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Nexperia USA Inc. PUSB3CB4Z
- Part No.:
- PUSB3CB4Z
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-XFDFN
- Datasheet:
-
PUSB3CB4Z.pdf
- Description:
- PUSB3CB4/SOT1176/XSON10
- Quantity:
- Payment:
- Shipping:
Inventory:3,092
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Product details
Overview
PUSB3CB4 from Nexperia is an extremely low capacitance (0.19 pF typical), bidirectional ESD protection diode array in a DFN2510A-10 (SOT1176) package, designed to protect four high-speed signal lines-such as USB3.2 Gen2 and HDMI2.1 differential pairs-against ±15 kV IEC 61000-4-2 ESD events while maintaining signal integrity up to 10 Gbit/s.
For engineers reviewing the PUSB3CB4 datasheet, PUSB3CB4 pinout, PUSB3CB4 application, or PUSB3CB4 equivalent, this device is selected for ultra-low-capacitance transient suppression on high-data-rate interfaces where clamping voltage (5.4 V at 6.5 A), reverse standoff voltage (±3.3 V), and dynamic resistance (0.34 Ω) directly impact eye diagram margin and system-level ESD robustness.
Technical Context
The PUSB3CB4 implements a snap-back clamping structure with negative dynamic resistance, enabling rapid transition into low-impedance conduction during ESD transients to limit voltage overshoot across protected lines. Its bidirectional architecture supports AC-coupled, differential signaling without polarity constraints.
It is characterized for IEC 61000-4-2 (±15 kV contact/air), IEC 61000-4-4 (40 A EFT), and IEC 61000-4-5 (8.2 A surge), with clamping verified under 8/20 µs and TLP waveforms. The device operates over –40 °C to +125 °C ambient and features two ground pins (pins 3 and 8) for low-inductance return paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | ±3.3 V reverse standoff voltage - ensures no leakage or conduction during normal 3.3 V signal operation |
| Cd | 0.19 pF typical diode capacitance at 1.5 V - preserves signal integrity on 10 Gbit/s USB3.2/HDMI2.1 links |
| VCL | 5.4 V clamping voltage at 6.5 A (8/20 µs) - limits transient overvoltage seen by downstream PHY |
| ESD Rating | ±15 kV per IEC 61000-4-2 - meets industrial and consumer end-equipment immunity requirements |
| IPP | 8.2 A peak pulse current (IEC 61000-4-5) - withstands surge events on exposed connectors |
| Rdyn | 0.34 Ω dynamic resistance - minimizes voltage drop during high-current ESD discharge |
Pinout & Package
DFN2510A-10 (SOT1176-2) ultra-thin surface-mount package: 1.0 mm × 2.5 mm × 0.5 mm body, leadless, 10-terminal layout with exposed thermal pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection channel for first bidirectional signal line (e.g., USB3.2 TX+/RX+) |
| 2 | CH2 | ESD protection channel for second bidirectional signal line (e.g., USB3.2 TX−/RX−) |
| 3 | GND | Primary low-inductance ground return path for CH1–CH2 clamping current |
| 4 | CH3 | ESD protection channel for third bidirectional signal line (e.g., HDMI2.1 TMDS0+) |
| 5 | CH4 | ESD protection channel for fourth bidirectional signal line (e.g., HDMI2.1 TMDS0−) |
| 6, 7, 9, 10 | n.c. | No internal connection - must remain unconnected in PCB layout |
| 8 | GND | Secondary ground terminal - used with pin 3 to reduce loop inductance for CH3–CH4 |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables protection of AC-coupled differential pairs without polarity assignment or DC bias dependency |
| Snap-back dynamic behavior | Reduces clamping voltage to 5.4 V under 6.5 A surge by entering low-resistance state post-breakdown |
| Dual-GND configuration | Minimizes transient ground bounce and improves common-mode rejection across four channels |
| Ultra-low 0.19 pF capacitance | Prevents signal degradation on 10 Gbit/s interfaces - validated via USB3.2 eye diagram testing |
Applications
| USB3.2 Gen2 Interface Protection | HDMI2.1 TMDS Channel Protection |
|---|---|
|
Use Scenario: Protecting SuperSpeed USB differential pairs (TX/RX) on laptop docking stations and external SSD enclosures. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed immediately before the USB3.2 controller PHY, operating transparently during 10 Gbit/s data transmission. Use Value: Maintains >80% eye opening in USB3.2 compliance testing while surviving ±15 kV contact ESD pulses at the connector. |
Use Scenario: Shielding HDMI2.1 TMDS lanes (up to 48 Gbit/s aggregate) in AV receivers and gaming monitors. IC Role / Device Role / Timing Role: Four-channel ESD suppressor mounted adjacent to HDMI receptacle, handling bidirectional AC-coupled video signals. Use Value: Enables full-bandwidth HDMI2.1 operation without measurable jitter increase or insertion loss penalty (≤0.1 dB @ 12 GHz). |
| 5G Smartphone Front-End Protection | High-Speed Industrial Camera Link |
|
Use Scenario: Guarding MIPI D-PHY or USB-C alternate mode lanes in compact smartphone PCBs with tight layout constraints. IC Role / Device Role / Timing Role: Ultra-small-footprint ESD array co-located with USB-C connector, protecting both CC and high-speed data lanes. Use Value: Achieves IEC 61000-4-2 Level 4 compliance in <1.5 mm² board area while adding <0.02 UI jitter to 2.5 Gbps signals. |
Use Scenario: Securing CoaXPress or SLVS-EC serial links in machine vision cameras exposed to factory ESD environments. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor on coaxial or differential camera sensor interface traces. Use Value: Prevents latch-up or damage in image sensor ICs during handling or cable hot-plug events, with <5.4 V clamping limiting stress on 3.3 V I/O cells. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD7L5.0DT5G | Single-channel, 0.35 pF capacitance, ±5.0 V VRWM | Requires four discrete devices for quad-line protection; higher capacitance degrades 10 Gbit/s eye margin | Use only when board space allows discrete placement and data rate ≤5 Gbit/s |
| Texas Instruments TPD4E001DRYR | Quad-channel, 0.6 pF typical capacitance, ±3.3 V VRWM | Higher capacitance increases insertion loss above 3 GHz; not validated for USB3.2 Gen2 eye compliance | Select only for cost-sensitive designs with <6 Gbit/s data rates and relaxed ESD margin requirements |
Compared with ESD7L5.0DT5G and TPD4E001DRYR, PUSB3CB4 delivers superior high-speed performance through its 0.19 pF capacitance and snap-back clamping, enabling direct integration into 10 Gbit/s USB3.2 and HDMI2.1 layouts without signal conditioning or layout compensation.
Availability
PUSB3CB4 is available at Aetrix Electronics and suitable for USB3.2 Gen2 interface protection, HDMI2.1 TMDS lane safeguarding, and high-speed MIPI/SLVS-EC camera link designs requiring stable component supply and guaranteed long-term manufacturability.
Supply support for PUSB3CB4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and ESD protection solutions, with manufacturing rooted in process technology leadership and automotive-grade quality systems.
PUSB3CB4 belongs to the TrEOS family of ultra-low-capacitance ESD protection devices, engineered specifically for next-generation high-speed digital interfaces where signal fidelity and transient immunity must coexist.
FAQ
What is the maximum data rate supported by PUSB3CB4 without signal degradation?
PUSB3CB4 is validated for 10 Gbit/s operation, as confirmed by USB3.2 Gen2 eye diagram testing (Fig. 4 and Fig. 5 in the datasheet). Its 0.19 pF typical capacitance and optimized layout minimize insertion loss and jitter, preserving >80% eye opening at full bandwidth. No equalization or pre-emphasis compensation is required in compliant PCB implementations.
Can PUSB3CB4 be used on single-ended 3.3 V I/O lines like GPIO or UART?
Yes - PUSB3CB4 supports bidirectional protection on any 3.3 V nominal signal line. Its ±3.3 V VRWM and snap-back clamping ensure compatibility with standard CMOS I/O, but its ultra-low capacitance offers no advantage over lower-cost alternatives for sub-100 Mbps signals. Use is justified only when layout density or multi-line integration benefits outweigh cost.
Why does PUSB3CB4 have two GND pins (pins 3 and 8)?
Pins 3 and 8 provide separate low-inductance ground return paths for CH1–CH2 and CH3–CH4, respectively. This dual-GND architecture reduces shared impedance and minimizes ground bounce during simultaneous multi-line ESD events. PCB layout must connect both pins directly to a solid ground plane using short, wide traces and multiple vias.
Is PUSB3CB4 qualified for automotive applications?
No - PUSB3CB4 is not AEC-Q200 qualified and lacks automotive-specific reliability testing or temperature range extension beyond –40 °C to +125 °C. Nexperia explicitly states in the legal disclaimers that non-automotive qualified products are unsuitable for safety-critical or life-support systems. For automotive use, consult Nexperia's dedicated automotive-grade ESD portfolio.
PUSB3CB4Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 2
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 5.4V (Typ)
- Current - Peak Pulse (10/1000µs):
- 6.5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- HDMI, Telecom, USB
- Capacitance @ Frequency:
- 0.19pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN2510A-10
PUSB3CB4Z FAQ
1.How can I place an order for PUSB3CB4Z through Aetrix?
Please submit a Request for Quotation (RFQ) for PUSB3CB4Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PUSB3CB4Z reliable?
The price and inventory of PUSB3CB4Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PUSB3CB4Z is usually 5 days.
3.What payment methods are accepted for PUSB3CB4Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PUSB3CB4Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PUSB3CB4Z?
PUSB3CB4Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PUSB3CB4Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PUSB3CB4Z?
For technical support, including PUSB3CB4Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PUSB3CB4Z requirements.
6.How does Aetrix verify that PUSB3CB4Z is sourced from the original manufacturer or authorized distributors?
All PUSB3CB4Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PUSB3CB4Z meets industry standards.
7.What is the process for return or replacement of PUSB3CB4Z?
All PUSB3CB4Z units undergo pre-shipment inspection (PSI). If there is an issue with PUSB3CB4Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PUSB3CB4Z part is unused and in its original packaging.
Return procedure for PUSB3CB4Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PUSB3CB4Z Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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