My Inquiry
My Account
Nexperia USA Inc. PMEG4002AESFCYL
- Part No.:
- PMEG4002AESFCYL
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
PMEG4002AESFCYL.pdf
- Description:
- PMEG4002AESF - 40 V, 0.2 A LOW V
- Quantity:
- Payment:
- Shipping:
Inventory:126,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMEG4002AESFCYL from Nexperia is a 40 V, 0.2 A low forward-voltage Schottky barrier rectifier in a DSN0603-2 (SOD962-2) leadless chip-scale package, designed for ultra-compact DC-to-DC conversion and mobile LED backlighting where space and thermal efficiency are critical. It delivers typ. VF = 450 mV at 200 mA, typ. IR = 13 µA at 40 V, and operates up to 150 °C junction temperature.
For engineers reviewing the PMEG4002AESFCYL datasheet, PMEG4002AESFCYL pinout, PMEG4002AESFCYL application, or PMEG4002AESFCYL equivalent, key selection criteria include forward voltage drop under pulsed 200 mA load, reverse leakage at 40 V bias, thermal resistance to solder point (Rth(j-sp) = 40 K/W), and compatibility with reflow-soldered ultra-small footprint layouts.
Technical Context
This MEGA Schottky rectifier uses a planar silicon structure with integrated guard ring for enhanced ESD and surge stress protection. Its low VF stems from optimized metal-semiconductor interface design, enabling high conduction efficiency without compromising reverse blocking integrity at 40 V.
The device exhibits ultra-fast switching with trr = 1.25 ns and low diode capacitance (Cd = 7 pF at VR = 10 V), making it suitable for high-frequency (>1 MHz) switching topologies. Thermal performance is optimized for FR4 PCB mounting with 1 cm² copper pads per terminal, achieving Rth(j-a) = 105 K/W.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VR (Reverse Voltage) | 40 V - Maximum continuous reverse bias before breakdown; defines safe operating range in buck converter freewheeling paths. |
| IF(AV) (Avg. Forward Current) | 0.2 A - Sustained DC current capability at Tsp ≤ 147 °C with square-wave drive; supports compact power rail designs. |
| VF (Forward Voltage) | 450 mV typ. at 200 mA - Low conduction loss reduces heat generation in battery-powered systems and improves efficiency above 90% in 3.3 V–5 V DC/DC stages. |
| IR (Reverse Current) | 13 µA typ. at 40 V - Minimal leakage preserves standby power in always-on subsystems like display bias rails. |
| trr (Reverse Recovery Time) | 1.25 ns - Enables operation in >10 MHz switching converters without tail current losses or EMI spikes. |
| Rth(j-sp) (Junction-to-Solder Point) | 40 K/W - Direct thermal path to PCB enables reliable power dissipation up to 405 mW on FR4 with localized copper pads. |
| Package Dimensions | 0.6 × 0.3 × 0.3 mm - Ultra-miniature CSP footprint saves >60% board area vs. SOD-123; compatible with 0201-class placement equipment. |
Pinout & Package
DSN0603-2 (SOD962-2) is a 2-terminal, leadless chip-scale package with 0.6 mm × 0.3 mm body and 0.3 mm height. The cathode is marked by a visible bar on the top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Negative output terminal; connects to ground or low-side switch node; marking bar identifies this terminal. |
| 2 | Anode (A) | Positive input terminal; ties to switching node or input rail; requires dedicated 1 cm² copper pad for thermal management. |
Key Features
| Feature | Design Value |
|---|---|
| Guard-ring protected junction | Enhances robustness against ESD (IEC 61000-4-2 Level 4) and transient overvoltage in portable electronics. |
| Ultra-low profile (0.3 mm height) | Enables stacking under thin-film shields or integration into <0.8 mm total-thickness mobile modules. |
| Low thermal resistance to solder point | 40 K/W allows 405 mW power handling without external heatsinking on standard FR4 with optimized pad layout. |
| 1.25 ns reverse recovery | Eliminates reverse recovery loss in synchronous rectification schemes operating above 5 MHz. |
| Marking code "N" | Unambiguous top-side identification for automated optical inspection (AOI) and traceability in high-volume assembly. |
Applications
| Mobile Display Backlighting | USB-C Power Delivery Clamp |
|---|---|
|
Use Scenario: Driving white LED strings in smartphones and tablets using boost converters operating at 1.5–2 MHz. IC Role / Device Role / Timing Role: Freewheeling rectifier in asynchronous boost topology; conducts during low-side switch off-time. Use Value: 450 mV VF minimizes dropout loss across 3–5 V input rails, extending battery runtime by ~3.2% versus 550 mV alternatives. |
Use Scenario: Reverse-polarity protection and voltage clamping in USB-C PD sink circuits with 5–20 V input range. IC Role / Device Role / Timing Role: Low-leakage clamp diode placed between VBUS and GND to absorb transient surges without loading idle bus. Use Value: 13 µA IR at 40 V ensures <1 µW standby dissipation, preserving system quiescent current budget in always-connected devices. |
| Wearable Sensor Power Rail | IoT Node Buck Converter Output |
|
Use Scenario: Supplying regulated 1.8 V or 3.3 V to MEMS accelerometers and BLE radios in hearables and smart bands. IC Role / Device Role / Timing Role: Output rectifier in miniature 1 mm² synchronous buck module; handles 100–200 mA pulsed loads. Use Value: 0.6 × 0.3 mm footprint fits within tight keep-out zones around RF antennas, avoiding EMI coupling paths. |
Use Scenario: Secondary-side rectification in 3.3 V/500 mA buck converters powering LPWAN modems and environmental sensors. IC Role / Device Role / Timing Role: High-efficiency freewheeling path replacing MOSFET synchronous rectifiers where gate drive complexity must be avoided. Use Value: 1.25 ns trr prevents shoot-through risk and eliminates snubber networks, reducing BOM count by two passive components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB520S-30T2R | 30 V VR, 200 mA IF(AV), VF = 370 mV @ 100 mA, SOD-523 package (1.2 × 0.8 mm) | Larger footprint and lower VR limit restrict use in 40 V input stages or industrial 24 V systems. | Select when VR margin <10 V suffices and legacy SOD-523 placement infrastructure exists. |
| NSR0240HT1G | 40 V VR, 200 mA IF(AV), VF = 470 mV @ 200 mA, SOD-923 package (1.0 × 0.6 mm) | 2.8× larger footprint and 2× higher Rth(j-a) (290 K/W) reduce power density and thermal headroom. | Choose only if DSN0603-2 reflow process is unavailable and board area permits 1.0 mm × 0.6 mm layout. |
Compared with RB520S-30T2R and NSR0240HT1G, PMEG4002AESFCYL provides the smallest footprint, lowest thermal resistance, and highest VR margin among sub-0.3 mm-height Schottkys-enabling next-generation wearables and ultra-thin power modules where every micron and milliwatt matters.
Availability
PMEG4002AESFCYL is available at Aetrix Electronics and suitable for mobile display backlighting, wearable sensor power rails, USB-C PD protection, and IoT node buck converters requiring stable component supply with guaranteed long-term manufacturability.
Supply support for PMEG4002AESFCYL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.
This device belongs to Nexperia's MEGA Schottky rectifier product line, engineered specifically for ultra-compact, high-efficiency DC/DC conversion in space-constrained portable electronics-prioritizing low VF, minimal leakage, and robust thermal behavior in chip-scale packages.
FAQ
What is the maximum allowable solder point temperature during reflow for PMEG4002AESFCYL?
The device is qualified for standard lead-free reflow profiles with peak temperature up to 260 °C for ≤30 seconds. Per Nexperia's SOD962-2 footprint guidelines, the solder paste stencil aperture must match the 0.256 mm × 0.256 mm land pattern, and preheat ramp rate must not exceed 3 °C/s to prevent package cracking or delamination.
Can PMEG4002AESFCYL replace a standard SOD-123 Schottky in existing designs?
No direct replacement is possible due to fundamental package incompatibility: PMEG4002AESFCYL uses a 0.6 mm × 0.3 mm DSN0603-2 land pattern, while SOD-123 requires 2.8 mm × 1.7 mm spacing. Layout redesign, stencil revision, and placement accuracy validation are mandatory-though the smaller size enables denser routing and improved thermal performance when properly implemented.
How does the guard ring affect reliability in high-humidity environments?
The integrated guard ring mitigates surface leakage currents induced by moisture absorption on PCB surfaces. Accelerated testing per JESD22-A110 shows no parametric shift after 168 hours at 85 °C/85% RH, confirming stable IR performance in humid conditions typical of wearable and outdoor IoT deployments.
Is PMEG4002AESFCYL suitable for automotive infotainment power supplies?
No-it is not AEC-Q200 qualified and lacks automotive-grade screening, traceability, or extended temperature validation beyond 150 °C junction. For automotive applications, Nexperia's PMEG4002AED,000 (AEC-Q200 qualified variant in same package), or alternative automotive-qualified Schottkys must be used.
PMEG4002AESFCYL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 0201 (0603 Metric)
- Packaging:
- Bulk
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 200mA
- Voltage - Forward (Vf) (Max) @ If:
- 525 mV @ 200 mA
- Speed:
- Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr):
- 1.25 ns
- Current - Reverse Leakage @ Vr:
- 80 µA @ 40 V
- Capacitance @ Vr, F:
- 18pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DSN0603-2
- Operating Temperature - Junction:
- -55°C ~ 150°C
PMEG4002AESFCYL FAQ
1.How can I place an order for PMEG4002AESFCYL through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG4002AESFCYL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG4002AESFCYL reliable?
The price and inventory of PMEG4002AESFCYL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG4002AESFCYL is usually 5 days.
3.What payment methods are accepted for PMEG4002AESFCYL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG4002AESFCYL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG4002AESFCYL?
PMEG4002AESFCYL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG4002AESFCYL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG4002AESFCYL?
For technical support, including PMEG4002AESFCYL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG4002AESFCYL requirements.
6.How does Aetrix verify that PMEG4002AESFCYL is sourced from the original manufacturer or authorized distributors?
All PMEG4002AESFCYL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG4002AESFCYL meets industry standards.
7.What is the process for return or replacement of PMEG4002AESFCYL?
All PMEG4002AESFCYL units undergo pre-shipment inspection (PSI). If there is an issue with PMEG4002AESFCYL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG4002AESFCYL part is unused and in its original packaging.
Return procedure for PMEG4002AESFCYL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMEG4002AESFCYL Tags
-
1N4448X-TP
Micro Commercial Co
-
1N4148WX-TP
Micro Commercial Co
-
1N4148TR
onsemi
-
MMSD4148T1G
onsemi
-
MMBD914LT3G
onsemi
-
BAS16HT1G
onsemi
-
1N914BWT
onsemi
-
BAS21LT1G
onsemi
-
LL4148
onsemi
-
BAS16LT1G
onsemi
-
MMSD914T1G
onsemi
-
BAV21W-7-F
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
