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Nexperia USA Inc. PMEG3020EPASX
- Part No.:
- PMEG3020EPASX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- 3-UDFN Exposed Pad
- Datasheet:
-
PMEG3020EPASX.pdf
- Description:
- DIODE SCHOTTKY 30V 2A DFN2020D-3
- Quantity:
- Payment:
- Shipping:
Inventory:2,964
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Product details
Overview
PMEG3020EPASX from Nexperia is a 30 V, 2 A low forward voltage Schottky barrier rectifier in a DFN2020D-3 (SOT1061D) ultra-thin leadless package, featuring integrated guard ring stress protection, exposed cathode thermal pad, and AEC-Q101 qualification for automotive reliability. It delivers VF = 410–470 mV at IF = 2 A and IR ≤ 2500 µA at VR = 30 V, enabling high-efficiency DC/DC conversion in space-constrained mobile power systems.
For engineers reviewing the PMEG3020EPASX datasheet, PMEG3020EPASX pinout, PMEG3020EPASX application, or PMEG3020EPASX equivalent, key selection criteria include its 470 mV max forward voltage, dual-anode thermal design, 12 K/W junction-to-solder-point thermal resistance, and suitability for reverse polarity protection and battery charger circuits requiring AEC-Q101 compliance.
Technical Context
This MEGA Schottky rectifier uses planar silicon construction with an integrated guard ring to suppress edge breakdown under transient stress, ensuring stable operation up to 150 °C junction temperature. Its low VF stems from optimized metal-semiconductor interface engineering rather than barrier height reduction alone.
The DFN2020D-3 package places both anode terminals on one side and the large-area cathode pad on the opposite side-enabling simultaneous thermal conduction and electrical current handling via the exposed copper tab. This architecture supports pulsed forward currents up to 17 A (IFSM) and average dissipation of 1800 mW on ceramic PCBs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VF @ IF = 2 A | 410–470 mV - Enables <100 mW conduction loss per diode in 2 A load paths, critical for portable device efficiency. |
| VR | 30 V - Rated for 24 V nominal automotive and industrial bus applications with margin for transients. |
| IF(AV) | 2 A - Sustained DC or square-wave current capability at Tsp ≤ 140 °C, validated on FR4 and ceramic PCBs. |
| IR @ VR = 30 V | 435–2500 µA - Low leakage preserves battery standby time in reverse-polarity protection circuits. |
| trr | 4 ns - Near-zero reverse recovery minimizes switching losses and EMI in high-frequency SMPS freewheeling. |
| Rth(j-sp) | 12 K/W - Direct thermal path from junction to solder point enables compact thermal design without external heatsinks. |
| AEC-Q101 | Qualified - Meets automotive-grade stress testing for temperature cycling, HTRB, and ESD, supporting under-hood use. |
Pinout & Package
Encapsulated in the ultra-thin DFN2020D-3 (SOT1061D) package: 2 × 2 × 0.65 mm body, no leads, visible and solderable side pads, and exposed cathode thermal pad on bottom surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode | Primary anode connection; electrically tied to Pin 2 for parallel current sharing and reduced trace inductance. |
| 2 | Anode | Secondary anode terminal; used with Pin 1 to distribute 2 A average current and improve thermal spreading. |
| 3 | Cathode | Exposed copper thermal pad - serves as main current return path and primary heat sink interface to PCB copper. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated guard ring | Prevents premature edge breakdown under voltage surge or mechanical stress, extending lifetime in automotive environments. |
| Exposed cathode pad | Provides 12 K/W junction-to-solder-point thermal resistance-enabling >1.8 W dissipation on standard FR4 with 1 cm² copper pad. |
| Leadless DFN2020D-3 | Reduces PCB footprint by 60% vs. SOD-123; supports AOI inspection and fine-pitch automated assembly for mobile PCBs. |
| Low VF / low IR trade-off | 470 mV max VF at 2 A with only 2.5 mA max IR at 30 V-optimized for high-efficiency, low-leakage DC/DC stages. |
| AEC-Q101 qualification | Validated for automotive temperature cycling (−40 °C to +125 °C), HTRB (1000 h @ 150 °C), and ESD (HBM ≥ 2 kV). |
Applications
| Mobile Battery Charger | Automotive Reverse Polarity Protection |
|---|---|
|
Use Scenario: Input rectification and reverse-blocking in USB-C PD and Qi wireless charging circuits for smartphones and wearables. IC Role / Device Role / Timing Role: Schottky rectifier placed between input connector and buck converter, conducting during forward bias and blocking during reverse fault conditions. Use Value: 470 mV VF reduces conduction loss by >30% vs. standard 600 mV Schottkys, extending battery runtime in always-on charging ICs. |
Use Scenario: In-line protection for 12 V/24 V vehicle infotainment and ADAS modules against accidental battery reversal. IC Role / Device Role / Timing Role: Cathode-connected to system ground, anodes to power input-blocks reverse current while passing forward current with minimal drop. Use Value: AEC-Q101 qualification ensures reliable operation across −40 °C to +125 °C ambient, eliminating field failures due to thermal cycling. |
| LED Backlight Power Path | High-Frequency SMPS Freewheeling |
|
Use Scenario: Output rectification in boost-based LED drivers for smartphone displays and automotive instrument clusters. IC Role / Device Role / Timing Role: Conducts during inductor discharge phase in continuous conduction mode (CCM), returning energy to output capacitor. Use Value: 4 ns trr eliminates reverse recovery spikes, reducing EMI filtering requirements and enabling >2 MHz switching frequencies. |
Use Scenario: Freewheeling path in synchronous buck converters powering FPGA core rails and CPU VRMs. IC Role / Device Role / Timing Role: Provides low-loss current recirculation path when high-side MOSFET is off, minimizing voltage overshoot and power loss. Use Value: Dual-anode layout lowers effective series resistance, allowing 2 A average current with <0.5 °C/W thermal rise on 1 cm² copper. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB055LAM-30TR | Higher VF (520 mV typ @ 2 A), same 30 V VR, SOD-523 package (0.6 × 0.3 mm), no exposed thermal pad. | Limited to <0.5 A continuous due to higher thermal resistance (Rth(j-a) ≈ 400 K/W); unsuitable for automotive or high-power mobile use. | Select only for ultra-low-cost, sub-500 mA consumer wearables where board space is more critical than thermal performance. |
| SS32HE3_A/H | Same 30 V/2 A rating, VF = 500 mV max @ 2 A, SMA package (4.5 × 2.7 mm), Rth(j-a) = 65 K/W on FR4. | Larger footprint and higher VF increase conduction loss and require larger PCB area-less optimal for thin mobile designs. | Prefer when legacy SMA footprint compatibility is required and thermal budget allows 100+ mV higher drop. |
Compared with RB055LAM-30TR and SS32HE3_A/H, PMEG3020EPASX offers the lowest VF (470 mV max), best thermal performance (12 K/W j-sp), and smallest footprint (2 × 2 mm), making it the optimal choice for thermally constrained, high-efficiency automotive and mobile power designs.
Availability
PMEG3020EPASX is available at Aetrix Electronics and suitable for automotive infotainment systems, mobile battery chargers, LED backlight drivers, and high-frequency SMPS requiring stable component supply, AEC-Q101 compliance, and ultra-thin packaging.
Supply support for PMEG3020EPASX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified components and advanced packaging technologies.
The MEGA Schottky product line targets high-efficiency power conversion in space- and thermal-constrained applications-including automotive, mobile, and industrial DC/DC systems-by combining low VF, robust stress protection, and thermally enhanced packages.
FAQ
What is the maximum allowable solder point temperature for PMEG3020EPASX during reflow?
The absolute maximum solder point temperature (Tsp) is 140 °C for δ = 0.5 duty cycle at 20 kHz, and 135 °C for DC operation. Exceeding these limits risks delamination or intermetallic degradation. Reflow profiles must follow Nexperia's SOT1061D footprint guidelines with peak temperature ≤ 260 °C for ≤ 30 seconds.
Can Pins 1 and 2 be used independently, or must they be shorted externally?
Pins 1 and 2 are internally connected anodes and must be routed together to a common net. Using them separately violates the device's thermal and current-sharing design-separate routing increases resistance imbalance and localized heating, risking premature failure at rated current.
How does the guard ring affect reverse voltage derating in automotive applications?
The integrated guard ring maintains stable 30 V VR rating across temperature and humidity without additional derating. Unlike conventional Schottkys, it prevents edge-initiated avalanche under transient overvoltage (e.g., load dump), enabling direct use in 24 V systems without external TVS clamping.
Is the cathode pad electrically isolated from the internal die substrate?
No-the cathode pad is the direct metallurgical extension of the die's cathode contact and forms the primary current return path. It must be connected to system ground or the negative rail; floating or insulated mounting degrades thermal performance and may cause thermal runaway under high current.
PMEG3020EPASX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 3-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 2A
- Voltage - Forward (Vf) (Max) @ If:
- 470 mV @ 2 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 4 ns
- Current - Reverse Leakage @ Vr:
- 2.5 mA @ 30 V
- Capacitance @ Vr, F:
- 150pF @ 1V, 1MHz
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN2020D-3
- Operating Temperature - Junction:
- 150°C (Max)
PMEG3020EPASX FAQ
1.How can I place an order for PMEG3020EPASX through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG3020EPASX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG3020EPASX reliable?
The price and inventory of PMEG3020EPASX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG3020EPASX is usually 5 days.
3.What payment methods are accepted for PMEG3020EPASX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG3020EPASX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG3020EPASX?
PMEG3020EPASX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG3020EPASX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG3020EPASX?
For technical support, including PMEG3020EPASX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG3020EPASX requirements.
6.How does Aetrix verify that PMEG3020EPASX is sourced from the original manufacturer or authorized distributors?
All PMEG3020EPASX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG3020EPASX meets industry standards.
7.What is the process for return or replacement of PMEG3020EPASX?
All PMEG3020EPASX units undergo pre-shipment inspection (PSI). If there is an issue with PMEG3020EPASX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG3020EPASX part is unused and in its original packaging.
Return procedure for PMEG3020EPASX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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