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Nexperia USA Inc. PMEG6030ETPX

Part No.:
PMEG6030ETPX
Manufacturer:
Nexperia USA Inc.
Category:
Single Diodes
Package:
SOD-128
Datasheet:
AetrixPMEG6030ETPX.pdf
Description:
DIODE SCHOTTKY 60V 3A SOD128
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:71,955

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Product details

Overview

PMEG6030ETPX from Nexperia is a planar Schottky barrier rectifier with integrated guard ring for stress protection, rated for 60 V reverse voltage and 3 A average forward current in a SOD128 (CFP5) surface-mount package. It delivers low forward voltage (460–530 mV at 3 A, 25 °C), operates up to 175 °C junction temperature, and supports reflow and wave soldering - deployed in high-efficiency DC-DC converters and reverse polarity protection circuits.

For engineers reviewing the PMEG6030ETPX datasheet, PMEG6030ETPX pinout, PMEG6030ETPX application, or PMEG6030ETPX equivalent, key selection criteria include thermal resistance (12 K/W junction-to-solder point), pulsed reverse current (80–200 µA at 60 V), reverse recovery time (12 ns), diode capacitance (360 pF at 1 V), and clip-bonded construction enabling high power capability in compact SMD form.

Technical Context

This Schottky rectifier uses a planar die structure with an integrated guard ring to enhance ruggedness against electrical overstress and improve reliability under transient conditions. Its low VF and absence of minority-carrier storage enable fast switching with trr = 12 ns and negligible reverse recovery charge.

The CFP5 (SOD128) package employs clip-bonding technology to reduce thermal resistance - Rth(j-sp) = 12 K/W - and supports high ambient operation up to 175 °C via optimized cathode tab thermal path. Reverse leakage remains controlled across temperature: IR = 0.5–10 µA at −40 °C and 45–150 mA at 125 °C (60 V, pulsed).

Key Specifications

Parameter Value and Actual Design Meaning
Reverse Voltage (VR) 60 V - Maximum blocking capability without breakdown; suitable for 48 V system rail protection and SMPS secondary-side rectification.
Average Forward Current (IF(AV)) 3 A - Sustained DC or square-wave current handling at Tsp ≤ 165 °C; enables compact high-current rectification in space-constrained layouts.
Forward Voltage (VF) 460–530 mV @ 3 A, 25 °C - Low conduction loss improves efficiency in low-voltage, high-current paths such as POL converters.
Reverse Recovery Time (trr) 12 ns - Enables high-frequency switching (>1 MHz) with minimal switching loss and EMI generation.
Junction Temperature (Tj) 175 °C - Extended thermal rating allows operation in harsh environments (e.g., automotive under-hood, industrial motor drives) without derating.
Thermal Resistance (Rth(j-sp)) 12 K/W - Low junction-to-solder-point resistance ensures efficient heat transfer to PCB copper, critical for sustained 3 A operation on FR4.
Diode Capacitance (Cd) 360 pF @ 1 V - Low capacitance minimizes AC coupling and ringing in high-speed switching nodes.

Pinout & Package

Encapsulated in a SOD128 (CFP5) plastic surface-mount package measuring 3.8 mm × 2.6 mm × 1.0 mm, with 4 mm lead pitch and flat leads optimized for automated assembly and thermal performance. The cathode is marked by a bar on the device top surface.

Pin/Terminal Circuit Role Design Meaning
1 Cathode (K) Output terminal for forward conduction; connected to PCB thermal pad for heat dissipation and low-inductance return path.
2 Anode (A) Input terminal for forward bias; electrically isolated from thermal pad; defines current entry point in rectification path.

Key Features

Feature Design Value
Integrated guard ring Enhances ESD and surge robustness by controlling electric field distribution at edge termination - critical for reliability in unregulated input stages.
Clip-bonding technology Reduces bond wire inductance and thermal resistance, enabling higher current density and improved thermal cycling endurance vs. wire-bonded equivalents.
Reflow/wave solder compatible Qualified per J-STD-020 and JEDEC J-STD-006 - eliminates process restrictions during high-volume manufacturing.
High-temperature operation Rated for continuous operation at Tj = 175 °C - eliminates need for oversized heatsinking in thermally constrained enclosures.

Applications

Low-Voltage DC-DC Conversion Reverse Polarity Protection

Use Scenario: Secondary-side synchronous rectification in 12 V → 3.3 V/5 V buck converters for FPGA power supplies.

IC Role / Device Role / Timing Role: Schottky rectifier replacing MOSFETs in non-synchronous designs; conducts during low-side switch ON phase.

Use Value: 460 mV VF reduces conduction loss by >30% vs. standard silicon diodes, improving full-load efficiency by ~1.2% at 3 A.

Use Scenario: Input protection for USB-C PD modules and industrial sensors exposed to accidental reverse connection.

IC Role / Device Role / Timing Role: Series-connected cathode-to-load configuration; blocks reverse current while passing forward current with minimal drop.

Use Value: 3 A IF(AV) rating and 12 ns trr prevent latch-up during hot-plug transients; 175 °C Tj ensures survival during overvoltage fault heating.

Switch Mode Power Supply Output High-Temperature Motor Drive Auxiliary Supply

Use Scenario: Output rectification in 24 V/48 V offline SMPS for telecom and server PSUs.

IC Role / Device Role / Timing Role: Freewheeling diode in flyback or forward converter secondary winding; clamps inductive kick and recirculates energy.

Use Value: 60 V VR provides 20% margin above 48 V nominal rails; low Cd (360 pF) suppresses high-frequency ringing at switching edges.

Use Scenario: Auxiliary 12 V supply rectification in IPM-based BLDC motor controllers mounted near heat sinks.

IC Role / Device Role / Timing Role: Bridge rectifier input stage feeding LDO or buck controller; subjected to ambient >105 °C.

Use Value: Guaranteed 3 A conduction at Tamb = 100 °C (FR4, δ = 0.5) per Fig. 11; Rth(j-sp) = 12 K/W enables direct thermal coupling to metal-core PCB.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
Vishay VS-3EYH06-M3/54 Same 60 V VR, 3 A IF(AV), but TO-277 package (larger footprint, higher Rth(j-a) = 45 K/W); VF = 520–590 mV @ 3 A. Less suitable for ultra-thin or high-density layouts; requires larger thermal pad area for equivalent cooling. Select when board-level mechanical clearance permits larger package and lower-cost procurement is prioritized over thermal density.
ON Semiconductor SB360 SOD-123FL package (smaller, 2.7 × 1.7 mm); VR = 60 V, IF(AV) = 3 A, but VF = 550–650 mV @ 3 A and Tj max = 150 °C. Limited to ≤150 °C ambient operation; higher VF increases conduction loss by ~150 mW at 3 A vs. PMEG6030ETPX. Choose only if strict size reduction outweighs thermal and efficiency trade-offs in non-high-temp applications.

Compared with VS-3EYH06-M3/54 and SB360, PMEG6030ETPX uniquely combines SOD128's compactness with 175 °C rating and lowest VF (460 mV typ), making it optimal for thermally dense, high-reliability 48 V systems where thermal resistance and long-term stability are critical.

Availability

PMEG6030ETPX is available at Aetrix Electronics and suitable for low-voltage rectification, high-efficiency DC-DC conversion, switch mode power supply output stages, and reverse polarity protection requiring stable component supply across industrial, computing, and transportation end markets.

Supply support for PMEG6030ETPX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-qualified components.

PMEG6030ETPX belongs to Nexperia's high-temperature Schottky rectifier product line, engineered specifically for efficiency-critical, thermally demanding power conversion in industrial automation, telecom infrastructure, and embedded power systems.

FAQ

What is the maximum allowable solder point temperature during reflow for PMEG6030ETPX?

The device is qualified for standard lead-free reflow per J-STD-020, with peak temperature up to 260 °C for ≤30 seconds. The cathode solder point must not exceed 260 °C to avoid delamination or intermetallic degradation; thermal profile validation using the footprint in Figure 19 is recommended.

How does the guard ring affect surge robustness in PMEG6030ETPX?

The integrated guard ring controls electric field crowding at the die edge, raising the effective avalanche threshold and improving resistance to repetitive surge events (e.g., IEC 61000-4-5). This enables reliable operation in unfiltered 24/48 V inputs without external TVS clamping in many cases.

Can PMEG6030ETPX be used in parallel configurations for higher current?

Yes, but with caution: forward voltage matching (±30 mV) and symmetrical PCB layout (equal trace length/width/thermal mass) are required to ensure current sharing. Derate total IF(AV) by 15% versus sum of individual ratings due to thermal coupling effects on FR4 substrates.

What is the significance of Rth(j-sp) = 12 K/W in practical thermal design?

Rth(j-sp) measures resistance from junction to cathode solder point - not ambient - enabling accurate modeling of heat flow into the PCB copper. With a 1 cm² cathode pad on FR4, this value allows calculation of actual junction temperature rise (ΔTj = Ptot × 12 K/W) independent of board airflow or enclosure conditions.

PMEG6030ETPX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SOD-128
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
60 V
Current - Average Rectified (Io):
3A
Voltage - Forward (Vf) (Max) @ If:
530 mV @ 3 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
12 ns
Current - Reverse Leakage @ Vr:
200 µA @ 60 V
Capacitance @ Vr, F:
360pF @ 1V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOD-128/CFP5
Operating Temperature - Junction:
175°C (Max)

PMEG6030ETPX FAQ

1.How can I place an order for PMEG6030ETPX through Aetrix?

Please submit a Request for Quotation (RFQ) for PMEG6030ETPX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PMEG6030ETPX reliable?

The price and inventory of PMEG6030ETPX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG6030ETPX is usually 5 days.

3.What payment methods are accepted for PMEG6030ETPX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG6030ETPX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PMEG6030ETPX?

PMEG6030ETPX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PMEG6030ETPX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PMEG6030ETPX?

For technical support, including PMEG6030ETPX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG6030ETPX requirements.

6.How does Aetrix verify that PMEG6030ETPX is sourced from the original manufacturer or authorized distributors?

All PMEG6030ETPX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG6030ETPX meets industry standards.

7.What is the process for return or replacement of PMEG6030ETPX?

All PMEG6030ETPX units undergo pre-shipment inspection (PSI). If there is an issue with PMEG6030ETPX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PMEG6030ETPX part is unused and in its original packaging.

Return procedure for PMEG6030ETPX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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