Nexperia USA Inc. PMEG3030BEP,115

Overview

PMEG3030BEP from Nexperia is a planar Schottky barrier rectifier with integrated guard ring for stress protection, designed for low-voltage, high-efficiency DC-to-DC conversion and reverse polarity protection. It delivers 3 A average forward current at ≤450 mV forward voltage (IF = 3 A, Tj = 25 °C), supports 30 V reverse voltage, and uses clip-bond technology for enhanced thermal performance in SOD128 (CFP5) surface-mount package.

For engineers reviewing the PMEG3030BEP datasheet, PMEG3030BEP pinout, PMEG3030BEP application, or PMEG3030BEP equivalent, key selection criteria include low VF rectification under high ambient temperature, thermal resistance to solder point (Rth(j-sp) = 12 K/W), IRMS capability up to 2.13 A (δ = 0.5), and compatibility with both reflow and wave soldering on FR4 or ceramic PCBs.

Technical Context

This Schottky diode employs a planar junction structure with an integrated guard ring to suppress edge breakdown and improve reliability under repetitive surge stress. Its clip-bond construction directly connects the die to the cathode lead frame, reducing thermal resistance and enabling higher power density than wire-bonded equivalents.

The device operates with minimal forward voltage drop across its rated current range (280–450 mV from 0.1 A to 3 A), and exhibits low reverse leakage (≤150 µA at VR = 30 V, Tj = 25 °C) and low junction-to-solder-point thermal resistance (12 K/W), making it suitable for thermally constrained, high-frequency switching topologies.

Key Specifications

Pinout & Package

Encapsulated in a SOD128 (CFP5) plastic surface-mount package: 3.8 mm × 2.6 mm × 1.0 mm body, 4.0 mm lead pitch, flat lead profile optimized for automated assembly and thermal dissipation via cathode tab.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with NSR3030HT1G and VSSAF30M3, PMEG3030BEP provides superior thermal performance (Rth(j-sp) = 12 K/W), integrated guard ring for field reliability, and lowest VF in its class-making it optimal for thermally dense, high-reliability industrial and medical power stages.

Availability

PMEG3030BEP is available at Aetrix Electronics and suitable for USB-C power delivery input stages, industrial 24 V DC/DC converters, and medical portable monitor battery charging paths requiring stable component supply, consistent parametric performance, and long-term production continuity.

Supply support for PMEG3030BEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors-including logic, discretes, MOSFETs, and analog devices-with manufacturing rooted in process efficiency and automotive-grade quality systems.

PMEG3030BEP belongs to Nexperia's low-VF Schottky rectifier product line, engineered specifically for high-efficiency, space-constrained power conversion in consumer, industrial, and computing applications where thermal management and low conduction loss are critical.

FAQ

What is the maximum allowable solder point temperature for PMEG3030BEP during reflow?

The datasheet specifies Tsp ≤ 140 °C for δ = 0.5 square-wave operation. For reflow, peak temperature must not exceed 260 °C for ≤10 s (per JEDEC J-STD-020), with the solder point (cathode tab) monitored to ensure sustained thermal stress remains within 140 °C during steady-state operation post-reflow.

Can PMEG3030BEP be used in automotive applications?

No-PMEG3030BEP is not AEC-Q200 qualified. Nexperia explicitly states non-automotive qualification in the legal disclaimers. Its 150 °C Tj rating and thermal specs do not meet automotive qualification requirements for temperature cycling, humidity, or long-term reliability testing.

How does the guard ring affect reverse voltage derating in real-world layouts?

The integrated guard ring suppresses edge electric field crowding, allowing the device to maintain rated 30 V VR even with suboptimal PCB creepage (e.g., 0.8 mm spacing). Without it, same-die Schottkys typically require ≥1.2 mm clearance to avoid premature breakdown at elevated humidity or contamination.

Is wave soldering supported, and what footprint adjustments are needed versus reflow?

Yes-Nexperia provides dedicated wave soldering footprints (Fig. 16) with enlarged solder lands (5.7 mm × 2.3 mm) and dummy tracks to prevent bridging. Unlike reflow, wave requires 0.2 mm wider solder mask openings and 0.15 mm larger paste apertures to accommodate solder wave meniscus and ensure full wetting of the cathode tab.