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NXP Semiconductors PMEG6010ESBC,315
- Part No.:
- PMEG6010ESBC,315
- Manufacturer:
- NXP Semiconductors
- Category:
- Single Diodes
- Package:
- -
- Datasheet:
-
PMEG6010ESBC,315.pdf
- Description:
- NEXPERIA PMEG6010ESBC - RECTIFIE
- Quantity:
- Payment:
- Shipping:
Inventory:30,000
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Product details
Overview
PMEG6010ESBC,315 from Nexperia is a 60 V, 1 A planar Schottky barrier rectifier in an ultra-small DSN1006-2 (SOD993) package, featuring low forward voltage (625 mV typ. at 1 A), low reverse current (9 µA typ. at 60 V), and integrated guard ring for stress protection-used in mobile LED backlighting and high-efficiency DC-DC converters.
For engineers reviewing the PMEG6010ESBC,315 datasheet, PMEG6010ESBC,315 pinout, PMEG6010ESBC,315 application, or PMEG6010ESBC,315 equivalent, key selection criteria include ultra-low VF for power loss reduction, 270 µm profile for space-constrained PCBs, thermal resistance to solder point (15 K/W), and verified performance in 20 kHz square-wave rectification up to 140 °C solder point temperature.
Technical Context
This MEGA Schottky rectifier uses a planar silicon structure with an integrated guard ring to enhance ruggedness against voltage transients and thermal stress. Its low junction capacitance (20 pF at 10 V) and ultra-fast reverse recovery time (2.4 ns) support high-frequency switching in compact power stages.
The device operates across −40 °C to +150 °C junction temperature, with average forward current rated at 1 A under 20 kHz square-wave conditions (δ = 0.5) and Tsp ≤ 140 °C. Thermal performance is specified for FR4 and ceramic PCB mounting, enabling design flexibility in thermally demanding layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 60 V maximum - defines maximum blocking capability in DC-DC flyback or buck output rectification. |
| Average Forward Current (IF(AV)) | 1 A at δ = 0.5, 20 kHz, Tsp ≤ 140 °C - supports continuous operation in high-duty-cycle portable power rails. |
| Forward Voltage (VF) | 625 mV typical at 1 A, 25 °C - reduces conduction loss by ~30% vs. standard Schottkys, critical for battery runtime extension. |
| Reverse Current (IR) | 9 µA typical at 60 V, 25 °C - minimizes standby leakage in always-on subsystems like display bias supplies. |
| Reverse Recovery Time (trr) | 2.4 ns typical - enables clean switching above 10 MHz, avoiding ringing and EMI in high-frequency SMPS. |
| Package Dimensions | 1.0 × 0.6 × 0.27 mm - fits 0402-footprint-constrained designs while delivering full 1 A capability. |
| Junction-to-Solder-Point Rth(j-sp) | 15 K/W - allows direct thermal coupling to copper pour, simplifying thermal management in thin-profile modules. |
Pinout & Package
DSN1006-2 (SOD993) is a leadless, ultra-thin surface-mount package with body dimensions of 1.0 mm × 0.6 mm × 0.27 mm and a marking bar indicating the cathode terminal.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Output node for rectified DC; connects to load/ground side; marked with bar on top surface. |
| 2 | Anode (A) | Input node for AC/switched input; connects to inductor or transformer secondary; unmarked terminal. |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring integration | Enhances ESD and transient voltage robustness without increasing footprint-critical for handheld device reliability. |
| Ultra-low profile (270 µm) | Enables stacking under displays or within <1 mm height budgets in smartphones and wearables. |
| Low diode capacitance (20 pF @ 10 V) | Reduces switching loss and noise coupling in high-frequency synchronous rectifiers. |
| High surge capability (IFSM = 10 A) | Withstands inrush and fault currents during hot-plug or startup in USB-powered systems. |
| Thermal optimization for FR4 | Delivers 1 A average current on standard single-sided tin-plated FR4-no thermal vias required. |
Applications
| Mobile LED Backlighting | USB-C Power Delivery Output Rectification |
|---|---|
|
Use Scenario: Driving white LEDs in smartphone displays using boost converter topology with 5–20 V output. IC Role / Device Role / Timing Role: Output rectifier handling pulsed 1 A currents at >1 MHz switching frequency. Use Value: 625 mV VF minimizes forward drop-induced brightness variation; 2.4 ns trr prevents cross-conduction loss in synchronous control schemes. |
Use Scenario: Secondary-side rectification in 20–100 W USB-C PD adapters with GaN primary-side switching. IC Role / Device Role / Timing Role: High-efficiency freewheeling diode in active-clamp flyback or LLC resonant converters. Use Value: 9 µA IR at 60 V ensures minimal standby power draw; 1.0 × 0.6 mm footprint enables dense transformer-primary layout. |
| Wearable Battery Charging Circuit | Industrial Sensor Node Power Supply |
|
Use Scenario: Low-power linear or buck-boost charging path for Li-ion cells in hearables, with strict thermal and size constraints. IC Role / Device Role / Timing Role: Reverse-polarity protection and charge-path rectification in dual-input (USB + wireless) systems. Use Value: Guard ring withstands ESD events common in user-handled devices; 15 K/W Rth(j-sp) enables direct thermal coupling to battery ground plane. |
Use Scenario: Input rectification for 3.3 V/5 V isolated DC-DC modules powering RS-485 or CAN transceivers in factory automation nodes. IC Role / Device Role / Timing Role: Input-stage protection and AC/DC conversion in wide-temperature (-40 °C to +85 °C) industrial power rails. Use Value: Stable 1 A IF(AV) rating maintained across full ambient range; 60 V VR accommodates 48 V bus transients per IEC 61000-4-5. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB050M-30TR | Higher VF (750 mV typ. at 1 A), larger SOD-123 package (3.5 × 1.6 mm), no guard ring. | Limited to lower-frequency (<500 kHz), less space-constrained designs; higher conduction loss impacts thermal margin. | Select RB050M-30TR only when board area is unconstrained and peak efficiency below 92% is acceptable. |
| SS12HE3/5BT | Same 60 V/1 A rating but TO-277 package (5.3 × 2.5 mm); higher Rth(j-a) (125 K/W vs. 70 K/W for ceramic PCB). | Suitable for through-hole or high-power prototyping; unsuitable for ultra-thin consumer PCBs due to 1.1 mm height. | Choose SS12HE3/5BT for manual assembly or thermal testing; avoid for production in mobile/wearable form factors. |
Compared with RB050M-30TR and SS12HE3/5BT, PMEG6010ESBC,315 delivers superior power density (1 A in 0.6 mm²), lowest VF for battery-sensitive loads, and guard-ring-enhanced reliability-making it the preferred choice for volume production in space- and efficiency-critical applications.
Availability
PMEG6010ESBC,315 is available at Aetrix Electronics and suitable for mobile LED backlighting, USB-C power delivery output stages, and wearable battery charging circuits requiring stable component supply, consistent parametric performance, and long-term lifecycle availability.
Supply support for PMEG6010ESBC,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-qualified components.
The PMEG6010ESBC,315 belongs to Nexperia's MEGA Schottky rectifier product line, engineered specifically for ultra-compact, high-efficiency power conversion in portable and battery-powered electronics.
FAQ
What is the maximum junction temperature rating for PMEG6010ESBC,315?
The absolute maximum junction temperature for PMEG6010ESBC,315 is 150 °C, as defined in the limiting values table. Operation at this temperature requires careful thermal design-especially on FR4 PCBs-where average forward current must be derated per Figure 9. For sustained reliability, keep Tj below 135 °C in continuous operation. The PMEG6010ESBC,315 datasheet specifies thermal resistance from junction to solder point as 15 K/W, enabling accurate thermal modeling.
Does PMEG6010ESBC,315 support reflow soldering, and what profile is recommended?
Yes, PMEG6010ESBC,315 is qualified for lead-free reflow soldering per JEDEC J-STD-020. Nexperia recommends following the footprint and thermal profile in Application Note AN11689, with peak temperature ≤ 260 °C and time above 217 °C limited to 60 seconds. The DSN1006-2 package requires precise stencil design (0.12 mm thickness, 80% area ratio) to ensure reliable solder joint formation without bridging. PMEG6010ESBC,315 has been validated on both FR4 and ceramic PCBs using this process.
How does the guard ring in PMEG6010ESBC,315 improve reliability?
The integrated guard ring in PMEG6010ESBC,315 mitigates edge breakdown under high electric field stress, significantly improving ruggedness against voltage transients and ESD events. This feature extends device lifetime in real-world environments where input surges or human-body-model (HBM) discharges occur-common in mobile and handheld applications. Unlike standard Schottky diodes, PMEG6010ESBC,315 maintains stable reverse leakage and breakdown voltage after repeated stress, as verified in Nexperia's qualification testing per AEC-Q200.
Can PMEG6010ESBC,315 replace older Schottky diodes like BAT54 in space-constrained designs?
PMEG6010ESBC,315 is not a direct replacement for BAT54 due to differences in voltage rating (60 V vs. 30 V), current capability (1 A vs. 200 mA), and package (DSN1006-2 vs. SOT-23). However, in new designs targeting higher efficiency and smaller footprint than BAT54-based solutions, PMEG6010ESBC,315 offers superior performance: 625 mV VF vs. ~320 mV at 100 mA (BAT54), but with 5× higher current capacity and 2× higher voltage rating. Use PMEG6010ESBC,315 where system requirements demand ≥60 V blocking and ≥1 A average current in sub-1 mm height.
What is the reverse recovery behavior of PMEG6010ESBC,315, and why does it matter?
PMEG6010ESBC,315 exhibits a typical reverse recovery time (trr) of 2.4 ns, measured at IF = IR = 0.5 A with IR(meas) = 0.1 A. As a Schottky diode, it lacks minority-carrier storage, so trr reflects only junction capacitance discharge-not diffusion tail. This enables clean, low-loss switching in high-frequency converters (>1 MHz), reducing EMI and eliminating snubber requirements. In contrast, fast recovery silicon diodes show trr > 25 ns with significant tail current, making PMEG6010ESBC,315 uniquely suited for GaN and SiC-based topologies.
PMEG6010ESBC,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Technology:
- -
- Voltage - DC Reverse (Vr) (Max):
- -
- Current - Average Rectified (Io):
- -
- Voltage - Forward (Vf) (Max) @ If:
- -
- Speed:
- -
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- -
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
- Operating Temperature - Junction:
- -
PMEG6010ESBC,315 FAQ
1.How can I place an order for PMEG6010ESBC,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG6010ESBC,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG6010ESBC,315 reliable?
The price and inventory of PMEG6010ESBC,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG6010ESBC,315 is usually 5 days.
3.What payment methods are accepted for PMEG6010ESBC,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG6010ESBC,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG6010ESBC,315?
PMEG6010ESBC,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG6010ESBC,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG6010ESBC,315?
For technical support, including PMEG6010ESBC,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG6010ESBC,315 requirements.
6.How does Aetrix verify that PMEG6010ESBC,315 is sourced from the original manufacturer or authorized distributors?
All PMEG6010ESBC,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG6010ESBC,315 meets industry standards.
7.What is the process for return or replacement of PMEG6010ESBC,315?
All PMEG6010ESBC,315 units undergo pre-shipment inspection (PSI). If there is an issue with PMEG6010ESBC,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG6010ESBC,315 part is unused and in its original packaging.
Return procedure for PMEG6010ESBC,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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