Nexperia USA Inc. PMEG60T30ELRX

Overview

PMEG60T30ELRX from Nexperia is a 60 V, 3 A Trench MEGA Schottky barrier rectifier in CFP3 (SOD123W) package, designed for low-leakage, high-efficiency DC-to-DC conversion and freewheeling in compact power supplies. It delivers VF = 550 mV at IF = 3 A and IR = 0.3 µA at VR = 60 V, enabling reduced conduction loss and thermal stress in space-constrained 5–24 V systems.

For engineers reviewing the PMEG60T30ELRX datasheet, PMEG60T30ELRX pinout, PMEG60T30ELRX application, or PMEG60T30ELRX equivalent, key selection criteria include forward voltage at rated current, reverse leakage at max VR, thermal resistance to solder point (Rth(j-sp) = 18 K/W), junction temperature limit (175 °C), and compatibility with reflow/wave soldering on FR4 PCBs.

Technical Context

This Schottky rectifier uses Trench MEGA technology to achieve ultra-low reverse leakage while maintaining low VF - a trade-off typically unattainable in planar Schottky diodes. Its clip-bonded construction enhances thermal transfer from die to cathode tab, supporting higher average current (IF(AV) = 3 A) under δ = 0.5 square-wave conditions at Tsp ≤ 147 °C.

The device exhibits no minority-carrier storage, resulting in negligible reverse recovery time (trr < 17 ns) and zero Qrr-related switching loss. Its capacitance (Cd = 580 pF at VR = 1 V) and fast step/ramp recovery behavior make it suitable for high-frequency (>200 kHz) synchronous rectification and flyback snubber-free designs.

Key Specifications

Pinout & Package

Encapsulated in CFP3 (SOD123W) - a 2.6 mm × 1.7 mm × 1.0 mm surface-mount plastic package with flat leads optimized for thermal performance and automated assembly. Cathode-side tab provides low-inductance, high-current path and enhanced heat spreading.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-3EY06HM3/H and NSR30CM3T5G, PMEG60T30ELRX uniquely balances 60 V rating, sub-µA leakage, and 18 K/W Rth(j-sp) - making it optimal for thermally dense, wide-input-range DC-DC converters where efficiency, reliability, and board area are jointly constrained.

Availability

PMEG60T30ELRX is available at Aetrix Electronics and suitable for DC-DC converter output rectification, freewheeling in buck regulators, and reverse polarity protection requiring stable component supply, consistent parametric performance, and long-term manufacturability.

Supply support for PMEG60T30ELRX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies - delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

PMEG60T30ELRX belongs to Nexperia's Trench MEGA Schottky rectifier product line, engineered specifically for high-efficiency, low-profile power conversion in space- and thermal-constrained applications such as telecom power supplies and portable medical devices.

FAQ

Is PMEG60T30ELRX qualified for automotive applications?

No. Per Nexperia's revision history, this part was explicitly changed to non-automotive status in v.3 (2023). It lacks AEC-Q101 qualification, automotive-grade screening, and guaranteed PPAP documentation. For automotive use, select the -Q qualified variant (e.g., PMEG60T30ELRX-Q) or consult Nexperia's automotive portfolio.

What is the recommended PCB footprint for reflow soldering?

The official reflow footprint specifies 1.1 mm × 1.1 mm anode pad, 1.2 mm × 1.4 mm cathode pad, 0.1 mm stencil thickness, and 1.6 mm × 2.1 mm overall solder land area. This layout ensures optimal thermal transfer to the cathode tab and avoids solder bridging during 260 °C peak reflow profiles.

How does clip bonding improve thermal performance over wire bonding?

Clip bonding replaces aluminum wires with a direct copper strap between die and leadframe, reducing interfacial thermal resistance by ~40%. Measured Rth(j-sp) = 18 K/W confirms this - enabling 3 A average current at Tsp = 147 °C, whereas comparable wire-bonded SOD123W parts typically max out at ~2.2 A under identical conditions.

Can PMEG60T30ELRX replace a standard SMA-packaged Schottky in existing designs?

Yes, with layout adaptation. While both are 2-terminal Schottky rectifiers, CFP3 (SOD123W) has 40% smaller footprint and 0.6 mm lower height than SMA. The cathode tab requires dedicated thermal pad routing, and the anode pad is offset - so direct drop-in replacement is not possible without footprint revision and thermal validation.