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Nexperia USA Inc. PMEG3050EP,115
- Part No.:
- PMEG3050EP,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SOD-128
- Datasheet:
-
PMEG3050EP,115.pdf
- Description:
- DIODE SCHOTTKY 30V 5A SOD128
- Quantity:
- Payment:
- Shipping:
Inventory:12,179
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Product details
Overview
PMEG3050EP from Nexperia is a planar Schottky barrier rectifier with integrated guard ring for stress protection, rated at 30 V reverse voltage and 5 A average forward current, featuring low 315–360 mV forward voltage at 5 A and 25 °C junction temperature, housed in a compact SOD128 (CFP5) surface-mount package. It serves as a high-efficiency low-voltage rectifier in DC-to-DC converters and SMPS output stages.
For engineers reviewing the PMEG3050EP datasheet, PMEG3050EP pinout, PMEG3050EP application, or PMEG3050EP equivalent, key selection criteria include forward voltage drop at rated current, thermal resistance to solder point (12 K/W), reverse leakage at 30 V (2.6–8 mA), diode capacitance (260–800 pF), and compatibility with reflow/wave soldering on FR4 or ceramic PCBs.
Technical Context
This Schottky rectifier employs clip-bond technology to enhance power capability and thermal performance, enabling stable operation up to 150 °C junction temperature. Its guard ring structure improves ruggedness against electrical overstress and transient voltage spikes common in switching power supplies.
The device exhibits low capacitive charge (Cd = 260 pF at VR = 10 V, 1 MHz), supporting fast switching in high-frequency SMPS designs, while its forward voltage remains tightly controlled across temperature (240–360 mV from −40 °C to 150 °C at IF = 1–5 A).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 30 V - Maximum blocking voltage before breakdown; defines usable input/output range in low-voltage DC systems. |
| Average Forward Current (IF(AV)) | 5 A - Continuous DC or pulsed current handling capacity under specified thermal conditions (Tsp ≤ 130 °C). |
| Forward Voltage (VF) | 315–360 mV at IF = 5 A, Tj = 25 °C - Directly determines conduction loss and efficiency in high-current rectification paths. |
| Reverse Current (IR) | 2.6–8 mA at VR = 30 V, Tj = 25 °C - Sets standby power loss and impacts no-load efficiency in isolated converters. |
| Thermal Resistance (Rth(j-sp)) | 12 K/W - Junction-to-solder-point resistance with 1 cm² cathode pad on FR4; enables accurate thermal design of PCB copper area. |
| Diode Capacitance (Cd) | 260 pF at VR = 10 V, 1 MHz - Influences switching speed and EMI generation during turn-off in high-frequency topologies. |
| Non-repetitive Peak Current (IFSM) | 70 A (tp = 8 ms) - Supports surge tolerance during startup or fault transients without permanent degradation. |
Pinout & Package
Encapsulated in a SOD128 (CFP5) plastic surface-mount package measuring 3.8 mm × 2.6 mm × 1.0 mm with 4 mm pitch, the device uses a two-terminal configuration optimized for thermal dissipation via the cathode tab.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Main current exit terminal; marked with bar on package; connects to ground or low-side return path; primary thermal interface to PCB. |
| 2 | Anode (A) | Main current entry terminal; connects to switched node or input rail; electrically isolated from cathode by Schottky junction. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated guard ring | Enhances ESD and transient overvoltage robustness without external protection components in space-constrained layouts. |
| Clip-bond construction | Reduces parasitic inductance and improves thermal transfer from die to cathode tab, supporting higher power density than wire-bonded equivalents. |
| SOD128 footprint | Enables automated placement and reflow/wave soldering compatibility while maintaining 1 mm profile for ultra-thin end equipment. |
| Low VF across temperature | Maintains <360 mV VF up to 150 °C junction temperature, ensuring consistent conduction loss in thermally stressed environments. |
| High IFSM rating | 70 A single-pulse surge capability allows use in applications with high inrush currents without derating or parallel devices. |
Applications
| Low-Voltage Rectification | High-Efficiency DC-DC Conversion |
|---|---|
|
Use Scenario: Output rectification in 3.3 V or 5 V buck converters powering FPGAs, microcontrollers, or memory subsystems. IC Role / Device Role / Timing Role: Low-loss unidirectional current path replacing synchronous MOSFETs where gate drive complexity must be avoided. Use Value: Reduces conduction loss by >40% versus standard silicon diodes, improving full-load efficiency by 1–2% in 12 V input → 3.3 V output designs. |
Use Scenario: Secondary-side rectification in isolated flyback or forward converters delivering <10 W at <12 V output. IC Role / Device Role / Timing Role: Fast-recovery rectifier minimizing reverse recovery charge and associated switching losses. Use Value: Enables >90% peak efficiency at light loads due to sub-1 µA leakage at 5 V reverse bias and low Cd (<300 pF). |
| SMPS Output Stage | Reverse Polarity Protection |
|
Use Scenario: Main output rectifier in compact AC/DC adapters and USB PD power bricks operating at 100–500 kHz switching frequency. IC Role / Device Role / Timing Role: High-current freewheeling diode conducting during MOSFET off-time in continuous conduction mode. Use Value: Clip-bond thermal path sustains 5 A average current with <15 °C junction rise above solder point on 1 cm² copper, eliminating need for heatsinks. |
Use Scenario: Series-connected protection diode in battery-powered IoT sensors or portable medical devices with coin-cell or Li-ion inputs. IC Role / Device Role / Timing Role: Reverse-blocking element preventing damage when batteries are inserted backward. Use Value: 30 V VR rating covers 3S Li-ion (12.6 V) and 4S NiMH (6 V) stacks with margin; low VF avoids excessive voltage drop in low-power rails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-50WQ03FNTR-M3 | Same 30 V VR, 5 A IF(AV), but VF = 380 mV @ 5 A; TO-277 package with higher Rth(j-a) (35 K/W vs 12 K/W to solder point). | Larger footprint and lower thermal performance limit usable current in compact PCBs without extended copper pours. | Prefer when legacy TO-277 layout exists or when higher surge rating (120 A IFSM) is required over thermal optimization. |
| ON Semiconductor MBR530LSFT1G | 30 V VR, 5 A IF(AV), VF = 420 mV @ 5 A; SOD-123FL package with no dedicated thermal pad, Rth(j-a) = 60 K/W. | Not suitable for sustained 5 A operation without significant derating; lacks guard ring for transient protection. | Select only for cost-sensitive, low-duty-cycle applications where peak efficiency and ruggedness are secondary to BOM cost. |
Compared with VS-50WQ03FNTR-M3 and MBR530LSFT1G, PMEG3050EP delivers superior thermal management via its SOD128 clip-bond structure and lower VF-enabling full 5 A current in space-constrained, thermally demanding DC-DC outputs without forced air or heatsinking.
Availability
PMEG3050EP is available at Aetrix Electronics and suitable for low-voltage rectification, high-efficiency DC-DC conversion, and reverse polarity protection requiring stable component supply across industrial, consumer, and computing power designs.
Supply support for PMEG3050EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions, headquartered in Nijmegen, Netherlands, with manufacturing in Europe and Asia.
The PMEG3050EP belongs to Nexperia's low-VF Schottky rectifier product line, engineered specifically for efficiency-critical power conversion in compact, thermally constrained applications such as USB-C PD adapters and portable electronics.
FAQ
What is the maximum allowable junction temperature for continuous operation?
The PMEG3050EP has a maximum junction temperature (Tj) rating of 150 °C, validated under conditions where solder point temperature does not exceed 130 °C and ambient temperature remains ≤35 °C on standard FR4 PCBs. Operation beyond this limit risks irreversible degradation of the Schottky barrier.
Can PMEG3050EP be used in automotive applications?
No-this part is explicitly non-automotive qualified per Nexperia's revision history (v.3, Jan 2023). It lacks AEC-Q101 qualification, automotive-grade screening, and guaranteed operation over −40 °C to +125 °C extended temperature range. Automotive alternatives must be selected from Nexperia's Q-series portfolio.
How does the guard ring improve reliability in real-world circuits?
The integrated guard ring mitigates edge breakdown under high dv/dt or voltage transients by redistributing electric field stress away from the active junction periphery. This prevents localized avalanche and premature failure during load dump events or inductive switching in SMPS circuits.
Is wave soldering supported, and what footprint is required?
Yes-Nexperia provides dedicated wave soldering footprints (Fig. 16) with 4.35 mm × 3.65 mm solder lands and dummy tracks to prevent bridging. The SOD128 package is qualified for both wave and reflow processes, with thermal profiles defined in Section 13 of the datasheet.
PMEG3050EP,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOD-128
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 5A
- Voltage - Forward (Vf) (Max) @ If:
- 360 mV @ 5 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 8 mA @ 30 V
- Capacitance @ Vr, F:
- 800pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-128/CFP5
- Operating Temperature - Junction:
- 150°C (Max)
PMEG3050EP,115 FAQ
1.How can I place an order for PMEG3050EP,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG3050EP,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG3050EP,115 reliable?
The price and inventory of PMEG3050EP,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG3050EP,115 is usually 5 days.
3.What payment methods are accepted for PMEG3050EP,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG3050EP,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG3050EP,115?
PMEG3050EP,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG3050EP,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG3050EP,115?
For technical support, including PMEG3050EP,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG3050EP,115 requirements.
6.How does Aetrix verify that PMEG3050EP,115 is sourced from the original manufacturer or authorized distributors?
All PMEG3050EP,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG3050EP,115 meets industry standards.
7.What is the process for return or replacement of PMEG3050EP,115?
All PMEG3050EP,115 units undergo pre-shipment inspection (PSI). If there is an issue with PMEG3050EP,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG3050EP,115 part is unused and in its original packaging.
Return procedure for PMEG3050EP,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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