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Nexperia USA Inc. PMEG3010ESBZ
- Part No.:
- PMEG3010ESBZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- 2-XDFN
- Datasheet:
-
PMEG3010ESBZ.pdf
- Description:
- DIODE SCHOTTKY 30V 1A DSN1006-2
- Quantity:
- Payment:
- Shipping:
Inventory:8,580
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Product details
Overview
PMEG3010ESBZ from Nexperia is a 30 V, 1 A low forward-voltage Schottky barrier rectifier in a DSN1006-2 (SOD993) ultra-small surface-mount package, featuring typical VF = 495 mV at 1 A and IR = 12 µA at 30 V, optimized for high-efficiency DC-to-DC conversion and mobile LED backlighting.
For engineers reviewing the PMEG3010ESBZ datasheet, PMEG3010ESBZ pinout, PMEG3010ESBZ application, or PMEG3010ESBZ equivalent, this device supports ultra-high-speed switching (trr = 3.2 ns), thermal performance up to 150 °C junction temperature, and PCB footprint-constrained designs requiring <270 µm height and 1.0 × 0.6 mm body size.
Technical Context
This MEGA Schottky rectifier uses a planar silicon die with integrated guard ring for stress protection, enabling robust operation under repetitive surge currents (IFSM = 10 A) and fast transient response without minority-carrier storage delay.
Its low capacitance (Cd = 32 pF at VR = 10 V, f = 1 MHz) and nanosecond-scale reverse recovery support high-frequency switching topologies, while thermal resistance Rth(j-sp) = 15 K/W enables efficient heat transfer through solder point in compact power stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 30 V - Maximum blocking capability for 24 V rail clamping and input protection. |
| Average Forward Current (IF(AV)) | 1 A - Sustained DC or square-wave current handling at Tsp ≤ 140 °C on standard FR4 PCB. |
| Forward Voltage (VF) | 495 mV typ. at 1 A - Reduces conduction loss by ~30% vs. standard Schottkys, critical for >90% efficiency DC/DC stages. |
| Reverse Current (IR) | 12 µA typ. at 30 V - Minimizes leakage-induced standby power loss in battery-powered systems. |
| Reverse Recovery Time (trr) | 3.2 ns - Enables clean switching at >10 MHz frequencies without tail current or ringing. |
| Package Dimensions | 1.0 × 0.6 × 0.27 mm - Ultra-compact DSN1006-2 footprint ideal for space-constrained mobile and wearable PCBs. |
| Junction Temperature (Tj) | 150 °C max - Supports operation in thermally dense environments like portable chargers and PMIC modules. |
Pinout & Package
DSN1006-2 (SOD993) is a leadless, two-terminal surface-mount package with 0.27 mm typical height and cathode marked by a bar on the top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Negative output terminal; marked by bar on package top; connects to ground or return path in buck/flyback outputs. |
| 2 | Anode (A) | Positive input terminal; ties to switch node or input rail; requires thermal pad connection for optimal Rth(j-sp). |
Key Features
| Feature | Design Value |
|---|---|
| Guard-ring protected die | Prevents edge breakdown under voltage transients, improving reliability in noisy automotive and industrial DC/DC inputs. |
| Ultra-low profile (270 µm) | Enables stacking of components in thin-profile devices such as smartphones and smartwatches without mechanical interference. |
| Low thermal resistance (Rth(j-sp) = 15 K/W) | Allows direct heat sinking via anode/cathode solder pads, eliminating need for thermal vias in space-limited layouts. |
| High surge capability (IFSM = 10 A) | Withstands inrush and fault currents in USB PD and wireless charging circuits without degradation. |
| Low diode capacitance (32 pF at 10 V) | Reduces switching node oscillation and EMI in high-frequency synchronous rectifiers and boost converters. |
Applications
| Mobile LED Backlighting | USB-C Power Delivery |
|---|---|
|
Use Scenario: Driving white LEDs in smartphone displays using boost converter with 5–20 V output. IC Role / Device Role / Timing Role: Output rectifier in asynchronous boost stage, conducting during low-side switch off-time. Use Value: 495 mV VF minimizes forward drop loss across LED string, extending battery runtime by up to 8% versus higher-VF alternatives. |
Use Scenario: Input protection and reverse polarity blocking in 20 V/5 A USB-C power input stage. IC Role / Device Role / Timing Role: Unidirectional current gate between source and system rail; blocks reverse current during hot-swap events. Use Value: 30 V VR rating and 10 A IFSM withstand load-dump transients and cable-insertion surges without latch-up or failure. |
| Wearable Battery Charging | Industrial Sensor Node Power |
|
Use Scenario: Rectification in miniature Li-ion linear charger ICs with integrated inductorless topology. IC Role / Device Role / Timing Role: Synchronous rectifier replacement in low-current (<500 mA) buck-boost charge paths. Use Value: 12 µA IR at 30 V reduces quiescent current drain, enabling >12-month shelf life for coin-cell-powered wearables. |
Use Scenario: Power path management in battery-backed industrial IoT nodes operating at −40 °C to +85 °C ambient. IC Role / Device Role / Timing Role: OR-ing diode between primary battery and backup supercapacitor, preventing backfeed. Use Value: Stable VF and IR across full temperature range ensure predictable power-loss budgeting and no cold-start failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB050M-30 | Higher VF = 550 mV typ. at 1 A; larger SOD-123 package (3.7 × 1.6 mm); 120 °C Tj max. | Less suitable for ultra-thin mobile designs due to 1.2 mm height and lower thermal margin. | Select when cost sensitivity outweighs size/efficiency requirements and board space permits larger footprint. |
| SS12 | VF = 500 mV typ., but trr = 10 ns and Cd = 110 pF; DO-214AC package (4.5 × 2.7 mm); 125 °C Tj max. | Higher EMI risk and slower switching limit use in >2 MHz converters and noise-sensitive RF modules. | Choose only for legacy through-hole or high-power (>1.5 A) applications where thermal mass compensates for slower recovery. |
Compared with RB050M-30 and SS12, PMEG3010ESBZ delivers superior volumetric efficiency (0.16 mm³ vs. 7.1 mm³), 3× faster trr, and 4× lower Cd-making it the only option meeting strict height, speed, and leakage constraints in next-gen portable power designs.
Availability
PMEG3010ESBZ is available at Aetrix Electronics and suitable for mobile LED backlighting, USB-C power delivery, wearable battery charging, and industrial sensor node power requiring stable component supply across extended temperature and lifecycle demands.
Supply support for PMEG3010ESBZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-grade qualification.
This part belongs to Nexperia's MEGA Schottky rectifier product line, engineered specifically for ultra-compact, high-efficiency power conversion in space- and thermal-constrained consumer and industrial electronics.
FAQ
Is PMEG3010ESBZ suitable for automotive applications?
No-PMEG3010ESBZ is not AEC-Q200 qualified and lacks automotive-specific testing or screening. Nexperia explicitly states non-automotive qualification in its legal disclaimers. For automotive use, select AEC-Q200-compliant alternatives such as PMEG3020CPA or PMEG6020CPA with validated temperature cycling and humidity testing.
What is the maximum allowable soldering temperature for DSN1006-2 reflow?
The DSN1006-2 package supports standard lead-free reflow profiles with peak temperature up to 260 °C for ≤30 seconds, per Nexperia's AN11689 assembly guidelines. Exceeding this risks delamination or solder joint voiding due to the ultra-thin copper leadframe and minimal thermal mass.
How does the guard ring improve reliability in PMEG3010ESBZ?
The integrated guard ring prevents premature edge breakdown under high electric field stress, especially during voltage transients or partial PCB contamination. It extends operational lifetime in real-world conditions where surface leakage or localized overvoltage would otherwise cause early failure in unprotected Schottky structures.
Can PMEG3010ESBZ replace a standard 1N5819 in existing designs?
Only with layout revision: PMEG3010ESBZ's DSN1006-2 footprint (1.0 × 0.6 mm) is incompatible with DO-41 or SOD-123 pads. While electrical specs (30 V, 1 A, low VF) overlap, mechanical redesign is mandatory. Thermal performance also differs significantly-DSN1006-2 relies on solder-point conduction, not case convection.
PMEG3010ESBZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 2-XDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 565 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 3.2 ns
- Current - Reverse Leakage @ Vr:
- 45 µA @ 30 V
- Capacitance @ Vr, F:
- 32pF @ 10V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DSN1006-2
- Operating Temperature - Junction:
- 150°C (Max)
PMEG3010ESBZ FAQ
1.How can I place an order for PMEG3010ESBZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG3010ESBZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG3010ESBZ reliable?
The price and inventory of PMEG3010ESBZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG3010ESBZ is usually 5 days.
3.What payment methods are accepted for PMEG3010ESBZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG3010ESBZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG3010ESBZ?
PMEG3010ESBZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG3010ESBZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG3010ESBZ?
For technical support, including PMEG3010ESBZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG3010ESBZ requirements.
6.How does Aetrix verify that PMEG3010ESBZ is sourced from the original manufacturer or authorized distributors?
All PMEG3010ESBZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG3010ESBZ meets industry standards.
7.What is the process for return or replacement of PMEG3010ESBZ?
All PMEG3010ESBZ units undergo pre-shipment inspection (PSI). If there is an issue with PMEG3010ESBZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG3010ESBZ part is unused and in its original packaging.
Return procedure for PMEG3010ESBZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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