Nexperia USA Inc. PUMX2,115

Overview

PUMX2 from Nexperia is an NPN/NPN general-purpose double transistor in a SOT363-3 (SC-88/TSSOP6) package, rated for 50 V V_CEO, 150 mA I_C, and DC current gain (h_FE) of 120–560 per transistor; used in compact dual-switching or amplification stages in automotive body control modules and portable power management circuits.

For engineers reviewing the PUMX2 datasheet, PUMX2 pinout, PUMX2 application, or PUMX2 equivalent, key selection criteria include dual-transistor integration in ultra-small SMD footprint, AEC-Q101 qualification, guaranteed h_FE spread, thermal resistance (R_th(j-a) = 417 K/W per device), and discrete-level reliability in space-constrained designs.

Technical Context

This dual NPN transistor integrates two electrically isolated transistors sharing a single 6-pin TSSOP6 plastic package. Each transistor supports independent switching or linear amplification with verified V_CEO = 50 V, I_C = 150 mA, and f_T = 100 MHz at 12 V/2 mA.

Thermal performance is specified for FR4 PCB mounting: total device P_tot = 300 mW at T_amb ≤ 25 °C, with R_th(j-a) = 417 K/W - enabling stable operation in ambient temperatures from –65 °C to +150 °C.

Key Specifications

Pinout & Package

SOT363-3 (TSSOP6) plastic surface-mounted package: 1.35 mm × 2.2 mm footprint, 0.65 mm pitch, 0.95 mm max height, 6-lead gull-wing configuration with pin 1 index marker.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual NPN transistor applications.

Compared with BC846BPDW1T1G and MBT3904DW1T1G, PUMX2 provides broader h_FE coverage, higher V_CEO, and mandatory AEC-Q101 compliance - making it the only option qualified for automotive body electronics without derating or additional validation.

Availability

PUMX2 is available at Aetrix Electronics and suitable for automotive body control modules, portable LED driver circuits, industrial sensor interfaces, and consumer appliance fan controllers requiring stable component supply and long-term lifecycle support.

Supply support for PUMX2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete, logic, and MOSFET devices.

PUMX2 belongs to Nexperia's AEC-Q101-qualified general-purpose bipolar transistor family, engineered for space-constrained automotive and industrial switching and amplification where dual-device integration improves reliability and reduces assembly cost.

FAQ

Is PUMX2 pin-compatible with BC846BPDW1T1G?

Yes - both use identical SOT363-3 (TSSOP6) package with matching pin 1 indexing and pinout: E1-E2-B2-C2-B1-C1. However, PUMX2 offers wider h_FE (120–560 vs. 200–450) and AEC-Q101 qualification, while BC846BPDW1T1G lacks automotive qualification and has lower V_CEO (45 V).

What is the maximum allowable PCB temperature rise when operating PUMX2 at 150 mA per transistor?

At I_C = 150 mA and V_CE = 1 V (typical mid-switching), power dissipation per transistor is ~150 mW. With R_th(j-a) = 417 K/W for the full device, junction temperature rise is ~62.6 K above ambient. For T_j ≤ 150 °C, maximum ambient must be ≤ 87 °C on standard FR4.

Can PUMX2 be used in linear amplifier configurations?

Yes - its guaranteed h_FE range (120–560), low V_CE(sat) (≤250 mV), and f_T = 100 MHz support Class-A and Class-AB small-signal amplification. Bias networks must ensure I_C stays within 1–50 mA for optimal linearity and thermal stability.

Does PUMX2 require special PCB layout considerations for thermal management?

Yes - although rated for 300 mW total device dissipation, its 417 K/W R_th(j-a) assumes standard FR4 with tin-plated copper. To maintain T_j < 125 °C at full load, add ≥2 cm² of 1-oz copper pour connected to pins 1, 2, 4, and 6 via multiple vias, and avoid enclosing the package under shielding cans.