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Renesas R2J20658BNP#G0

Part No.:
R2J20658BNP#G0
Manufacturer:
Renesas
Category:
Gate Drivers
Package:
-
Datasheet:
AetrixR2J20658BNP#G0.pdf
Description:
HALF BRIDGE BASED MOSFET DRIVER
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Payment
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Inventory:167,500

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Product details

Overview

R2J20658BNP from Renesas Electronics is an integrated DrMOS power stage combining high-side and low-side MOSFETs with a matched gate driver in a single QFN40 package. It delivers up to 40 A average output current, supports >1 MHz switching, operates with VIN up to 20 V, and integrates thermal warning (115°C) and shutdown (150°C) for desktop/server VRMs.

For engineers reviewing the R2J20658BNP datasheet, R2J20658BNP pinout, R2J20658BNP application, or R2J20658BNP equivalent, this device serves as a high-efficiency, Intel 6×6-compliant synchronous buck power stage with tri-state PWM input, built-in 5 V regulator, zero-current detection, and bootstrapped high-side drive-critical for CPU/GPU core voltage regulation.

Technical Context

The R2J20658BNP implements a tightly coupled multi-chip module architecture where driver timing, MOSFET on-resistance, and parasitic inductance are co-optimized for high-frequency (>1 MHz), low-voltage (e.g., 1.3 V) synchronous buck operation. Its UVLO (7.4 V turn-on / 7.0 V turn-off) and supervisor circuit (4.3 V active / 3.8 V shutdown) govern internal 5 V regulation and driver activation independently of DISBL# control.

It features dual thermal protection: open-drain THWN asserts at 115°C (±15°C hysteresis) for system-level warning without disabling operation, while THDN triggers latch-off shutdown above 150°C and forces DISBL# low. The LSDBL# pin enables discontinuous conduction mode by disabling the low-side gate, and the PWM input supports tri-state detection for zero-current detection during mid-voltage or high-impedance states.

Key Specifications

Parameter Value and Actual Design Meaning
Average Output Current40 A maximum - supports high-power CPU/GPU core rails
Input Voltage Range (VIN)4.5–16 V DC - compatible with standard 12 V input VRM designs
Switching FrequencyUp to >1 MHz - enables compact magnetics and fast transient response
Thermal Warning Threshold115°C (typ.) - provides early overtemperature alert before performance derating
Thermal Shutdown Threshold150°C (latch-off) - protects against catastrophic thermal failure
VCIN Operating Range4.5–5.5 V or 8–22 V - flexible bias options including external 5 V supply
Reg5V Output4.95–5.45 V @ 0–10 mA - powers logic interface and external circuits
PackageQFN40 (6 mm × 6 mm × 0.95 mm) - thermally enhanced surface-mount footprint

Pinout & Package

Package: QFN40 (6 mm × 6 mm × 0.95 mm), thermally optimized with exposed die pads for high-power dissipation. Three large thermal pads (VSWH, VIN, PGND) must be soldered to PCB copper for thermal and electrical integrity.

Pin/Terminal Circuit Role Design Meaning
LSDBL# (1)Low-side gate disable controlAssert low to force low-side FET off - enables DCM operation and reduces light-load losses
Reg5V (2)5 V logic regulator outputSupplies 5 V ±2.5% to external logic; requires ≥0.1 μF ceramic decoupling to CGND
VCIN (3)Driver supply inputEnables internal 5 V regulator when >7.4 V; supports 4.5–5.5 V or 8–22 V operation
BOOT (4)High-side bootstrap nodeInternally switched to Reg5V - eliminates need for external Schottky diode
CGND (5, 37)Control ground referenceMust be externally connected to PGND; separates signal and power return paths
GH (6)High-side gate drive outputMonitored signal for gate voltage; drives high-side MOSFET source (VSWH) to drain (VIN)
VIN (8–14, Pad)Main power inputConnects to high-side MOSFET drain; multiple pins and pad reduce resistance/inductance
VSWH (7, 15, 29–35, Pad)Switch node / phase outputCommon connection point for high-side source and low-side drain; critical for EMI and layout
PGND (16–28)Power ground returnMultiple pins + large pad ensure low-impedance path for high di/dt currents
GL (36)Low-side gate drive outputMonitored signal for gate voltage; drives low-side MOSFET drain (VSWH) to source (PGND)
THWN (38)Thermal warning open-drain outputPulls low at >115°C; requires external pull-up resistor (e.g., 51 kΩ) for system monitoring
DISBL# (39)Global disable inputDrives GL/GH low when asserted; internally pulled low during thermal shutdown
PWM (40)Tri-state PWM logic input5 V TTL-compatible; mid-voltage or high-Z triggers zero-current detection for efficiency optimization

Key Features

Feature Design Value
Intel 6×6 DrMOS complianceFully meets specification for interoperability with industry-standard VRM controllers and layouts
Built-in bootstrap switchEliminates external SBD - reduces BOM count, layout area, and reverse recovery losses
Zero-current detection (ZCD)Enables discontinuous conduction mode via PWM tri-state detection - improves light-load efficiency
Dual thermal protectionIndependent THWN (warning) and THDN (shutdown) outputs - supports predictive thermal management
Integrated 5 V regulatorStable 5 V output with line/load regulation <±10 mV - powers controller logic without external LDO
Low-side MOSFET with integrated SBDReduces ringing and conduction loss during body-diode conduction - enhances reliability and EMI

Applications

Desktop CPU Core VRM Server GPU Power Stage

Use Scenario: High-current, fast-transient voltage regulation for Intel/AMD desktop processors requiring 1.0–1.4 V at up to 40 A.

IC Role / Device Role / Timing Role: Primary synchronous buck power stage delivering regulated core voltage; handles high di/dt with minimal layout parasitics.

Use Value: Enables >1 MHz operation with low power loss (typ. 3.2 W at 25 A/1.3 V), reducing inductor size and improving transient response vs. discrete solutions.

Use Scenario: Multi-phase power delivery for datacenter GPU accelerators demanding stable 0.8–1.2 V rails under dynamic 30–45 A loads.

IC Role / Device Role / Timing Role: Single-phase DrMOS stage in multiphase VRM; synchronized via PWM to maintain phase interleaving and current balance.

Use Value: Integrated thermal warning allows proactive throttling before shutdown, increasing system uptime and enabling predictive maintenance in rack-scale deployments.

Enterprise SSD Controller Supply AI Accelerator Core Rail

Use Scenario: Compact, high-efficiency 1.1 V/20 A supply for NVMe SSD controllers in space-constrained U.2/U.3 form factors.

IC Role / Device Role / Timing Role: Standalone buck converter stage; leverages ZCD and LSDBL# to minimize idle power in burst-access workloads.

Use Value: QFN40 footprint and integrated bootstrapping reduce PCB area by ~35% vs. discrete MOSFET+driver solutions, easing thermal design in sealed enclosures.

Use Scenario: Core voltage regulation for edge AI inference chips operating at 0.75–0.95 V with aggressive load-step requirements (e.g., 15 A/μs).

IC Role / Device Role / Timing Role: High-bandwidth power stage responding to fast PWM edges; GH/GL monitoring supports real-time gate-drive diagnostics.

Use Value: Optimized driver-MOSFET timing minimizes shoot-through risk and conduction loss, achieving >92% peak efficiency at 1.0 V/30 A per phase.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DrMOS power stage applications.

Alternative Part Technical Difference Application Difference Selection Advice
IR35201MTRPBF40 A rated, 5×6 mm QFN, supports 3.3 V PWM; lacks integrated boot switch and THWN outputRequires external bootstrap diode; no thermal warning signal - limits predictive thermal management capabilityPreferred where cost sensitivity outweighs thermal monitoring needs and board space permits external components
MP86957GQZ40 A rated, 6×6 mm QFN, includes integrated boot switch and thermal shutdown but no THWN pinProvides thermal shutdown only; missing open-drain warning output prevents early-overtemp system responseSelected for simpler thermal schemes where warning-level intervention is not required in firmware

Compared with IR35201MTRPBF and MP86957GQZ, the R2J20658BNP uniquely combines Intel 6×6 compliance, integrated boot switch, tri-state ZCD, and dual thermal signaling (THWN + THDN) - making it optimal for high-reliability desktop/server VRMs requiring both efficiency and thermal intelligence.

Availability

R2J20658BNP is available at Aetrix Electronics and suitable for desktop CPU VRMs, server GPU power stages, enterprise SSD controller supplies, and AI accelerator core rails requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for R2J20658BNP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and computing markets.

The R2J20658BNP belongs to Renesas' DrMOS product line, engineered specifically for high-efficiency, high-density voltage regulation modules in Intel- and AMD-compliant desktop and server platforms.

FAQ

What is the maximum safe operating frequency for the R2J20658BNP?

The R2J20658BNP supports high-frequency operation above 1 MHz, as confirmed in its datasheet features and typical application circuits. At 1 MHz with VIN = 12 V, VOUT = 1.3 V, and IOUT = 25 A, power loss remains within thermal limits. Operation beyond 1.2 MHz is feasible but requires careful attention to gate drive strength, PCB layout parasitics, and thermal management to maintain efficiency and reliability of the R2J20658BNP.

Does the R2J20658BNP require an external bootstrap diode?

No, the R2J20658BNP does not require an external bootstrap diode. Its BOOT pin is internally connected to the Reg5V output through a built-in switch, eliminating the need for an external Schottky diode. This integration reduces component count, PCB area, and reverse recovery losses - a key advantage explicitly stated in the device description and pin function table of the R2J20658BNP datasheet.

How does the THWN pin function in the R2J20658BNP?

The THWN pin on the R2J20658BNP is an open-drain thermal warning output that pulls low when the internal driver IC junction temperature exceeds 115°C (typ.). It does not disable operation but signals impending thermal stress to the system controller. An external pull-up resistor (e.g., 51 kΩ) is required. This feature enables proactive thermal management before reaching the 150°C shutdown threshold - a distinct capability of the R2J20658BNP.

Can the R2J20658BNP operate with a 5 V VCIN supply?

Yes, the R2J20658BNP supports VCIN = 4.5–5.5 V, provided VCIN is connected to the Reg5V pin as specified in the "Pin Connection" section. In this configuration, the internal 5 V regulator is bypassed, and the device relies on the external 5 V supply for driver bias. This mode avoids UVLO activation and simplifies power sequencing - a validated operating condition documented for the R2J20658BNP.

What is the purpose of the LSDBL# pin on the R2J20658BNP?

The LSDBL# pin on the R2J20658BNP disables the low-side MOSFET gate driver when asserted low, forcing discontinuous conduction mode (DCM). This reduces light-load power loss and improves efficiency during idle or low-utilization states. The pin is internally pulled up to Reg5V (160 kΩ), so leaving it open enables normal continuous conduction - a behavior explicitly defined in the truth table and functional description of the R2J20658BNP.

R2J20658BNP#G0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
-
Channel Type:
-
Number of Drivers:
-
Gate Type:
-
Voltage - Supply:
-
Logic Voltage - VIL, VIH:
-
Current - Peak Output (Source, Sink):
-
Input Type:
-
High Side Voltage - Max (Bootstrap):
-
Rise / Fall Time (Typ):
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

R2J20658BNP#G0 FAQ

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Please submit a Request for Quotation (RFQ) for R2J20658BNP#G0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of R2J20658BNP#G0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R2J20658BNP#G0 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R2J20658BNP#G0?

For technical support, including R2J20658BNP#G0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R2J20658BNP#G0 requirements.

6.How does Aetrix verify that R2J20658BNP#G0 is sourced from the original manufacturer or authorized distributors?

All R2J20658BNP#G0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R2J20658BNP#G0 meets industry standards.

7.What is the process for return or replacement of R2J20658BNP#G0?

All R2J20658BNP#G0 units undergo pre-shipment inspection (PSI). If there is an issue with R2J20658BNP#G0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R2J20658BNP#G0 part is unused and in its original packaging.

Return procedure for R2J20658BNP#G0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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