Renesas R2J20658BNP#G0
- Part No.:
- R2J20658BNP#G0
- Manufacturer:
- Renesas
- Category:
- Gate Drivers
- Package:
- -
- Datasheet:
-
R2J20658BNP#G0.pdf
- Description:
- HALF BRIDGE BASED MOSFET DRIVER
- Quantity:
- Payment:

- Shipping:

Inventory:167,500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R2J20658BNP from Renesas Electronics is an integrated DrMOS power stage combining high-side and low-side MOSFETs with a matched gate driver in a single QFN40 package. It delivers up to 40 A average output current, supports >1 MHz switching, operates with VIN up to 20 V, and integrates thermal warning (115°C) and shutdown (150°C) for desktop/server VRMs.
For engineers reviewing the R2J20658BNP datasheet, R2J20658BNP pinout, R2J20658BNP application, or R2J20658BNP equivalent, this device serves as a high-efficiency, Intel 6×6-compliant synchronous buck power stage with tri-state PWM input, built-in 5 V regulator, zero-current detection, and bootstrapped high-side drive-critical for CPU/GPU core voltage regulation.
Technical Context
The R2J20658BNP implements a tightly coupled multi-chip module architecture where driver timing, MOSFET on-resistance, and parasitic inductance are co-optimized for high-frequency (>1 MHz), low-voltage (e.g., 1.3 V) synchronous buck operation. Its UVLO (7.4 V turn-on / 7.0 V turn-off) and supervisor circuit (4.3 V active / 3.8 V shutdown) govern internal 5 V regulation and driver activation independently of DISBL# control.
It features dual thermal protection: open-drain THWN asserts at 115°C (±15°C hysteresis) for system-level warning without disabling operation, while THDN triggers latch-off shutdown above 150°C and forces DISBL# low. The LSDBL# pin enables discontinuous conduction mode by disabling the low-side gate, and the PWM input supports tri-state detection for zero-current detection during mid-voltage or high-impedance states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Average Output Current | 40 A maximum - supports high-power CPU/GPU core rails |
| Input Voltage Range (VIN) | 4.5–16 V DC - compatible with standard 12 V input VRM designs |
| Switching Frequency | Up to >1 MHz - enables compact magnetics and fast transient response |
| Thermal Warning Threshold | 115°C (typ.) - provides early overtemperature alert before performance derating |
| Thermal Shutdown Threshold | 150°C (latch-off) - protects against catastrophic thermal failure |
| VCIN Operating Range | 4.5–5.5 V or 8–22 V - flexible bias options including external 5 V supply |
| Reg5V Output | 4.95–5.45 V @ 0–10 mA - powers logic interface and external circuits |
| Package | QFN40 (6 mm × 6 mm × 0.95 mm) - thermally enhanced surface-mount footprint |
Pinout & Package
Package: QFN40 (6 mm × 6 mm × 0.95 mm), thermally optimized with exposed die pads for high-power dissipation. Three large thermal pads (VSWH, VIN, PGND) must be soldered to PCB copper for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LSDBL# (1) | Low-side gate disable control | Assert low to force low-side FET off - enables DCM operation and reduces light-load losses |
| Reg5V (2) | 5 V logic regulator output | Supplies 5 V ±2.5% to external logic; requires ≥0.1 μF ceramic decoupling to CGND |
| VCIN (3) | Driver supply input | Enables internal 5 V regulator when >7.4 V; supports 4.5–5.5 V or 8–22 V operation |
| BOOT (4) | High-side bootstrap node | Internally switched to Reg5V - eliminates need for external Schottky diode |
| CGND (5, 37) | Control ground reference | Must be externally connected to PGND; separates signal and power return paths |
| GH (6) | High-side gate drive output | Monitored signal for gate voltage; drives high-side MOSFET source (VSWH) to drain (VIN) |
| VIN (8–14, Pad) | Main power input | Connects to high-side MOSFET drain; multiple pins and pad reduce resistance/inductance |
| VSWH (7, 15, 29–35, Pad) | Switch node / phase output | Common connection point for high-side source and low-side drain; critical for EMI and layout |
| PGND (16–28) | Power ground return | Multiple pins + large pad ensure low-impedance path for high di/dt currents |
| GL (36) | Low-side gate drive output | Monitored signal for gate voltage; drives low-side MOSFET drain (VSWH) to source (PGND) |
| THWN (38) | Thermal warning open-drain output | Pulls low at >115°C; requires external pull-up resistor (e.g., 51 kΩ) for system monitoring |
| DISBL# (39) | Global disable input | Drives GL/GH low when asserted; internally pulled low during thermal shutdown |
| PWM (40) | Tri-state PWM logic input | 5 V TTL-compatible; mid-voltage or high-Z triggers zero-current detection for efficiency optimization |
Key Features
| Feature | Design Value |
|---|---|
| Intel 6×6 DrMOS compliance | Fully meets specification for interoperability with industry-standard VRM controllers and layouts |
| Built-in bootstrap switch | Eliminates external SBD - reduces BOM count, layout area, and reverse recovery losses |
| Zero-current detection (ZCD) | Enables discontinuous conduction mode via PWM tri-state detection - improves light-load efficiency |
| Dual thermal protection | Independent THWN (warning) and THDN (shutdown) outputs - supports predictive thermal management |
| Integrated 5 V regulator | Stable 5 V output with line/load regulation <±10 mV - powers controller logic without external LDO |
| Low-side MOSFET with integrated SBD | Reduces ringing and conduction loss during body-diode conduction - enhances reliability and EMI |
Applications
| Desktop CPU Core VRM | Server GPU Power Stage |
|---|---|
Use Scenario: High-current, fast-transient voltage regulation for Intel/AMD desktop processors requiring 1.0–1.4 V at up to 40 A. IC Role / Device Role / Timing Role: Primary synchronous buck power stage delivering regulated core voltage; handles high di/dt with minimal layout parasitics. Use Value: Enables >1 MHz operation with low power loss (typ. 3.2 W at 25 A/1.3 V), reducing inductor size and improving transient response vs. discrete solutions. |
Use Scenario: Multi-phase power delivery for datacenter GPU accelerators demanding stable 0.8–1.2 V rails under dynamic 30–45 A loads. IC Role / Device Role / Timing Role: Single-phase DrMOS stage in multiphase VRM; synchronized via PWM to maintain phase interleaving and current balance. Use Value: Integrated thermal warning allows proactive throttling before shutdown, increasing system uptime and enabling predictive maintenance in rack-scale deployments. |
| Enterprise SSD Controller Supply | AI Accelerator Core Rail |
Use Scenario: Compact, high-efficiency 1.1 V/20 A supply for NVMe SSD controllers in space-constrained U.2/U.3 form factors. IC Role / Device Role / Timing Role: Standalone buck converter stage; leverages ZCD and LSDBL# to minimize idle power in burst-access workloads. Use Value: QFN40 footprint and integrated bootstrapping reduce PCB area by ~35% vs. discrete MOSFET+driver solutions, easing thermal design in sealed enclosures. |
Use Scenario: Core voltage regulation for edge AI inference chips operating at 0.75–0.95 V with aggressive load-step requirements (e.g., 15 A/μs). IC Role / Device Role / Timing Role: High-bandwidth power stage responding to fast PWM edges; GH/GL monitoring supports real-time gate-drive diagnostics. Use Value: Optimized driver-MOSFET timing minimizes shoot-through risk and conduction loss, achieving >92% peak efficiency at 1.0 V/30 A per phase. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DrMOS power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR35201MTRPBF | 40 A rated, 5×6 mm QFN, supports 3.3 V PWM; lacks integrated boot switch and THWN output | Requires external bootstrap diode; no thermal warning signal - limits predictive thermal management capability | Preferred where cost sensitivity outweighs thermal monitoring needs and board space permits external components |
| MP86957GQZ | 40 A rated, 6×6 mm QFN, includes integrated boot switch and thermal shutdown but no THWN pin | Provides thermal shutdown only; missing open-drain warning output prevents early-overtemp system response | Selected for simpler thermal schemes where warning-level intervention is not required in firmware |
Compared with IR35201MTRPBF and MP86957GQZ, the R2J20658BNP uniquely combines Intel 6×6 compliance, integrated boot switch, tri-state ZCD, and dual thermal signaling (THWN + THDN) - making it optimal for high-reliability desktop/server VRMs requiring both efficiency and thermal intelligence.
Availability
R2J20658BNP is available at Aetrix Electronics and suitable for desktop CPU VRMs, server GPU power stages, enterprise SSD controller supplies, and AI accelerator core rails requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for R2J20658BNP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and computing markets.
The R2J20658BNP belongs to Renesas' DrMOS product line, engineered specifically for high-efficiency, high-density voltage regulation modules in Intel- and AMD-compliant desktop and server platforms.
FAQ
What is the maximum safe operating frequency for the R2J20658BNP?
The R2J20658BNP supports high-frequency operation above 1 MHz, as confirmed in its datasheet features and typical application circuits. At 1 MHz with VIN = 12 V, VOUT = 1.3 V, and IOUT = 25 A, power loss remains within thermal limits. Operation beyond 1.2 MHz is feasible but requires careful attention to gate drive strength, PCB layout parasitics, and thermal management to maintain efficiency and reliability of the R2J20658BNP.
Does the R2J20658BNP require an external bootstrap diode?
No, the R2J20658BNP does not require an external bootstrap diode. Its BOOT pin is internally connected to the Reg5V output through a built-in switch, eliminating the need for an external Schottky diode. This integration reduces component count, PCB area, and reverse recovery losses - a key advantage explicitly stated in the device description and pin function table of the R2J20658BNP datasheet.
How does the THWN pin function in the R2J20658BNP?
The THWN pin on the R2J20658BNP is an open-drain thermal warning output that pulls low when the internal driver IC junction temperature exceeds 115°C (typ.). It does not disable operation but signals impending thermal stress to the system controller. An external pull-up resistor (e.g., 51 kΩ) is required. This feature enables proactive thermal management before reaching the 150°C shutdown threshold - a distinct capability of the R2J20658BNP.
Can the R2J20658BNP operate with a 5 V VCIN supply?
Yes, the R2J20658BNP supports VCIN = 4.5–5.5 V, provided VCIN is connected to the Reg5V pin as specified in the "Pin Connection" section. In this configuration, the internal 5 V regulator is bypassed, and the device relies on the external 5 V supply for driver bias. This mode avoids UVLO activation and simplifies power sequencing - a validated operating condition documented for the R2J20658BNP.
What is the purpose of the LSDBL# pin on the R2J20658BNP?
The LSDBL# pin on the R2J20658BNP disables the low-side MOSFET gate driver when asserted low, forcing discontinuous conduction mode (DCM). This reduces light-load power loss and improves efficiency during idle or low-utilization states. The pin is internally pulled up to Reg5V (160 kΩ), so leaving it open enables normal continuous conduction - a behavior explicitly defined in the truth table and functional description of the R2J20658BNP.
R2J20658BNP#G0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- -
- Channel Type:
- -
- Number of Drivers:
- -
- Gate Type:
- -
- Voltage - Supply:
- -
- Logic Voltage - VIL, VIH:
- -
- Current - Peak Output (Source, Sink):
- -
- Input Type:
- -
- High Side Voltage - Max (Bootstrap):
- -
- Rise / Fall Time (Typ):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
R2J20658BNP#G0 FAQ
1.How can I place an order for R2J20658BNP#G0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R2J20658BNP#G0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R2J20658BNP#G0 reliable?
The price and inventory of R2J20658BNP#G0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R2J20658BNP#G0 is usually 5 days.
3.What payment methods are accepted for R2J20658BNP#G0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R2J20658BNP#G0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R2J20658BNP#G0?
R2J20658BNP#G0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R2J20658BNP#G0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R2J20658BNP#G0?
For technical support, including R2J20658BNP#G0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R2J20658BNP#G0 requirements.
6.How does Aetrix verify that R2J20658BNP#G0 is sourced from the original manufacturer or authorized distributors?
All R2J20658BNP#G0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R2J20658BNP#G0 meets industry standards.
7.What is the process for return or replacement of R2J20658BNP#G0?
All R2J20658BNP#G0 units undergo pre-shipment inspection (PSI). If there is an issue with R2J20658BNP#G0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R2J20658BNP#G0 part is unused and in its original packaging.
Return procedure for R2J20658BNP#G0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R2J20658BNP#G0 Tags

-
ZXGD3009E6TA
Diodes Incorporated

-
1EDN7512BXTSA1
Infineon Technologies
-
UCC27517DBVR
Texas Instruments

-
MCP1416T-E/OT
Microchip Technology

-
MCP1402T-E/OT
Microchip Technology

-
MCP1415T-E/OT
Microchip Technology

-
MCP1401T-E/OT
Microchip Technology

-
IX4428NTR
Littelfuse Inc.

-
IRS2005STRPBF
Infineon Technologies

-
IRS2008STRPBF
Infineon Technologies

-
IX4310TTR
Littelfuse Inc.

-
2EDN7524RXTMA1
Infineon Technologies
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

