My Inquiry
My Account
NXP Semiconductors PMEG4030ER/BX
- Part No.:
- PMEG4030ER/BX
- Manufacturer:
- NXP Semiconductors
- Category:
- Single Diodes
- Package:
- -
- Datasheet:
-
PMEG4030ER/BX.pdf
- Description:
- DIODE SCHOTTKY 40V 3A SOD123W
- Quantity:
- Payment:
- Shipping:
Inventory:5,672
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMEG4030ER from Nexperia is a planar Schottky barrier rectifier with integrated guard ring for stress protection, designed for low-voltage DC-to-DC conversion and reverse polarity protection. It delivers 3 A average forward current at ≤40 V reverse voltage, with a typical forward voltage of 460 mV at 3 A and 25 °C, enabling high-efficiency power conversion in space-constrained SMD applications.
For engineers reviewing the PMEG4030ER datasheet, PMEG4030ER pinout, PMEG4030ER application, or PMEG4030ER equivalent, key selection criteria include its low VF performance, SOD123W package thermal behavior, clip-bond power capability, and suitability for SMPS output rectification where thermal resistance to solder point (Rth(j-sp) = 18 K/W) and junction temperature limits (Tj ≤ 150 °C) are critical.
Technical Context
This Schottky diode uses a planar die structure with an integrated guard ring to enhance ruggedness against electrical overstress and improve reliability under repetitive surge conditions. Its clip-bond construction enables higher power dissipation than wire-bonded equivalents in the same footprint.
The device operates as a unidirectional current switch with cathode-anode polarity, optimized for continuous conduction mode (CCM) and discontinuous conduction mode (DCM) rectification. Thermal performance is highly dependent on PCB layout-Rth(j-a) ranges from 70 K/W (ceramic) to 220 K/W (standard FR4), requiring careful thermal pad design for sustained 3 A operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 40 V maximum - defines maximum blocking capability in reverse bias without breakdown; sets upper limit for input/output voltage rails in buck converters or reverse protection circuits. |
| Average Forward Current (IF(AV)) | 3 A at Tsp ≤ 130 °C - sustainable DC or pulsed current under defined thermal boundary conditions; requires adequate copper area on cathode pad for full rating. |
| Forward Voltage (VF) | 460–540 mV at IF = 3 A, Tj = 25 °C - directly reduces conduction loss in high-current paths; enables >95% efficiency in 5 V/3 A output stages. |
| Reverse Current (IR) | 25–100 µA at VR = 40 V, Tj = 25 °C - low leakage preserves battery life in always-on systems and minimizes standby power loss. |
| Diode Capacitance (Cd) | 95 pF at VR = 10 V, f = 1 MHz - impacts switching speed and EMI in high-frequency SMPS; lower than comparable 40 V Si diodes. |
| Junction Temperature (Tj) | 150 °C maximum - constrains maximum ambient or board temperature when operating at full current; dictates derating curves in Fig. 9–11. |
| Thermal Resistance (Rth(j-sp)) | 18 K/W - measured from junction to cathode solder point; enables accurate thermal modeling when cathode pad is thermally anchored to internal ground or power planes. |
Pinout & Package
Encapsulated in a CFP3 (SOD123W) surface-mount plastic package measuring 2.6 mm × 1.7 mm × 1.0 mm, the PMEG4030ER features a flat lead profile optimized for automated reflow assembly and minimal board space. The cathode is marked by a bar on the top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Negative terminal; carries forward current out of the device; connects to output rail or ground return path; primary thermal path via large copper pad. |
| 2 | Anode (A) | Positive terminal; connects to input or switched node; smaller thermal contribution; must be routed with low-inductance trace in high-dI/dt applications. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated guard ring | Improves surge robustness and reduces localized electric field crowding, increasing reliability in transient-prone environments like automotive load dumps or industrial power cycling. |
| Clip-bond interconnect | Enables higher current density and lower thermal resistance vs. wire bonding-supports 3 A continuous current with reduced self-heating in compact layouts. |
| SOD123W package | 0.75 mm max height and 1.7 mm width allow placement in ultra-thin power modules and portable electronics where Z-height is constrained. |
| Low VF at high current | 460 mV typ. at 3 A ensures <1.4 W conduction loss (vs. ~3.6 W for 1.2 V Si diode), directly improving thermal margin and reducing heatsink requirements. |
| Low reverse leakage | 25 µA typ. at 40 V reverse bias minimizes quiescent current drain in battery-backed systems and improves no-load efficiency in offline adapters. |
Applications
| USB Power Delivery Output Rectification | Industrial PLC 24 V Input Protection |
|---|---|
|
Use Scenario: Rectifying 20 V output from synchronous buck converter in USB PD 3.0 compliant adapter. IC Role / Device Role / Timing Role: Output freewheeling diode in CCM/DCM operation; conducts during low-side FET off-time. Use Value: 460 mV VF reduces conduction loss by >60% vs. standard Si diode, enabling 5 W/cm² power density without forced air cooling. |
Use Scenario: Reverse polarity protection at 24 V DC input of programmable logic controller. IC Role / Device Role / Timing Role: Series-connected anode-to-input, cathode-to-system-rail; blocks reverse connection while conducting forward. Use Value: 3 A IF(AV) rating supports peak inrush currents up to 50 A (IFSM), surviving hot-plug events without degradation. |
| 5 V/3 A Point-of-Load Converter | IoT Sensor Node Battery Backup Path |
|
Use Scenario: Secondary-side rectification in 500 kHz buck converter powering FPGA core voltage. IC Role / Device Role / Timing Role: High-frequency unidirectional switch; handles 3 A DC + ripple current with minimal voltage overshoot. Use Value: 95 pF capacitance limits switching node ringing and EMI generation, easing EMC compliance in dense mixed-signal PCBs. |
Use Scenario: OR-ing diode between Li-ion battery and main 3.3 V supply in always-on environmental sensor. IC Role / Device Role / Timing Role: Prevents backfeed from battery to system during main supply dropout; conducts only when battery voltage exceeds rail. Use Value: 25 µA IR at 3.6 V reverse bias extends shelf life beyond 10 years in storage; low VF avoids unnecessary battery voltage drop. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VSSAF340M | Same 40 V VR, 3 A IF(AV), but VF = 520 mV typ. at 3 A; SOD123 package (slightly larger footprint). | Higher VF increases conduction loss by ~130 mW at 3 A; less suitable for thermally constrained PoL designs. | Select when legacy SOD123 footprint compatibility is required and 60 mV VF penalty is acceptable. |
| ON Semiconductor NSR340HT1G | Identical SOD123W package and 40 V/3 A rating; VF = 490 mV typ. at 3 A; slightly higher IR (50 µA typ. at 40 V). | Marginally higher leakage may impact long-term battery retention; otherwise functionally interchangeable in most SMPS roles. | Prefer for designs already using ON Semi BOMs; verify leakage sensitivity in >5-year battery backup applications. |
Compared with PMEG4030ER, VSSAF340M trades lower thermal resistance for higher VF, while NSR340HT1G offers near-identical performance with minor leakage trade-off-neither is pin-compatible due to differing marking schemes and qualification histories, but both fit the same SOD123W footprint and meet equivalent electrical boundaries.
Availability
PMEG4030ER is available at Aetrix Electronics and suitable for USB PD adapters, industrial PLCs, point-of-load converters, and IoT battery backup systems requiring stable component supply, consistent parametric performance, and long-lifecycle availability.
Supply support for PMEG4030ER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors-high-performance, reliable components for power management, logic, and analog applications.
The PMEG4030ER belongs to Nexperia's low-VF Schottky rectifier family, engineered specifically for high-efficiency, space-constrained DC-to-DC conversion and reverse polarity protection in consumer, industrial, and computing power supplies.
FAQ
What is the maximum junction temperature specification for the PMEG4030ER?
The PMEG4030ER has a maximum junction temperature (Tj) rating of 150 °C, as defined in the Absolute Maximum Ratings table. This limit governs thermal derating curves in Figures 9–11 and must not be exceeded during operation-even transiently-to ensure long-term reliability. The PMEG4030ER achieves this rating through its clip-bond construction and optimized SOD123W thermal path.
Does the PMEG4030ER have AEC-Q101 qualification?
No, the PMEG4030ER does not carry AEC-Q101 qualification. Revision history in the datasheet explicitly states that "AEC-Q101 qualified" was removed from the Features and benefits section in v.4 (20230123). It is intended for industrial, computing, and consumer applications-not automotive use-unless independently validated by the end customer.
How does the guard ring in the PMEG4030ER improve reliability?
The integrated guard ring in the PMEG4030ER reduces electric field concentration at the silicon edge, suppressing premature avalanche breakdown and enhancing resistance to electrostatic discharge (ESD) and repetitive voltage transients. This structural feature directly improves robustness in applications like industrial power inputs or USB ports exposed to load dump or hot-swap events.
What is the thermal resistance from junction to solder point (Rth(j-sp)) for the PMEG4030ER?
The PMEG4030ER has a thermal resistance from junction to solder point (Rth(j-sp)) of 18 K/W, measured at the cathode tab. This value enables precise thermal modeling when the cathode pad is connected to internal copper layers or thermal vias, and is significantly lower than junction-to-ambient values-highlighting the importance of optimizing the cathode thermal path in layout.
Can the PMEG4030ER replace a standard silicon rectifier in a 24 V SMPS design?
Yes, the PMEG4030ER can replace a standard silicon rectifier in a 24 V SMPS design-provided the reverse voltage requirement stays within 40 V and forward current remains ≤3 A. Its 460 mV VF at 3 A cuts conduction losses by more than half versus a typical 1.1 V Si diode, directly improving efficiency and reducing thermal stress on the PMEG4030ER and surrounding components.
PMEG4030ER/BX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- -
- Voltage - DC Reverse (Vr) (Max):
- -
- Current - Average Rectified (Io):
- -
- Voltage - Forward (Vf) (Max) @ If:
- -
- Speed:
- -
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- -
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
- Operating Temperature - Junction:
- -
PMEG4030ER/BX FAQ
1.How can I place an order for PMEG4030ER/BX through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG4030ER/BX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG4030ER/BX reliable?
The price and inventory of PMEG4030ER/BX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG4030ER/BX is usually 5 days.
3.What payment methods are accepted for PMEG4030ER/BX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG4030ER/BX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG4030ER/BX?
PMEG4030ER/BX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG4030ER/BX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG4030ER/BX?
For technical support, including PMEG4030ER/BX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG4030ER/BX requirements.
6.How does Aetrix verify that PMEG4030ER/BX is sourced from the original manufacturer or authorized distributors?
All PMEG4030ER/BX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG4030ER/BX meets industry standards.
7.What is the process for return or replacement of PMEG4030ER/BX?
All PMEG4030ER/BX units undergo pre-shipment inspection (PSI). If there is an issue with PMEG4030ER/BX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG4030ER/BX part is unused and in its original packaging.
Return procedure for PMEG4030ER/BX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMEG4030ER/BX Tags
-
1N4448X-TP
Micro Commercial Co
-
1N4148WX-TP
Micro Commercial Co
-
1N4148TR
onsemi
-
MMSD4148T1G
onsemi
-
MMBD914LT3G
onsemi
-
BAS16HT1G
onsemi
-
1N914BWT
onsemi
-
BAS21LT1G
onsemi
-
LL4148
onsemi
-
BAS16LT1G
onsemi
-
MMSD914T1G
onsemi
-
BAV21W-7-F
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
