My Inquiry
My Account
Nexperia USA Inc. PMEG3010ESBYL
- Part No.:
- PMEG3010ESBYL
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- 2-XDFN
- Datasheet:
-
PMEG3010ESBYL.pdf
- Description:
- DIODE SCHOTTKY 30V 1A DSN1006-2
- Quantity:
- Payment:
- Shipping:
Inventory:35
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMEG3010ESBYL from Nexperia is a 30 V, 1 A low forward-voltage Schottky barrier rectifier in a DSN1006-2 (SOD993) ultra-small surface-mount package, designed for high-efficiency DC-to-DC conversion and low-voltage rectification with VF = 495 mV at 1 A and IR = 12 µA at 30 V, commonly used in mobile LED backlighting and space-constrained power rails.
For engineers reviewing the PMEG3010ESBYL datasheet, PMEG3010ESBYL pinout, PMEG3010ESBYL application, or PMEG3010ESBYL equivalent, key selection criteria include ultra-low VF, sub-4 ns trr, 270 µm package height, thermal resistance to solder point (Rth(j-sp) = 15 K/W), and compatibility with FR4 and ceramic PCB mounting.
Technical Context
This MEGA Schottky diode uses a planar silicon structure with integrated guard ring for robust stress protection and stable reverse leakage across temperature. Its low junction capacitance (Cd = 32 pF at 10 V) and fast reverse recovery (trr = 3.2 ns) support high-frequency switching up to several MHz in synchronous rectifier and buck converter topologies.
The device operates with Tj up to 150 °C and supports average forward current of 1 A under square-wave conditions (δ = 0.5, f = 20 kHz) on standard FR4 PCBs. Thermal performance is optimized via low-profile anode/cathode solder pads, enabling efficient heat extraction through the solder point (Rth(j-sp) = 15 K/W).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VF @ 1 A | 495 mV typical - reduces conduction loss by >30% vs. standard Schottkys in 3.3 V/5 V rails |
| trr | 3.2 ns - enables clean switching in >1 MHz DC-DC converters without snubbers |
| IR @ 30 V | 12 µA typical - minimizes standby leakage in battery-powered systems |
| Package | DSN1006-2 (SOD993), 1.0 × 0.6 × 0.27 mm - fits 0402 footprint area with 270 µm height for ultra-thin designs |
| Rth(j-sp) | 15 K/W - direct thermal path to PCB copper improves power handling over ambient-limited packages |
| Cd @ 10 V | 32 pF - low capacitance preserves high-frequency efficiency and EMI profile |
Pinout & Package
DSN1006-2 (SOD993) is a leadless, two-terminal surface-mount package with exposed anode and cathode pads on the bottom; body dimensions are 1.0 mm × 0.6 mm × 0.27 mm; marking bar denotes cathode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Connected to output/ground side; marked with bar; carries return current in forward conduction |
| 2 | Anode (A) | Connected to input/high-side rail; serves as primary current entry point during forward bias |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring integration | Prevents edge breakdown under voltage stress, improving long-term reliability in transient-prone power rails |
| Ultra-low profile | 270 µm height enables use in <0.5 mm total stack-up assemblies such as slim smartphones and wearables |
| Low thermal resistance to solder point | 15 K/W allows 1 A continuous operation with minimal temperature rise when mounted on 1 cm² copper pads |
| High surge capability | 10 A non-repetitive peak forward current (IFSM) supports inrush current handling in hot-swap circuits |
Applications
| Mobile LED Backlighting | USB-C Power Delivery Rectification |
|---|---|
Use Scenario: Boost converter driving white LEDs in smartphone displays with tight height constraints. IC Role / Device Role / Timing Role: Synchronous rectifier replacing MOSFET in secondary-side regulation loop. Use Value: 495 mV VF reduces forward drop by 180 mV vs. competing Schottkys, extending battery runtime by ~2.3% at 500 mA load. | Use Scenario: Input rectification stage in compact 20 W USB-C PD adapter with 3.3–20 V output range. IC Role / Device Role / Timing Role: Low-loss freewheeling diode in flyback secondary winding. Use Value: 3.2 ns trr eliminates switching spikes and reduces EMI filter size by 30% compared to 10 ns alternatives. |
| Wearable Sensor Power Rail | IoT Node Battery Charger |
Use Scenario: 3.3 V LDO input protection and reverse polarity safeguard in hearable devices. IC Role / Device Role / Timing Role: Reverse-blocking diode preventing backfeed from coin-cell battery into charging circuitry. Use Value: 12 µA IR at 30 V limits quiescent current drain to <0.5 µA per diode in always-on sensor nodes. | Use Scenario: Buck-boost charger IC input stage accepting 1.8–5.5 V USB or solar input with bidirectional protection. IC Role / Device Role / Timing Role: Input OR-ing diode ensuring seamless source switchover without voltage sag. Use Value: 1.0 × 0.6 mm DSN1006-2 footprint saves 65% board area versus SOD-123, critical for sub-10 cm² IoT PCBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB050M-30TR | Higher VF (550 mV @ 1 A), larger SOD-523 package (1.25 × 0.85 mm), no guard ring | Lower surge rating (IFSM = 6 A), less suitable for transient-heavy industrial inputs | Choose for cost-sensitive, non-critical consumer apps where 55 mV VF penalty is acceptable |
| SS12HE3_A/H | Higher VR (40 V), larger SMA package (4.5 × 2.7 mm), VF = 500 mV @ 1 A, trr = 10 ns | Not viable for ultra-thin designs due to 2.2 mm height; better for high-power, lower-frequency supplies | Choose when higher reverse voltage margin or legacy SMA footprint compatibility is required |
Compared with RB050M-30TR and SS12HE3_A/H, PMEG3010ESBYL delivers superior height-constrained performance: 270 µm thickness enables next-gen wearables, 3.2 ns trr supports >1 MHz switching, and its guard ring ensures stable IR over lifetime in thermally cycled environments.
Availability
PMEG3010ESBYL is available at Aetrix Electronics and suitable for mobile LED backlighting, USB-C power delivery adapters, wearable sensor power rails, and IoT node battery chargers requiring stable component supply with consistent DSN1006-2 packaging and traceable lot history.
Supply support for PMEG3010ESBYL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-qualified components.
The MEGA Schottky series targets ultra-efficient, space-constrained power conversion-designed specifically for mobile, wearables, and IoT applications demanding lowest possible VF, minimal height, and robust transient immunity.
FAQ
What is the maximum junction temperature for continuous operation?
The absolute maximum junction temperature (Tj) is 150 °C. Continuous operation at this limit requires careful thermal design: on FR4 PCB with 1 cm² copper pads per terminal, the device sustains 1 A average forward current at Tamb ≤ 105 °C (δ = 0.5, f = 20 kHz). Derating is mandatory above 125 °C ambient.
Does PMEG3010ESBYL have automotive qualification?
No. PMEG3010ESBYL is not AEC-Q200 qualified and is designated for industrial and consumer applications only. Nexperia explicitly states in its legal disclaimers that non-automotive qualified products are unsuitable for safety-critical or automotive use, and no testing or warranty applies to such deployments.
How does the guard ring improve reliability?
The integrated guard ring mitigates electric field crowding at the silicon edge, preventing premature avalanche breakdown under repetitive voltage transients (e.g., load dump, ESD). This extends operational lifetime in DC-DC converters subject to line surges and improves consistency of IR across temperature and voltage stress cycles.
Can PMEG3010ESBYL replace a standard SOD-123 Schottky in existing layouts?
No-DSN1006-2 (SOD993) has different pad geometry, solder mask openings, and thermal land requirements than SOD-123. The recommended reflow footprint (0.5 mm × 0.6 mm lands, 0.7 mm spacing) is incompatible with SOD-123 land patterns. Layout redesign and stencil adjustment are required for migration.
PMEG3010ESBYL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 2-XDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 565 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 3.2 ns
- Current - Reverse Leakage @ Vr:
- 45 µA @ 30 V
- Capacitance @ Vr, F:
- 32pF @ 10V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DSN1006-2
- Operating Temperature - Junction:
- 150°C (Max)
PMEG3010ESBYL FAQ
1.How can I place an order for PMEG3010ESBYL through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG3010ESBYL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG3010ESBYL reliable?
The price and inventory of PMEG3010ESBYL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG3010ESBYL is usually 5 days.
3.What payment methods are accepted for PMEG3010ESBYL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG3010ESBYL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG3010ESBYL?
PMEG3010ESBYL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG3010ESBYL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG3010ESBYL?
For technical support, including PMEG3010ESBYL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG3010ESBYL requirements.
6.How does Aetrix verify that PMEG3010ESBYL is sourced from the original manufacturer or authorized distributors?
All PMEG3010ESBYL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG3010ESBYL meets industry standards.
7.What is the process for return or replacement of PMEG3010ESBYL?
All PMEG3010ESBYL units undergo pre-shipment inspection (PSI). If there is an issue with PMEG3010ESBYL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG3010ESBYL part is unused and in its original packaging.
Return procedure for PMEG3010ESBYL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMEG3010ESBYL Tags
-
1N4448X-TP
Micro Commercial Co
-
1N4148WX-TP
Micro Commercial Co
-
1N4148TR
onsemi
-
MMSD4148T1G
onsemi
-
MMBD914LT3G
onsemi
-
BAS16HT1G
onsemi
-
1N914BWT
onsemi
-
BAS21LT1G
onsemi
-
LL4148
onsemi
-
BAS16LT1G
onsemi
-
MMSD914T1G
onsemi
-
BAV21W-7-F
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
