portable electronics.

Technical Context

This MEGA Schottky rectifier uses a planar silicon die with integrated guard ring for enhanced ESD and surge stress protection. Its ultra-low VF enables reduced conduction loss in high-frequency switching topologies, while trr = 3.2 ns supports operation beyond 100 MHz in synchronous rectification and flyback snubber circuits.

The device operates across −40 °C to +150 °C junction temperature, with thermal resistance Rth(j-a) varying from 70 K/W (ceramic PCB) to 240 K/W (standard FR4), and features a 0.27 mm typical package height optimized for thin-profile mobile assemblies.

Key Specifications

Parameter Value and Actual Design Meaning
VF @ IF = 1 A 495 mV typical - reduces conduction loss by ~30% vs. standard Schottkys in 3.3 V/5 V buck converters
IR @ VR = 30 V 12 µA typical - minimizes standby leakage in battery-powered systems with >10-year shelf life
trr 3.2 ns - enables clean zero-voltage switching in >5 MHz DC-DC controllers without ringing
Package DSN1006-2 (SOD993), 1.0 × 0.6 × 0.27 mm - fits 0201 footprint area with 0.5 mm pad pitch for HDI PCBs
Rth(j-sp) 15 K/W - allows direct thermal coupling to copper pour via anode/cathode solder points for improved power handling
IF(AV) 1 A at Tsp ≤ 140 °C - supports continuous 1 A output in compact USB-C PD sink designs with minimal heatsinking
V(BR)R 30 V minimum - provides 20% margin over 24 V industrial bus and 3.3 V/5 V logic rail applications

Pinout & Package

DSN1006-2 (SOD993) is a 2-terminal leadless ultra-small surface-mount package with 1.0 mm × 0.6 mm body and 0.27 mm typical height. The cathode is marked by a bar on the top surface.

Pin/Terminal Circuit Role Design Meaning
1 Cathode (K) Output node in forward conduction; connects to load or switch node; marking bar identifies this terminal
2 Anode (A) Input node sourcing current; ties to input rail or synchronous FET drain; serves as primary thermal path to PCB

Key Features

Feature Design Value
Integrated guard ring Prevents edge breakdown under transient overvoltage, enabling robust operation in noisy automotive and industrial environments
Ultra-low profile (270 µm) Enables stacking under display modules and within <0.8 mm total thickness mobile bezels
Low Cd = 32 pF @ VR = 10 V Minimizes capacitive loading on high-speed gate drivers and RF bias networks
IFRM = 4 A (tp ≤ 1 ms) Supports short-duration inrush current during hot-plug events in USB and PoE-powered devices
Marking code "3E" Enables automated optical inspection (AOI) traceability and eliminates misorientation during high-speed placement

Applications

Mobile LED Backlighting USB-C Power Delivery Sink

Use Scenario: Driving white LEDs in smartphone displays using boost converter with 3.3 V–5 V input.

IC Role / Device Role / Timing Role: Output rectifier in asynchronous boost topology; conducts during switch-off phase.

Use Value: 495 mV VF reduces power loss by 180 mW vs. 675 mV diodes at 1 A, extending battery runtime by 4.2% in 300 mA backlight load.

Use Scenario: Reverse-polarity protection and output rectification in 20 W USB-C PD sink module.

IC Role / Device Role / Timing Role: Low-loss freewheeling path in buck-boost controller IC feedback loop.

Use Value: 12 µA IR at 20 V ensures <1 µW standby dissipation, meeting USB PD 3.1 quiescent current requirements.

Wearable Sensor Power Rail Thin-Film OLED Driver Supply

Use Scenario: Generating regulated 1.8 V supply from coin-cell battery for MEMS accelerometer and BLE SoC.

IC Role / Device Role / Timing Role: Synchronous rectifier in ultra-low-IQ charge pump regulator.

Use Value: 3.2 ns trr prevents shoot-through in 2 MHz switching, maintaining >92% efficiency at 100 µA load.

Use Scenario: Providing stable 12 V bias for OLED pixel driver ICs in foldable display panels.

IC Role / Device Role / Timing Role: Input-side clamp and output rectifier in dual-phase boost converter.

Use Value: 0.27 mm height avoids interference with flexible substrate bending radius (<3 mm), preserving display reliability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
RB050M-30TR Higher VF = 550 mV @ 1 A; larger SOD-123FL package (1.7 × 1.3 × 0.9 mm) Acceptable in non-space-constrained industrial SMPS where thermal mass compensates higher VF Select when board-level rework tolerance and hand-soldering feasibility outweigh size and efficiency needs.
SS12HE3/5BT Lower VR = 20 V; VF = 500 mV @ 1 A; SMA package (4.5 × 2.7 × 2.1 mm) Suitable only for ≤15 V systems; incompatible with 24 V auxiliary rails or USB PD input stages Choose only for cost-sensitive 5 V/12 V consumer adapters where 30 V rating is unnecessary.

Compared with RB050M-30TR and SS12HE3/5BT, PMEG3010ESBCYL delivers superior volumetric efficiency (0.16 mm³ vs. 2.0 mm³ and 25.5 mm³), lower conduction loss at 1 A, and guaranteed 30 V reverse blocking-critical for future-proofing in multi-rail portable platforms.

Availability

PMEG3010ESBCYL is available at Aetrix Electronics and suitable for mobile LED backlighting, USB-C power delivery sinks, wearable sensor power rails, and thin-film OLED driver supplies requiring stable component supply across high-mix, low-volume production runs.

Supply support for PMEG3010ESBCYL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-qualified components.

This part belongs to Nexperia's MEGA Schottky rectifier product line, engineered specifically for ultra-compact, high-efficiency power conversion in battery-powered and thermally constrained applications.

FAQ

What is the maximum allowable solder point temperature for PMEG3010ESBCYL during reflow?

The absolute maximum solder point temperature is not specified separately, but the datasheet defines Tsp ≤ 140 °C for average forward current derating. Reflow profiles must comply with JEDEC J-STD-020, with peak temperature ≤ 260 °C for ≤ 30 seconds and time above 217 °C limited to 60–150 seconds. Exceeding these violates the qualified process window and risks intermetallic delamination.

Can PMEG3010ESBCYL be used in automotive infotainment power supplies?

No-PMEG3010ESBCYL is not automotive-qualified. The datasheet explicitly states it is "non-automotive qualified" and lacks AEC-Q101 stress testing, PPAP documentation, or guaranteed operation across −40 °C to +125 °C ambient with 150 °C junction. For automotive use, select Nexperia's AEC-Q101-qualified equivalents like PMEG3010EH,000.

How does the guard ring affect layout design for ESD robustness?

The integrated guard ring requires no special PCB layout but mandates strict adherence to the recommended solder land pattern (0.5 mm × 0.6 mm pads, 0.35 mm spacing). Avoid routing high-dV/dt traces near the device edges, and ensure ≥0.2 mm clearance between cathode/anode pads and adjacent copper to prevent field crowding that could bypass the guard ring's protection.

Is thermal resistance Rth(j-sp) measured to both terminals or only the anode?

Rth(j-sp) = 15 K/W is measured specifically to the anode solder point, as stated in Table 6 footnote [5]: "Soldering point of anode tab." The cathode has no dedicated thermal tab; its thermal path relies on the PCB copper area connected to the cathode pad, resulting in higher effective Rth(j-a) unless both terminals are thermally anchored.

PMEG3010ESBCYL Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
2-XDFN
Packaging:
Bulk
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
30 V
Current - Average Rectified (Io):
1A
Voltage - Forward (Vf) (Max) @ If:
565 mV @ 1 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
3.2 ns
Current - Reverse Leakage @ Vr:
45 µA @ 30 V
Capacitance @ Vr, F:
32pF @ 10V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DSN1006-2
Operating Temperature - Junction:
150°C

PMEG3010ESBCYL FAQ

1.How can I place an order for PMEG3010ESBCYL through Aetrix?

Please submit a Request for Quotation (RFQ) for PMEG3010ESBCYL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PMEG3010ESBCYL reliable?

The price and inventory of PMEG3010ESBCYL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG3010ESBCYL is usually 5 days.

3.What payment methods are accepted for PMEG3010ESBCYL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG3010ESBCYL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PMEG3010ESBCYL?

PMEG3010ESBCYL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PMEG3010ESBCYL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PMEG3010ESBCYL?

For technical support, including PMEG3010ESBCYL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG3010ESBCYL requirements.

6.How does Aetrix verify that PMEG3010ESBCYL is sourced from the original manufacturer or authorized distributors?

All PMEG3010ESBCYL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG3010ESBCYL meets industry standards.

7.What is the process for return or replacement of PMEG3010ESBCYL?

All PMEG3010ESBCYL units undergo pre-shipment inspection (PSI). If there is an issue with PMEG3010ESBCYL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PMEG3010ESBCYL part is unused and in its original packaging.

Return procedure for PMEG3010ESBCYL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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