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Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

Taiwan Semiconductor Corporation PU1BM

Name: PU1BM
Brand: Taiwan Semiconductor Corporation
SKU: PU1BM
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PU1BM

Manufacturer:: Taiwan Semiconductor Corporation

Category:: Single Diodes

Package:: 2-SMD, Flat Leads

Datasheet:: PU1BM.pdf

Description:: 25NS, 1A, 100V, ULTRA FAST RECOV

Quantity:: RFQ Add To RFQ list

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Inventory:12,000

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Product details

Overview

PU1BM from Taiwan Semiconductor is a 1A, 100V ultra-fast surface-mount rectifier diode in Micro SMA package, featuring 25 ns reverse recovery time, 0.90 V forward voltage at 1.0 A/25°C, and 28 A surge current capability - deployed in DC-DC converters and freewheeling paths.

For engineers reviewing the PU1BM datasheet, PU1BM pinout, PU1BM application, or PU1BM equivalent, key selection criteria include repetitive peak reverse voltage (100 V), thermal resistance (R_θJL = 28 °C/W), junction temperature range (–55 to +175 °C), and RoHS/halogen-free compliance for high-reliability power conversion designs.

Technical Context

The PU1BM employs planar silicon technology optimized for fast switching in high-frequency SMPS topologies. Its single-die configuration supports unidirectional conduction with cathode-band polarity marking and achieves sub-30 ns trr under IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A test conditions.

Thermal performance is characterized on a 5 mm × 5 mm copper pad PCB: R_θJA = 60 °C/W, R_θJC = 34 °C/W, enabling sustained 1 A average forward current up to 125 °C ambient when properly heatsinked via lead termination.

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	100 V - maximum repetitive reverse blocking voltage; defines safe operating limit in flyback/freewheeling clamp circuits
I_F	1 A - continuous average forward current rating at T_A = 25 °C; derates linearly above 25 °C per Fig.1
t_rr	24–25 ns - ultra-fast recovery enables >100 kHz switching without excessive switching loss or ringing
V_F @ 1 A, 25°C	0.90 V (max) - low conduction loss improves efficiency in low-voltage output stages
I_FSM (8.3 ms)	28 A - short-duration surge withstand capability for inrush and fault transients
R_θJL	28 °C/W - low junction-to-lead thermal resistance supports direct PCB copper pad heat extraction
Junction Temp Range	–55 to +175 °C - wide operating range suitable for automotive under-hood and industrial ambient environments

Pinout & Package

Package: Micro SMA - surface-mount plastic package with matte tin-plated leads, UL 94V-0 molding compound, moisture sensitivity level 1, and cathode band polarity indicator.

Pin/Terminal	Circuit Role	Design Meaning
Anode	Forward current entry node	Connected to lower-potential side (e.g., switch node in buck freewheel path); no internal marking
Cathode	Forward current exit node / reverse blocking terminal	Identified by molded cathode band; connects to higher-potential rail (e.g., output capacitor positive)

Key Features

Feature	Design Value
Ultra-fast recovery (t_rr ≤ 25 ns)	Minimizes reverse recovery charge (Q_rr = 40 nC) and associated switching losses in high-frequency converters
Low I_R (≤ 1 µA @ 25°C)	Reduces standby power loss in offline adapters and battery-backed systems
Planar die construction	Ensures consistent parameter distribution and high reliability under thermal cycling stress
RoHS & halogen-free compliance	Meets IEC 61249-2-21 and global environmental directives for industrial and consumer end equipment

Applications

Buck Converter Freewheeling Diode	Boost PFC Input Rectifier
Use Scenario: Used as the low-side freewheeling diode in non-synchronous buck regulators powering FPGA core rails. IC Role / Device Role / Timing Role: Unidirectional current path during high-side MOSFET off-time; conducts stored inductor energy to output capacitor. Use Value: 25 ns t_rr prevents cross-conduction loss and reduces EMI generation during transition edges.	Use Scenario: Rectifies AC input in active PFC boost front-end stages operating at 65–133 kHz. IC Role / Device Role / Timing Role: High-speed AC-to-DC conversion with minimal reverse recovery tail current. Use Value: Q_rr = 40 nC and low I_R maintain high PF correction accuracy and reduce thermal stress on boost diode.
Inverter Bridge Anti-Parallel Diode	DC-DC Isolated Flyback Clamp
Use Scenario: Integrated as anti-parallel diode across IGBTs in motor drive half-bridge inverters. IC Role / Device Role / Timing Role: Provides controlled commutation path during IGBT turn-off and regenerative braking. Use Value: 175 °C max junction temperature and 28 A I_FSM support transient overloads without thermal runaway.	Use Scenario: Clamps transformer leakage inductance energy in flyback converters with 100 V output rails. IC Role / Device Role / Timing Role: Fast clamping device absorbing spike energy during primary switch turn-off. Use Value: 100 V V_RRM margin accommodates reflected voltage spikes while maintaining low V_F conduction loss.

Buck Converter Freewheeling Diode

Boost PFC Input Rectifier

Use Scenario: Used as the low-side freewheeling diode in non-synchronous buck regulators powering FPGA core rails.

IC Role / Device Role / Timing Role: Unidirectional current path during high-side MOSFET off-time; conducts stored inductor energy to output capacitor.

Use Value: 25 ns t_rr prevents cross-conduction loss and reduces EMI generation during transition edges.

Use Scenario: Rectifies AC input in active PFC boost front-end stages operating at 65–133 kHz.

IC Role / Device Role / Timing Role: High-speed AC-to-DC conversion with minimal reverse recovery tail current.

Use Value: Q_rr = 40 nC and low I_R maintain high PF correction accuracy and reduce thermal stress on boost diode.

Inverter Bridge Anti-Parallel Diode

DC-DC Isolated Flyback Clamp

Use Scenario: Integrated as anti-parallel diode across IGBTs in motor drive half-bridge inverters.

IC Role / Device Role / Timing Role: Provides controlled commutation path during IGBT turn-off and regenerative braking.

Use Value: 175 °C max junction temperature and 28 A I_FSM support transient overloads without thermal runaway.

Use Scenario: Clamps transformer leakage inductance energy in flyback converters with 100 V output rails.

IC Role / Device Role / Timing Role: Fast clamping device absorbing spike energy during primary switch turn-off.

Use Value: 100 V V_RRM margin accommodates reflected voltage spikes while maintaining low V_F conduction loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-fast rectifier applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STTH1R06	V_RRM = 600 V, t_rr = 35 ns, I_F = 1 A, DO-214AC package	Higher voltage rating but slower recovery; less efficient in <100 kHz designs	Select when system requires >100 V reverse standoff with moderate speed trade-off
ES1B	V_RRM = 100 V, t_rr = 35 ns, I_F = 1 A, SMA package (larger footprint)	Same voltage rating but 10 ns slower recovery; higher R_θJA due to standard SMA	Choose if board layout allows larger SMA and thermal budget permits higher loss

Compared with STTH1R06 and ES1B, the PU1BM delivers superior high-frequency efficiency via its 24–25 ns t_rr and lower R_θJL, making it optimal for compact, thermally constrained 100 V SMPS where switching loss and thermal management are critical.

Availability

PU1BM is available at Aetrix Electronics and suitable for DC-DC converters, switching mode inverters, and freewheeling applications requiring stable component supply, consistent parametric performance, and RoHS-compliant sourcing.

Supply support for PU1BM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global power management and industrial markets since 1979.

The PU1BM belongs to TSC's ultra-fast rectifier product line, engineered specifically for high-efficiency, high-frequency switching power supplies where low Q_rr, tight V_F tolerance, and robust thermal performance are essential.

FAQ

What is the maximum repetitive peak reverse voltage rating for PU1BM?

The PU1BM has a maximum repetitive peak reverse voltage (V_RRM) of 100 V, verified per absolute maximum ratings table in the official Taiwan Semiconductor datasheet revision B2103. This rating defines the highest reverse-biased voltage the device can block repeatedly without breakdown under normal operating conditions. Exceeding 100 V risks avalanche failure or premature degradation. The PU1BM is not rated for 200 V operation - that specification applies only to the PU1DM variant.

Does PU1BM have a specified reverse recovery time, and under what test conditions?

Yes, PU1BM specifies reverse recovery time (t_rr) as 24 ns (typical) and 25 ns (maximum). These values are measured under two distinct conditions: (1) IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A; and (2) IF = 1.0 A, di/dt = 50 A/µs, VR = 30 V. Both test configurations confirm its classification as an ultra-fast rectifier suitable for >100 kHz switching applications.

What is the forward voltage drop of PU1BM at full rated current and room temperature?

The forward voltage drop (V_F) of PU1BM is 0.90 V maximum at I_F = 1.0 A and T_J = 25 °C, per electrical specifications table. At the same current and elevated junction temperature (125 °C), V_F drops to 0.76 V (max), reflecting the negative temperature coefficient of silicon diodes. This low V_F contributes directly to reduced conduction loss in high-current power stages.

Is PU1BM compatible with lead-free reflow soldering processes?

Yes, PU1BM is fully compatible with lead-free reflow soldering. Its matte tin-plated leads meet J-STD-002 solderability requirements, and the Micro SMA package is rated for moisture sensitivity level 1 (MSL-1) per J-STD-020 - meaning it may be stored indefinitely at ≤30 °C/60% RH without baking prior to assembly. No special handling or pre-bake is required before standard Pb-free reflow profiles.

What thermal resistance values are specified for PU1BM, and how are they measured?

PU1BM specifies R_θJL = 28 °C/W (junction-to-lead), R_θJC = 34 °C/W (junction-to-case), and R_θJA = 60 °C/W (junction-to-ambient). All values are measured with the device mounted on a standardized 5 mm × 5 mm copper pad PCB, per JEDEC test methodology. R_θJA reflects natural convection cooling; forced airflow or additional copper area will improve actual thermal performance in end-use layouts.

PU1BM Specifications

Product attributes: Attribute value

Manufacturer:: Taiwan Semiconductor Corporation

Series:: -

Package/Case:: 2-SMD, Flat Leads

Packaging:: Tape & Reel (TR)

Product Status:: Active

Technology:: Standard

Voltage - DC Reverse (Vr) (Max):: 100 V

Current - Average Rectified (Io):: 1A

Voltage - Forward (Vf) (Max) @ If:: 1.05 V @ 1 A

Speed:: Fast Recovery =< 500ns, > 200mA (Io)

Reverse Recovery Time (trr):: 24 ns

Current - Reverse Leakage @ Vr:: 1 µA @ 100 V

Capacitance @ Vr, F:: 18pF @ 4V, 1MHz

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: Micro SMA

Operating Temperature - Junction:: -55°C ~ 175°C

PU1BM FAQ

1.How can I place an order for PU1BM through Aetrix?

Please submit a Request for Quotation (RFQ) for PU1BM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PU1BM reliable?

The price and inventory of PU1BM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PU1BM is usually 5 days.

3.What payment methods are accepted for PU1BM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PU1BM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PU1BM?

PU1BM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PU1BM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PU1BM?

For technical support, including PU1BM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PU1BM requirements.

6.How does Aetrix verify that PU1BM is sourced from the original manufacturer or authorized distributors?

All PU1BM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PU1BM meets industry standards.

7.What is the process for return or replacement of PU1BM?

All PU1BM units undergo pre-shipment inspection (PSI). If there is an issue with PU1BM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PU1BM part is unused and in its original packaging.

Return procedure for PU1BM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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