Nexperia USA Inc. PMEG60T20ELPX

Overview

PMEG60T20ELPX from Nexperia is a Trench MEGA Schottky barrier rectifier optimized for low-leakage, high-efficiency DC-to-DC conversion and freewheeling applications. It delivers 2 A average forward current at 60 V reverse voltage, with typ. 550 mV forward voltage at 2 A and 25 °C, and ultra-low reverse leakage of 0.2 µA at 60 V/25 °C - enabling compact, thermally efficient power stages in space-constrained SMD designs.

For engineers reviewing the PMEG60T20ELPX datasheet, PMEG60T20ELPX pinout, PMEG60T20ELPX application, or PMEG60T20ELPX equivalent, this device is selected for low-voltage rectification where low VF, minimal IR, and robust thermal performance under reflow/wave soldering are critical - especially in SMPS secondary-side outputs and reverse polarity protection circuits.

Technical Context

This Schottky rectifier employs Trench MEGA technology to suppress leakage current while maintaining low forward voltage drop across its anode–cathode junction. Its clip-bonded construction enhances thermal conduction from die to cathode tab, supporting 2.8 A continuous forward current and 40 A non-repetitive peak surge capability.

The CFP5 (SOD128) package enables high power density with 12 K/W junction-to-solder-point thermal resistance when mounted on a 1 cm² cathode pad. Its step- and ramp-recovery times (11 ns and 14 ns respectively) confirm fast switching behavior without minority-carrier storage - essential for high-frequency synchronous rectification and freewheeling in >100 kHz converters.

Key Specifications

Pinout & Package

Encapsulated in a CFP5 (SOD128) surface-mount plastic package measuring 3.8 mm × 2.6 mm × 1.0 mm with 4 mm lead pitch and flat, gull-wing leads - optimized for automated placement and both reflow and wave soldering.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SS26 and RB055LAM-40, PMEG60T20ELPX uniquely balances 60 V blocking, sub-600 mV VF, and sub-µA leakage - making it the only option among the three qualified for high-efficiency 24–48 V input SMPS with strict thermal and standby-power constraints.

Availability

PMEG60T20ELPX is available at Aetrix Electronics and suitable for switch mode power supplies, reverse polarity protection circuits, and low-voltage freewheeling applications requiring stable component supply, consistent parametric performance, and long-term production continuity.

Supply support for PMEG60T20ELPX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-grade qualification.

This device belongs to Nexperia's Trench MEGA Schottky rectifier product line - engineered specifically for high-efficiency, low-leakage power conversion in consumer, industrial, and computing power supplies.

FAQ

What is the maximum junction temperature for continuous operation?

The absolute maximum junction temperature is 175 °C, and the device is rated for continuous operation up to this limit when thermal design meets the specified solder point temperature (Tsp ≤ 159 °C for 2 A average current). Derating curves in Figures 8–10 confirm usable current capacity down to ambient temperatures as low as −55 °C.

Can PMEG60T20ELPX be used in automotive applications?

No - this part is explicitly designated as non-automotive qualified per Nexperia's revision history (v.3, April 2023). It lacks AEC-Q101 qualification, automotive-specific testing, and guaranteed PPAP documentation. For automotive use, select the -Q variant (e.g., PMEG60T20ELPX-Q) which undergoes extended temperature cycling, HTOL, and ESD validation.

How does the CFP5 package improve thermal performance over SOD-123?

The CFP5 package uses a clip-bonded cathode structure with direct metal-to-PCB thermal path, achieving 12 K/W junction-to-solder-point resistance - roughly half that of typical SOD-123 Schottky diodes (~22–25 K/W). This allows 2.8 A continuous current handling on FR4 with a 1 cm² cathode pad, versus ~1.5 A for comparable SOD-123 parts.

Is there a recommended PCB footprint for optimal thermal performance?

Yes - Nexperia specifies a 1 cm² copper pad for the cathode terminal (Figure 16), with two 2.1 mm × 1.9 mm solder lands and 2.5 mm × 3.4 mm paste stencil openings. This layout achieves the 12 K/W Rth(j–sp) value cited in Table 6; using smaller pads increases thermal resistance by up to 3× and risks derating beyond datasheet limits.