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Renesas R2J20657NP#G3

Part No.:
R2J20657NP#G3
Manufacturer:
Renesas
Category:
Gate Drivers
Package:
40-WFQFN Exposed Pad
Datasheet:
AetrixR2J20657NP#G3.pdf
Description:
HALF BRIDGE BASED MOSFET DRIVER
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,500

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Product details

Overview

R2J20657NP#G3 from Renesas Electronics is an integrated DrMOS power stage combining high-side and low-side MOS FETs with a matched gate driver in a single QFN40 package. It delivers up to 40 A average output current, supports >1 MHz switching, operates with VIN up to 20 V, and integrates thermal warning (115°C) and shutdown (150°C) for desktop/server CPU VRMs.

For engineers reviewing the R2J20657NP#G3 datasheet, R2J20657NP#G3 pinout, R2J20657NP#G3 application, or R2J20657NP#G3 equivalent, this device requires attention to its tri-state PWM input behavior, dual thermal protection thresholds, bootstrapped high-side drive, and LSDBL#-enabled DCM operation - all critical for high-efficiency, high-density buck converter design.

Technical Context

The R2J20657NP#G3 implements a synchronous buck topology with tightly coupled high-side and low-side MOS FETs and an on-die driver optimized per Intel 6×6 DrMOS specification. Its timing control minimizes shoot-through risk while enabling fast transitions at >1 MHz frequencies.

It features dual-supply operation: VCIN accepts either 4.5–5.5 V (tied to Reg5V) or 8–22 V, with UVLO thresholds at 7.4 V (enable) and 7.0 V (disable). The built-in 5 V regulator (Reg5V) supplies logic and bias, with ±10 mV line/load regulation and 4.95–5.45 V output.

Key Specifications

Parameter Value and Actual Design Meaning
Average Output Current40 A max - supports high-current CPU core rails in desktop/server platforms
Input Voltage Range (VIN)4.5–16 V DC - compatible with standard 12 V input bus with margin
Switching Frequency>1 MHz - enables compact magnetics and high transient response in VRMs
Thermal Warning Threshold115°C (typ.) - open-drain THWN signal alerts system controller before shutdown
Thermal Shutdown Threshold150°C - latched-off protection disables GH/GL and pulls DISBL# low
PWM Input Compatibility3.3 V or 5 V TTL-level with 1.4–2.0 V tri-state window - supports common controller interfaces
PackageQFN40 (6 mm × 6 mm × 0.95 mm) - thermally enhanced, lead-free/halogen-free surface-mount module

Pinout & Package

Package: QFN40 (6 mm × 6 mm × 0.95 mm), exposed thermal pad (PGND-connected), RoHS-compliant, halogen-free.

Pin/Terminal Circuit Role Design Meaning
LSDBL# (1)Low-side disable controlActive-low input enabling Discontinuous Conduction Mode (DCM); internally pulled up to Reg5V
Reg5V (2)5 V regulator outputStable +5 V supply for external logic; requires ≥0.1 μF ceramic capacitor to CGND
VCIN (3)Driver supply inputAccepts 4.5–5.5 V (tied to Reg5V) or 8–22 V; powers internal logic and UVLO circuitry
BOOT (4)Bootstrap supply nodeInternally switched +5 V source for high-side gate drive; connects to external bootstrap capacitor
CGND (5, 37, Pad)Control ground referenceLogic ground plane; must be externally connected to PGND for noise immunity and regulation stability
GH (6)High-side gate driver outputMonitored signal for high-side MOS FET gate; used for layout verification and fault analysis
VIN (8–14, Pad)Main power inputConnects to 12 V rail; multiple pins and thermal pad reduce IR drop and improve thermal conduction
VSWH (7, 15, 29–35, Pad)Switch nodePhase output connecting high-side drain to low-side drain; high di/dt node requiring tight loop layout
PGND (16–28)Power ground returnLow-impedance path for high-current switching return; multiple pins and thermal pad minimize voltage bounce
GL (36)Low-side gate driver outputMonitored signal for low-side MOS FET gate; used for timing validation and gate drive integrity checks
THWN (38)Thermal warning indicatorOpen-drain output asserted low when die temperature exceeds 115°C; requires external pull-up resistor
DISBL# (39)Global disable controlActive-low shutdown input; also driven low internally during thermal shutdown to notify controller
PWM (40)PWM logic inputTTL-compatible input accepting 3.3 V/5 V signals; includes 150 ns hold-off for tri-state detection

Key Features

Feature Design Value
Integrated DrMOS architectureCo-located high-side/low-side MOS FETs + driver in one QFN40 package reduce parasitic inductance and layout complexity
Intel 6×6 DrMOS complianceMeets mechanical, electrical, and thermal requirements for standardized server/desktop VRM modules
Built-in bootstrap switchEliminates need for external Schottky diode in high-side gate drive path, reducing BOM count and footprint
DCM support via LSDBL#Enables discontinuous conduction mode for light-load efficiency improvement without controller modification
Dual thermal protectionNon-latching thermal warning (115°C) and latched thermal shutdown (150°C) provide layered system safety
Tri-state PWM inputAutomatically disables both gates when PWM signal floats in 1.4–2.0 V hysteresis window, preventing undefined states

Applications

Desktop CPU VRM Server Processor Power Delivery

Use Scenario: Primary 1.3 V core power stage for Intel LGA115x/AM4 desktop CPUs with multi-phase interleaving.

IC Role / Device Role / Timing Role: Synchronous buck power stage delivering up to 40 A per phase; handles high di/dt switching at >1 MHz with minimal dead-time loss.

Use Value: Enables compact, high-efficiency VRM designs meeting Intel VRD specifications while simplifying thermal management via integrated THWN/THDN.

Use Scenario: Single-phase or multiphase core rail in dual-socket Xeon server motherboards requiring stable 1.0–1.8 V at >30 A.

IC Role / Device Role / Timing Role: High-current DrMOS stage interfacing directly with digital PWM controllers (e.g., ISL63xx, IR35xx) via TTL-level PWM and DISBL#.

Use Value: Reduces PCB area and layout sensitivity versus discrete MOS+driver solutions, while supporting dynamic DCM for idle power optimization.

Workstation GPU Core Supply High-Performance FPGA Core Rail

Use Scenario: Core voltage regulation for NVIDIA RTX-class GPUs where transient response and thermal headroom are critical.

IC Role / Device Role / Timing Role: Fast-switching power stage handling rapid load steps up to 25 A/μs; leverages low-inductance QFN40 package for clean VSWH edges.

Use Value: Achieves <1% output voltage deviation under 20 A step load due to minimized gate drive loop inductance and integrated driver timing.

Use Scenario: 1.2 V core supply for Xilinx Versal or Intel Stratix 10 FPGAs with dynamic partial reconfiguration and variable power states.

IC Role / Device Role / Timing Role: Programmable power stage supporting adaptive voltage scaling (AVS) via PWM frequency and duty-cycle modulation.

Use Value: Enables precise voltage control down to ±10 mV with integrated Reg5V reference and thermal derating feedback via THWN.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DrMOS power stage applications.

Alternative Part Technical Difference Application Difference Selection Advice
IR35203MTRPBF40 A rated, 30 V VIN max, integrated current sense, no LSDBL# pinLacks DCM enable; requires external current sensing for telemetryPreferred when real-time current monitoring is required and DCM is not needed
MP86957GQZ-1040 A rated, 16 V VIN max, 500 kHz–1.5 MHz programmable frequency, no THWN pinNo thermal warning output; relies on controller-based thermal managementPreferred for cost-sensitive designs where full thermal telemetry is handled externally

Compared with IR35203MTRPBF and MP86957GQZ-10, the R2J20657NP#G3 uniquely combines LSDBL#-enabled DCM, open-drain THWN signaling, and Intel 6×6 mechanical compliance - making it optimal for high-reliability desktop/server VRMs requiring autonomous light-load efficiency and early thermal intervention.

Availability

R2J20657NP#G3 is available at Aetrix Electronics and suitable for desktop CPU VRMs, server processor power delivery, workstation GPU core supplies, and high-performance FPGA core rails requiring stable component supply, thermal-aware operation, and high-frequency synchronous buck conversion.

Supply support for R2J20657NP#G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and computing markets.

The R2J20657NP#G3 belongs to Renesas' DrMOS product line, engineered specifically for high-efficiency, high-density voltage regulator modules in desktop and server platforms compliant with Intel VRD specifications.

FAQ

What is the maximum safe operating frequency for R2J20657NP#G3?

The R2J20657NP#G3 supports high-frequency operation above 1 MHz, as confirmed in its datasheet features and typical application circuits. At 1 MHz with 12 V input and 1.3 V output, it maintains efficient thermal performance within its Safe Operating Area. Designers should verify gate drive strength and PCB layout integrity when operating near 1.2 MHz to avoid excessive switching losses.

How does the LSDBL# pin function in R2J20657NP#G3?

The LSDBL# pin on R2J20657NP#G3 is an active-low input that disables the low-side MOS FET gate drive (GL) to enable Discontinuous Conduction Mode (DCM). When asserted low, it forces GL low while GH remains controlled by PWM, allowing inductor current to fall to zero - improving light-load efficiency. The pin is internally pulled up to Reg5V with a 160 kΩ resistor.

Does R2J20657NP#G3 require an external bootstrap diode?

No, R2J20657NP#G3 does not require an external bootstrap diode. It integrates a built-in bootstrapping switch on the BOOT pin, which supplies +5 V to the high-side gate driver from the Reg5V rail. This eliminates the need for an external Schottky diode, reducing component count and PCB footprint while maintaining reliable high-side drive.

What thermal protection mechanisms are implemented in R2J20657NP#G3?

R2J20657NP#G3 implements two independent thermal protections: a non-latching Thermal Warning (THWN) output that asserts low at 115°C to alert the system controller, and a latched Thermal Shutdown (THDN) that disables both GH and GL outputs at 150°C and pulls DISBL# low. Both functions monitor the driver IC junction temperature and operate without external components.

Can R2J20657NP#G3 operate with a 5 V VCIN supply?

Yes, R2J20657NP#G3 supports VCIN = 4.5–5.5 V when connected directly to the Reg5V output, as specified in the Recommended Operating Conditions. In this configuration, the internal 5 V regulator powers the driver logic, and VCIN serves as its input. The datasheet provides dedicated pin connection diagrams for this 5 V VCIN application mode.

R2J20657NP#G3 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
40-WFQFN Exposed Pad
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Driven Configuration:
High-Side or Low-Side
Channel Type:
Independent
Number of Drivers:
1
Gate Type:
N-Channel MOSFET
Voltage - Supply:
4.5V ~ 16V
Logic Voltage - VIL, VIH:
0.8V, 2.6V
Current - Peak Output (Source, Sink):
-
Input Type:
TTL
High Side Voltage - Max (Bootstrap):
25 V
Rise / Fall Time (Typ):
-
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6x6)

R2J20657NP#G3 FAQ

1.How can I place an order for R2J20657NP#G3 through Aetrix?

Please submit a Request for Quotation (RFQ) for R2J20657NP#G3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R2J20657NP#G3 reliable?

The price and inventory of R2J20657NP#G3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R2J20657NP#G3 is usually 5 days.

3.What payment methods are accepted for R2J20657NP#G3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R2J20657NP#G3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R2J20657NP#G3?

R2J20657NP#G3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R2J20657NP#G3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R2J20657NP#G3?

For technical support, including R2J20657NP#G3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R2J20657NP#G3 requirements.

6.How does Aetrix verify that R2J20657NP#G3 is sourced from the original manufacturer or authorized distributors?

All R2J20657NP#G3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R2J20657NP#G3 meets industry standards.

7.What is the process for return or replacement of R2J20657NP#G3?

All R2J20657NP#G3 units undergo pre-shipment inspection (PSI). If there is an issue with R2J20657NP#G3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R2J20657NP#G3 part is unused and in its original packaging.

Return procedure for R2J20657NP#G3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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