Nexperia USA Inc. PMEG60T10ELXDX

Overview

PMEG60T10ELXDX from Nexperia is a 60 V, 1 A trench Schottky barrier rectifier in CFP2-HP (SOD323HP) surface-mount package, designed for high-efficiency DC-to-DC conversion and freewheeling paths where low forward voltage (570–640 mV at 1 A, 25 °C), ultra-low reverse recovery charge (1.5 nC), and low leakage current (0.08–0.4 µA at 60 V, 25 °C) are critical.

For engineers reviewing the PMEG60T10ELXDX datasheet, PMEG60T10ELXDX pinout, PMEG60T10ELXDX application, or PMEG60T10ELXDX equivalent, this device is selected for OR-ing, reverse polarity protection, and LED lighting power stages requiring fast switching, minimal conduction loss, and thermal robustness via clip-bonded cathode heatsink exposure.

Technical Context

This Schottky rectifier uses trench MOS-based architecture to suppress minority-carrier injection, eliminating reverse recovery tail current and enabling operation up to 20 kHz square-wave duty cycles with δ = 0.5 and T_sp ≤ 172 °C. Its junction-to-solder-point thermal resistance is 6 K/W - enabled by direct clip-bonding of the cathode to an exposed metal pad - making it suitable for thermally constrained PCB layouts.

The device exhibits temperature-stable forward voltage (500–570 mV at 1 A, 125 °C) and controlled reverse leakage (0.12–0.4 mA at 60 V, 125 °C), with diode capacitance dropping from 155 pF at 1 V to 50 pF at 10 V (f = 1 MHz, 25 °C), supporting high-frequency switching node integrity.

Key Specifications

Pinout & Package

Encapsulated in the CFP2-HP (SOD323HP) plastic SMD package, this device features an exposed cathode metal pad for direct thermal anchoring to PCB copper. The package measures 2.2 mm × 1.3 mm × 0.68 mm with gull-wing leads optimized for automated assembly and thermal reliability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with RB055LAM-40TR and SS12, PMEG60T10ELXDX delivers 50% higher voltage rating, 2× lower thermal resistance, and 3× lower Q_rr, making it uniquely suited for compact, high-efficiency 48 V–60 V DC-DC and OR-ing implementations where thermal headroom and switching loss are design-critical.

Availability

PMEG60T10ELXDX is available at Aetrix Electronics and suitable for high-efficiency DC-to-DC conversion, LED lighting drivers, and OR-ing power supplies requiring stable component supply, consistent parametric performance, and long-term manufacturability assurance.

Supply support for PMEG60T10ELXDX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-performance, energy-efficient discrete and logic devices, with leadership in Schottky rectifiers, ESD protection, and automotive-qualified components.

This device belongs to Nexperia's Trench Schottky Rectifier product line, engineered specifically for high-frequency power conversion topologies demanding minimal conduction loss, ultra-fast switching, and superior thermal performance in ultra-compact packages.

FAQ

What is the maximum allowable solder point temperature for continuous operation?

The datasheet specifies that average forward current is rated at T_sp ≤ 172 °C for δ = 0.5, 20 kHz square wave. Exceeding this temperature risks irreversible degradation of the clip bond and accelerated leakage growth. For reliable 1 A DC operation, maintain T_sp ≤ 150 °C using ≥1 cm² cathode copper pour.

Can PMEG60T10ELXDX replace a standard silicon diode in a 24 V buck converter?

Yes - its 60 V V_R provides 150% margin over 24 V nominal input, and 570 mV V_F at 1 A cuts conduction loss by ~65% versus a 1N4007 (1.1 V). However, verify layout thermal relief: the exposed cathode pad must connect to ≥1 cm² copper to sustain full current without exceeding T_j = 175 °C.

Is this device suitable for automotive applications?

No - the datasheet explicitly states "Non-automotive qualified products" and confirms no AEC-Q200 qualification or automotive-specific testing. It lacks guaranteed performance across -40 °C to +125 °C ambient with load-dump immunity per ISO 7637-2, and should not be used in safety-critical or vehicle-mounted systems.

How does the CFP2-HP package improve thermal performance over standard SOD323?

CFP2-HP replaces wire bonding with a copper clip directly attaching the cathode die to the exposed metal pad, reducing R_th(j-sp) from ~30 K/W (typical SOD323) to 6 K/W. This 5× improvement allows 1.2 W power dissipation at 25 °C ambient - double what standard SOD323 can achieve - without forced cooling.