Nexperia USA Inc. PMEG4010EXEX

Overview

PMEG4010EXEX from Nexperia is a 40 V, 1 A planar Schottky barrier rectifier in a CFP3-HP (SOD123HP) surface-mount package, designed for low-voltage DC-to-DC conversion and reverse polarity protection. It delivers 430–490 mV forward voltage at 1 A and 25 °C, exhibits ≤50 µA reverse leakage at 40 V/25 °C, and supports 50 A non-repetitive surge current - enabling high-efficiency power path management in space-constrained industrial and consumer power supplies.

For engineers reviewing the PMEG4010EXEX datasheet, PMEG4010EXEX pinout, PMEG4010EXEX application, or PMEG4010EXEX equivalent, key selection criteria include thermal resistance to solder point (6 K/W), low VF stability across -40 °C to 125 °C, clip-bonded package thermal performance, and SOD123HP footprint compatibility with automated reflow assembly.

Technical Context

This Schottky rectifier uses a planar metal-semiconductor junction architecture optimized for minimal forward conduction loss and fast switching behavior. Its clip-bond construction directly connects the die cathode to an exposed heatsink pad, reducing R_th(j-sp) to 6 K/W and enabling sustained 1 A average current at T_sp ≤ 172 °C under square-wave excitation (δ = 0.5, f = 20 kHz).

The device exhibits negligible reverse recovery charge (Q_rr = 2.5 nC) and sub-6 ns ramp-mode trr due to majority-carrier conduction, eliminating minority-carrier storage delay. Diode capacitance drops from 115 pF at 1 V to 40 pF at 10 V reverse bias, supporting stable high-frequency operation in SMPS output stages.

Key Specifications

Pinout & Package

Encapsulated in a CFP3-HP (SOD123HP) plastic surface-mount package measuring 2.80 mm × 1.80 mm × 0.90 mm, with an exposed cathode heatsink pad for enhanced thermal transfer. The package features gull-wing leads compatible with IPC-7351B footprint standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with NSR40100XV6T1G and VSSAF510-M3/84A, PMEG4010EXEX delivers superior thermal performance via its clip-bonded SOD123HP package - enabling 1 A continuous current with only 1 cm² cathode copper, whereas alternatives require either derating or larger PCB real estate to achieve equivalent reliability.

Availability

PMEG4010EXEX is available at Aetrix Electronics and suitable for USB-C power adapters, industrial 24 V input modules, and point-of-load DC-DC converters requiring stable component supply, high-volume manufacturability, and long-term lifecycle support.

Supply support for PMEG4010EXEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

The PMEG4010EXEX belongs to Nexperia's CFP3-HP Schottky rectifier product line, engineered specifically for thermally demanding, high-frequency power conversion where low VF and ultra-low Rth(j-sp) are critical to system efficiency and reliability.

FAQ

What is the maximum allowable solder point temperature for PMEG4010EXEX during reflow?

The device is qualified for reflow per J-STD-020, with peak solder point temperature limited to 260 °C for ≤30 seconds. Thermal design must ensure T_sp does not exceed 172 °C during steady-state operation at 1 A average current, as defined in the limiting values table for δ = 0.5 duty cycle.

Can PMEG4010EXEX replace a standard SOD-123 Schottky diode in existing layouts?

No - PMEG4010EXEX uses the CFP3-HP variant of SOD123HP, which has an exposed cathode pad requiring a dedicated 1 cm² thermal land. Standard SOD-123 footprints lack this copper area and thermal via pattern, resulting in thermal overload and premature failure if used interchangeably.

How does the 6 K/W Rth(j-sp) value impact PCB layout requirements?

A 6 K/W Rth(j-sp) demands direct thermal connection from the cathode pad to a minimum 1 cm² copper area on the primary side of the PCB, with no solder mask over the land. Adding 4–6 thermal vias (0.3 mm diameter, filled) to an internal ground plane further reduces effective thermal resistance by ~1.5 K/W in multilayer boards.

Is PMEG4010EXEX suitable for automotive applications?

No - this part is not AEC-Q200 qualified and lacks automotive-grade screening, high-temperature qualification beyond 175 °C junction, or guaranteed PPAP documentation. Nexperia explicitly states non-automotive qualification in the legal disclaimers; use only in industrial, consumer, or commercial equipment.