Nexperia USA Inc. PMEG60T30ELPX

Overview

PMEG60T30ELPX from Nexperia is a 60 V, 3 A Trench Schottky barrier rectifier in CFP5 (SOD128) package, designed for low-leakage, high-efficiency power conversion in space-constrained SMD applications. It delivers 550 mV typical forward voltage at 3 A and 0.3 µA typical reverse leakage at 60 V and 25 °C, enabling high-efficiency DC-DC stages and freewheeling paths in industrial and consumer power supplies.

For engineers reviewing the PMEG60T30ELPX datasheet, PMEG60T30ELPX pinout, PMEG60T30ELPX application, or PMEG60T30ELPX equivalent, key selection criteria include its trench-based Schottky architecture for ultra-low IR, clip-bonded thermal performance, and compatibility with both reflow and wave soldering on FR4 PCBs with standard or enhanced cathode pad layouts.

Technical Context

This device employs trench-structured Schottky junction technology to suppress reverse leakage while maintaining low VF - achieving 0.3–1.8 µA IR at VR = 60 V and Tj = 25 °C, versus >10× higher leakage in planar Schottky diodes. Its clip-bonded construction lowers Rth(j-sp) to 12 K/W, supporting 4.2 A peak forward current and 50 A non-repetitive surge capability.

The CFP5 package features a dual-terminal, flat-lead SMD outline (3.8 mm × 2.6 mm × 1.0 mm) with 4 mm pitch and exposed cathode tab for direct thermal coupling. Pin 1 is cathode (K), Pin 2 is anode (A); polarity is marked "E2" on the top surface per JEDEC-compliant SOD128 footprint.

Key Specifications

Pinout & Package

Encapsulated in CFP5 (SOD128) - a 2-terminal, surface-mounted plastic package measuring 3.8 mm × 2.6 mm × 1.0 mm with 4 mm lead pitch and exposed cathode thermal pad. Designed for automated placement and compatible with IPC-7351B footprint standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-3EY60-M3/54 and NSR3060HT1G, PMEG60T30ELPX offers the lowest IR (0.3 µA) and best thermal performance (12 K/W), making it optimal for battery-backed, high-density, or thermally isolated power rails where leakage and junction temperature must be tightly controlled.

Availability

PMEG60T30ELPX is available at Aetrix Electronics and suitable for switch mode power supplies, reverse polarity protection circuits, and high-efficiency DC-DC converters requiring stable component supply, consistent parametric performance, and long-term manufacturability.

Supply support for PMEG60T30ELPX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors - including logic, discrete, and MOSFETs - serving automotive, industrial, and consumer markets with scalable manufacturing and rigorous quality control.

The PMEG60T30ELPX belongs to Nexperia's Trench Schottky Rectifier product line, engineered specifically for ultra-low-leakage, high-current SMD power conversion in space- and efficiency-critical applications such as USB-C PD, PoE, and industrial SMPS.

FAQ

What is the maximum allowable solder point temperature during reflow for PMEG60T30ELPX?

The device is qualified for JEDEC J-STD-020D reflow profiles with peak temperature up to 260 °C for ≤30 seconds. The solder point (cathode tab) must not exceed 260 °C, and thermal profiling must ensure Tsp remains within 255–260 °C for no more than 10 seconds to avoid delamination or metallization damage.

Can PMEG60T30ELPX replace a standard silicon diode in a 24 V buck converter?

Yes - with significant efficiency gains. At 3 A, its 550 mV VF yields ~1.65 W conduction loss versus ~6.6 W for a 1N5408 (VF ≈ 2.2 V). However, ensure input transient clamping is added, as its 60 V VR provides less margin than 100 V silicon diodes in unregulated inputs.

Is PMEG60T30ELPX automotive-qualified?

No. Per Nexperia's revision history (v.3, Jan 2023), this part is explicitly designated non-automotive. It lacks AEC-Q101 qualification, extended temperature validation beyond 175 °C junction, and automotive-specific reliability testing. Use only in industrial, consumer, or commercial applications.

How does the CFP5 package improve thermal performance over SOD123 or SMA?

The CFP5's clip-bonded cathode tab achieves Rth(j-sp) = 12 K/W - 3× lower than SOD123 (≈35 K/W) and 2.5× lower than SMA (≈30 K/W) - due to direct metal-to-PCB thermal path and larger copper interface area (1 cm² recommended). This allows 3 A continuous current without external heatsinking on standard FR4.