Nexperia USA Inc. PMEG4005AESFCYL

Overview

PMEG4005AESFCYL from Nexperia is a 40 V, 0.5 A planar Schottky barrier rectifier with integrated guard ring for stress protection, housed in an SOD323 (SC-76) package. It delivers ultra-low forward voltage (420–470 mV at 500 mA), low reverse leakage (30–100 µA at 40 V), and high surge capability (10 A non-repetitive), enabling use in compact DC/DC converters and reverse polarity protection circuits.

For engineers reviewing the PMEG4005AESFCYL datasheet, PMEG4005AESFCYL pinout, PMEG4005AESFCYL application, or PMEG4005AESFCYL equivalent, key selection criteria include forward voltage optimization at low load currents (e.g., 220–270 mV at 10 mA), junction-to-solder-point thermal resistance (90 K/W), diode capacitance (43–50 pF at 1 V), and SOD323 footprint compatibility for space-constrained PCB layouts.

Technical Context

This Schottky rectifier uses a planar die structure with an integrated guard ring to enhance ruggedness against voltage transients and electrostatic stress. Its low VF stems from optimized metal-semiconductor interface design, not edge termination alone.

Thermal performance is defined by three distinct paths: junction-to-ambient (450 K/W on FR4), junction-to-solder-point (90 K/W at cathode tab), and junction-to-PCB pad (210 K/W). These values assume specified mounting conditions-no derating assumptions are embedded.

Key Specifications

Pinout & Package

Encapsulated in SOD323 (SC-76), a 1.7 mm × 1.25 mm × 0.95 mm surface-mount plastic package with 1.3 mm lead pitch. Cathode identified by marking bar.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with RB520S-40T1G and SS14, PMEG4005AESFCYL offers the lowest VF in its class at 500 mA while maintaining SOD323 compatibility and guard ring robustness-making it optimal for space-limited, efficiency-critical 0.5 A applications where thermal margin is tight.

Availability

PMEG4005AESFCYL is available at Aetrix Electronics and suitable for battery-powered IoT sensors, USB-C port protection, and compact DC/DC buck converters requiring stable component supply and consistent SOD323 footprint availability.

Supply support for PMEG4005AESFCYL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade components.

This device belongs to Nexperia's Schottky rectifier portfolio designed specifically for efficiency-critical, space-constrained power management in consumer, computing, and portable electronics.

FAQ

What is the maximum junction temperature for continuous operation?

The absolute maximum junction temperature is 150 °C per IEC 60134 limiting values. For reliable long-term operation, junction temperature must remain ≤150 °C under worst-case ambient, power dissipation, and PCB thermal conditions. Derating is required above 85 °C ambient per thermal resistance data in Table 6.

Does the marking bar indicate anode or cathode?

The marking bar on the SOD323 package identifies Pin 1 as the cathode (K), consistent with Table 2 pinning information and Figure 4 package outline. This orientation is standardized across Nexperia's Schottky diodes in SOD323 format.

Can this diode be used in reverse-biased clamping applications?

Yes-it is rated for 40 V reverse voltage and exhibits low leakage (≤100 µA at 40 V), making it suitable for voltage clamping where reverse breakdown must be avoided. Its 43–50 pF capacitance at 1 V also supports fast transient response in such roles.

Is thermal runaway a concern in high-temperature environments?

Yes-thermal runaway must be considered per Section 9 footnote [1], because reverse power losses (PR) can become significant at elevated temperatures and high VR. Designers must ensure total power dissipation remains within thermal limits using Rth(j-a) = 450 K/W or Rth(j-sp) = 90 K/W as appropriate.