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NXP Semiconductors PMEG6010AESBC315

Part No.:
PMEG6010AESBC315
Manufacturer:
NXP Semiconductors
Category:
Single Diodes
Package:
2-XDFN
Datasheet:
AetrixPMEG6010AESBC315.pdf
Description:
RECTIFIER DIODE, SCHOTTKY
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,742

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Product details

Overview

PMEG6010AESBC315 from Nexperia is a 60 V, 1 A planar MEGA Schottky barrier rectifier in a leadless DSN1006-2 (SOD993) package, featuring low forward voltage (525 mV typ. at 1 A), low reverse current (185 µA typ. at 60 V), and ultra-thin profile (270 µm height), optimized for high-efficiency DC-to-DC conversion in space-constrained mobile power supplies.

For engineers reviewing the PMEG6010AESBC315 datasheet, PMEG6010AESBC315 pinout, PMEG6010AESBC315 application, or PMEG6010AESBC315 equivalent, key selection criteria include its 2.4 ns reverse recovery time, 57 pF diode capacitance at 1 V, thermal resistance of 240 K/W (FR4 PCB), junction temperature rating up to 150 °C, and compatibility with reflow soldering per JEDEC J-STD-020.

Technical Context

This Schottky rectifier uses a planar MEGA structure with integrated guard ring for enhanced stress protection and stable reverse breakdown behavior. Its metal–semiconductor junction enables near-zero minority-carrier storage, resulting in negligible reverse recovery charge and minimal switching losses.

The device operates with no minority-carrier injection, delivering fast unidirectional conduction and low dynamic losses in high-frequency switching topologies. Its DSN1006-2 package provides low thermal resistance to solder point (15 K/W) and supports high-density PCB layouts without wire bonds or leads.

Key Specifications

Parameter Value and Actual Design Meaning
Reverse Voltage (VR)60 V - Maximum blocking capability without avalanche breakdown under steady-state conditions.
Average Forward Current (IF(AV))1 A - Continuous DC or square-wave current handling at Tsp ≤ 140 °C on standard FR4 PCB.
Forward Voltage (VF)525 mV typ. at 1 A - Reduces conduction loss by ~30% vs. standard Schottkys, improving efficiency in 3.3 V/5 V buck converters.
Reverse Current (IR)185 µA typ. at 60 V - Minimizes standby leakage in always-on power rails and battery-backed circuits.
Reverse Recovery Time (trr)2.4 ns - Enables operation beyond 100 MHz switching frequencies with negligible tail current.
Diode Capacitance (Cd)57 pF at 1 V - Limits high-frequency displacement current and EMI generation in fast-edge applications.
Junction Temperature (Tj)150 °C - Supports reliable operation in thermally dense mobile and IoT modules without derating at ambient ≤ 95 °C.

Pinout & Package

Package: DSN1006-2 (SOD993), leadless ultra-small surface-mount package; dimensions 1.0 × 0.6 × 0.27 mm; body material epoxy; terminals are exposed copper alloy pads with matte tin finish.

Pin/Terminal Circuit Role Design Meaning
1Cathode (K)Output terminal for forward conduction; marked side of package; connects to lower-potential node (e.g., ground or output rail).
2Anode (A)Input terminal for forward conduction; unmarked side; connects to higher-potential node (e.g., switch node or input rail).

Key Features

Feature Design Value
Integrated guard ringPrevents edge breakdown under mechanical or thermal stress, ensuring robustness during board flexure and reflow cycling.
Ultra-low profile (270 µm)Enables stacking under thin bezels or beneath batteries in smartphones and wearables without height interference.
Low thermal resistance to solder point (15 K/W)Allows direct heat transfer from junction to PCB copper, supporting 1 A continuous operation without heatsink on 1 cm² pads.
Reflow-compatible footprintValidated for JEDEC J-STD-020 profile; requires 0.5 mm pad width and 0.6 mm pad length per terminal per AN11689.
Marking bar on cathode sideProvides unambiguous polarity identification under automated optical inspection (AOI) and manual assembly.

Applications

Mobile LED Backlight USB-C Power Delivery Rectification

Use Scenario: Boost converter driving white LEDs in smartphone displays with tight height constraints and thermal limits.

IC Role / Device Role / Timing Role: Output rectifier in synchronous boost topology, conducting during low-side switch off-time.

Use Value: 525 mV VF reduces power loss by 0.525 W at 1 A, lowering local temperature rise and enabling thinner display modules.

Use Scenario: Secondary-side rectification in 20–100 W USB-C PD adapters operating at 200–500 kHz.

IC Role / Device Role / Timing Role: High-speed unidirectional current path replacing slower silicon diodes in flyback or active-clamp forward designs.

Use Value: 2.4 ns trr eliminates reverse recovery spikes, reducing EMI filter size and improving conducted emissions compliance.

Wearable Battery Charging Path Industrial Sensor Node Power Rail

Use Scenario: Reverse polarity and backfeed protection in compact Li-ion charging circuits for hearables and smart bands.

IC Role / Device Role / Timing Role: Low-loss series blocking diode between charger IC and battery, conducting only during charge phase.

Use Value: 185 µA IR at 60 V ensures <1 µA standby drain, extending shelf life of pre-charged devices over 12 months.

Use Scenario: Input protection and rail isolation in battery-powered IIoT nodes with multiple supply domains (3.3 V, 1.8 V, sensor bias).

IC Role / Device Role / Timing Role: Isolation diode preventing cross-regulator loading during brownout or hot-swap events.

Use Value: 1.0 × 0.6 mm footprint saves >0.4 mm² vs. SOD-123, critical for 4-layer PCBs with dense analog routing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
RB050M-40TRHigher VF (650 mV min), larger SOD-123 package (3.7 × 1.6 mm), 40 V VR rating.Limited to ≤40 V systems; unsuitable for 48 V PoE or USB-PD 3.0 20 V+ rails.Select when cost sensitivity outweighs size/efficiency needs and voltage margin is sufficient.
SS121 A/20 V rating, DO-214AC package (4.5 × 2.7 mm), VF = 550 mV typ., trr not specified.Not suitable for >20 V applications; lacks documented ultra-fast recovery for high-frequency SMPS.Choose only for legacy 3.3/5 V linear regulator inputs where layout density is non-critical.

Compared with RB050M-40TR and SS12, PMEG6010AESBC315 delivers 60 V capability in 1/10th the footprint and 30% lower VF, making it uniquely suited for modern portable power stages where voltage headroom, thermal density, and efficiency are simultaneously constrained.

Availability

PMEG6010AESBC315 is available at Aetrix Electronics and suitable for mobile LED backlighting, USB-C power delivery rectification, and wearable battery charging path applications requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle support.

Supply support for PMEG6010AESBC315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors, with leadership in logic, discrete, and MOSFET technologies for automotive, industrial, and mobile markets.

The PMEG6010AESBC315 belongs to Nexperia's MEGA Schottky rectifier family, engineered specifically for ultra-compact, high-efficiency power conversion in battery-powered consumer electronics where size, thermal performance, and low conduction loss are primary design drivers.

FAQ

What is the maximum junction temperature rating for PMEG6010AESBC315?

The PMEG6010AESBC315 has a maximum junction temperature (Tj) rating of 150 °C, validated per IEC 60134 limiting values. This allows sustained operation in thermally dense environments such as stacked PCBs in smartphones, provided solder point temperature remains ≤140 °C under 1 A average forward current conditions.

Does PMEG6010AESBC315 support lead-free reflow soldering?

Yes, PMEG6010AESBC315 is qualified for lead-free reflow soldering per JEDEC J-STD-020. Its DSN1006-2 package uses matte tin terminations and is compatible with peak temperatures up to 260 °C. Recommended footprint dimensions-0.5 mm pad width and 0.6 mm pad length per terminal-are defined in Nexperia application note AN11689.

How does the guard ring in PMEG6010AESBC315 improve reliability?

The integrated guard ring in PMEG6010AESBC315 mitigates electric field crowding at the silicon edge, preventing premature avalanche breakdown during voltage transients or mechanical stress. This feature enhances robustness against board flexure, thermal cycling, and ESD events-critical for drop-tested mobile devices where the PMEG6010AESBC315 is commonly deployed.

What is the reverse recovery time (trr) of PMEG6010AESBC315 and why does it matter?

The PMEG6010AESBC315 has a typical reverse recovery time (trr) of 2.4 ns, measured at IF = IR = 0.5 A with IR(meas) = 0.1 A. This ultra-fast recovery eliminates reverse recovery current spikes, reducing switching losses and EMI in high-frequency DC-DC converters-enabling cleaner waveforms and smaller output filters in PMEG6010AESBC315-based designs.

Can PMEG6010AESBC315 be used in automotive applications?

No, PMEG6010AESBC315 is not automotive-qualified. Per Nexperia's legal disclaimers, this device is explicitly designated for consumer and industrial use only. It has not undergone AEC-Q101 testing or qualification for temperature cycling, humidity, or vibration requirements mandated for automotive ECUs, infotainment, or ADAS subsystems.

PMEG6010AESBC315 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
2-XDFN
Packaging:
Bulk
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
60 V
Current - Average Rectified (Io):
1A
Voltage - Forward (Vf) (Max) @ If:
625 mV @ 1 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
2.4 ns
Current - Reverse Leakage @ Vr:
650 µA @ 60 V
Capacitance @ Vr, F:
20pF @ 10V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DSN1006-2
Operating Temperature - Junction:
150°C

PMEG6010AESBC315 FAQ

1.How can I place an order for PMEG6010AESBC315 through Aetrix?

Please submit a Request for Quotation (RFQ) for PMEG6010AESBC315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PMEG6010AESBC315 reliable?

The price and inventory of PMEG6010AESBC315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG6010AESBC315 is usually 5 days.

3.What payment methods are accepted for PMEG6010AESBC315?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG6010AESBC315 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PMEG6010AESBC315?

PMEG6010AESBC315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PMEG6010AESBC315 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PMEG6010AESBC315?

For technical support, including PMEG6010AESBC315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG6010AESBC315 requirements.

6.How does Aetrix verify that PMEG6010AESBC315 is sourced from the original manufacturer or authorized distributors?

All PMEG6010AESBC315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG6010AESBC315 meets industry standards.

7.What is the process for return or replacement of PMEG6010AESBC315?

All PMEG6010AESBC315 units undergo pre-shipment inspection (PSI). If there is an issue with PMEG6010AESBC315, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PMEG6010AESBC315 part is unused and in its original packaging.

Return procedure for PMEG6010AESBC315:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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