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Renesas R2J20658NP#G0

Part No.:
R2J20658NP#G0
Manufacturer:
Renesas
Category:
Gate Drivers
Package:
-
Datasheet:
AetrixR2J20658NP#G0.pdf
Description:
HALF BRIDGE BASED MOSFET DRIVER
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Product details

Overview

R2J20658NP from Renesas Electronics is an integrated DrMOS power stage combining high-side and low-side MOSFETs with a matched gate driver in a single QFN40 (6 mm × 6 mm) package. It delivers up to 40 A average output current, supports >1 MHz switching, operates with VIN up to 20 V, and incorporates thermal warning (115°C) and shutdown (150°C) for desktop/server CPU/GPU VRMs.

For engineers reviewing the R2J20658NP datasheet, R2J20658NP pinout, R2J20658NP application, or R2J20658NP equivalent, this device serves as a drop-in Intel 6×6 DrMOS-compliant solution for high-efficiency, high-density synchronous buck converters requiring precise timing control, built-in bootstrap switching, and DCM support via LSDBL#.

Technical Context

The R2J20658NP implements a tightly coupled multi-chip module architecture where parasitic inductance between driver and MOSFET dies is minimized, enabling stable operation above 1 MHz. Its internal UVLO (7.4 V turn-on / 7.0 V turn-off) and supervisor circuitry (4.3 V activation / 3.8 V shutdown) govern 5 V regulator enablement and driver state transitions independently of DISBL#.

Timing is optimized for low-voltage, high-current buck conversion: the tri-state PWM input detects 150 ns dwell within 1.4–2.0 V hysteresis window to disable both GH and GL; LSDBL# asserts low to force DCM by disabling GL while GH remains controllable; THWN provides open-drain thermal warning at 115°C without halting operation.

Key Specifications

Parameter Value and Actual Design Meaning
Average Output Current40 A maximum - enables single-phase CPU/GPU core power delivery without parallel stages
Switching Frequency SupportUp to 1 MHz+ - allows compact magnetics and reduced output capacitance in VRM designs
VIN Operating Range4.5 V to 16 V DC - compatible with standard 12 V input rails and intermediate bus architectures
Thermal Warning Threshold115°C (typ.) - provides early overtemperature alert to system controller before performance derating
Thermal Shutdown Threshold150°C (latch-off) - protects against catastrophic failure by forcing GH/GL low and pulling DISBL# low
VCIN Supply Range4.5–5.5 V or 8–22 V - supports dual-mode operation: internal 5 V regulator or external VCIN sourcing
PWM Input Compatibility3.3 V and 5 V TTL logic - interoperable with common PWM controllers without level-shifting

Pinout & Package

Package: QFN40 (6 mm × 6 mm × 0.95 mm), thermally enhanced with three exposed die-pads (VSWH, VIN, CGND) requiring PCB soldering per datasheet note.

Pin/Terminal Circuit Role Design Meaning
1 LSDBL#Low-side gate disable controlActive-low input enabling Discontinuous Conduction Mode (DCM); internally pulled up to Reg5V
2 Reg5V+5 V logic supply outputStable 4.95–5.45 V regulated output for external logic; requires ≥0.1 μF ceramic capacitor to CGND
3 VCINDriver supply inputUVLO-controlled input (7.4 V turn-on); powers internal driver and 5 V regulator when ≥7.4 V
4 BOOTBootstrap voltage nodeInternally switched +5 V supply for high-side gate drive; eliminates need for external Schottky diode
5, 37 CGNDControl ground referenceSignal ground for PWM, DISBL#, THWN; must be externally connected to PGND
6 GHHigh-side gate drive outputMonitored gate signal for high-side MOSFET; driven by internal level shifter and overlap protection
8–14, Pad VINMain power inputInput voltage connection (4.5–16 V); multiple pins and pad reduce resistance/inductance for high-current paths
7, 15, 29–35, Pad VSWHSwitch node outputPhase node connecting high-side drain and low-side drain; critical for EMI and layout; requires low-inductance routing
16–28 PGNDPower ground returnHigh-current ground path for MOSFET sources and body diodes; multiple pins and pad minimize IR drop
36 GLLow-side gate drive outputMonitored gate signal for low-side MOSFET; disabled when LSDBL# = L to enter DCM
38 THWNThermal warning indicatorOpen-drain output active low at >115°C; requires external pull-up resistor (e.g., 51 kΩ) for system monitoring
39 DISBL#Global disable controlActive-low shutdown: forces GH/GL low but leaves Reg5V active; pulled low internally during thermal shutdown
40 PWMPWM logic inputTTL-compatible input with 150 ns tri-state detection window (1.4–2.0 V); supports 3.3 V/5 V controllers

Key Features

Feature Design Value
Intel 6×6 DrMOS complianceFully satisfies mechanical, electrical, and thermal requirements of Intel's DrMOS specification for server/desktop VRMs
Built-in bootstrap switchEliminates external Schottky diode on BOOT rail, reducing BOM count and improving reliability in high-frequency operation
Low-side MOSFET with integrated SBDReduces reverse recovery loss and ringing during dead-time, improving efficiency and EMI in synchronous rectification
Dual thermal protectionIndependent thermal warning (115°C) and latch-off shutdown (150°C) provide layered safety for sustained high-load operation
Tri-state PWM inputAutomatically disables both GH and GL when PWM signal floats or dwells in hysteresis window, preventing shoot-through
DCM support via LSDBL#Enables discontinuous conduction mode by disabling GL only-preserving high-side control for light-load efficiency optimization

Applications

Server CPU Voltage Regulator Desktop GPU Power Stage

Use Scenario: High-current, multi-phase VRM supplying core voltage to dual-socket Xeon processors under dynamic load transients.

IC Role / Device Role / Timing Role: Single-phase DrMOS power stage delivering up to 40 A with <150 ns propagation delay and overlap protection.

Use Value: Enables compact, high-efficiency phase design meeting Intel VR12.5/VR13 specs with built-in thermal monitoring and DCM capability.

Use Scenario: Single-phase auxiliary rail for GPU memory or I/O voltage in high-end gaming desktops with tight board space constraints.

IC Role / Device Role / Timing Role: Integrated high/low-side MOSFET + driver replacing discrete solutions; supports >1 MHz switching for smaller inductors.

Use Value: Reduces component count by 6+ devices per phase and improves thermal response via on-die temperature sensing (THWN/THDN).

AI Accelerator Core Rail High-Density Rack-Mount PSU

Use Scenario: Point-of-load regulation for FPGA or ASIC cores in AI training accelerators requiring rapid load-step response and thermal margin.

IC Role / Device Role / Timing Role: Fast-switching DrMOS stage with 150 ns tri-state hold-off and 115°C thermal warning for predictive thermal management.

Use Value: Delivers 40 A peak current with minimal layout parasitics due to monolithic QFN40 integration, supporting <500 ns load-step recovery.

Use Scenario: Secondary-side synchronous buck stage in modular 3 kW rack PSUs powering edge compute nodes with strict efficiency targets.

IC Role / Device Role / Timing Role: High-reliability power stage with latch-off thermal shutdown (150°C), Pb-free/Halogen-free construction, and 20 V max VIN rating.

Use Value: Extends service life in thermally constrained environments via double thermal protection and robust absolute max ratings (e.g., VSWH(AC) = 30 V).

Equivalent & Alternatives

The following parts are listed as comparable options for similar DrMOS power stage applications.

Alternative Part Technical Difference Application Difference Selection Advice
IR35201MTRPBF8 mm × 8 mm QFN; higher Rds(on) (high-side 3.5 mΩ, low-side 1.8 mΩ vs. R2J20658NP's 2.8/1.5 mΩ); no integrated SBD on low-sideTargeted at enterprise server VRMs with larger board area; lacks DCM support via dedicated LSDBL# pinSelect when footprint size is less constrained and legacy Intel VR12 compatibility is required over VR13/VR14 features
ISL99227BIRZ6 mm × 6 mm QFN; lower max current (35 A vs. 40 A); THWN threshold at 125°C (vs. 115°C); no tri-state PWM hysteresis windowOptimized for client notebook VRMs; thermal warning triggers later, reducing early throttling in burst-load scenariosSelect for cost-sensitive mobile platforms where 5 A lower current headroom and relaxed thermal warning are acceptable

Compared with IR35201MTRPBF and ISL99227BIRZ, the R2J20658NP offers superior current density (40 A in 6×6 mm), earlier thermal warning (115°C), integrated low-side SBD for reduced ringing, and explicit DCM control-making it optimal for next-gen high-power-density VRMs demanding tight thermal margins and light-load efficiency.

Availability

R2J20658NP is available at Aetrix Electronics and suitable for server CPU voltage regulation, desktop GPU power delivery, AI accelerator core rails, and high-density rack-mount PSU applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for R2J20658NP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and datacenter markets.

The R2J20658NP belongs to Renesas' DrMOS product line, engineered specifically for high-efficiency, high-current synchronous buck converters in Intel-compliant server and desktop VRMs-emphasizing thermal intelligence, integration density, and fast transient response.

FAQ

What is the maximum safe operating frequency for the R2J20658NP?

The R2J20658NP is characterized for stable operation above 1 MHz, with typical application data validated at 600 kHz and 1 MHz. Its monolithic QFN40 construction minimizes inter-die parasitics, enabling reliable high-frequency switching up to 1.2 MHz in well-designed layouts with proper gate drive strength and thermal management. The R2J20658NP datasheet confirms functionality beyond 1 MHz in recommended operating conditions.

Does the R2J20658NP require an external bootstrap diode?

No, the R2J20658NP does not require an external bootstrap diode. It integrates a dedicated internal bootstrap switch on the BOOT pin, which supplies +5 V to the high-side gate driver when enabled. This eliminates the need for an external Schottky diode, reducing BOM count, layout complexity, and potential failure points in high-frequency VRM designs using the R2J20658NP.

How does the LSDBL# pin function in the R2J20658NP?

The LSDBL# pin on the R2J20658NP is an active-low input that disables the low-side MOSFET gate driver (GL) while leaving the high-side driver (GH) operational. When asserted low, it forces Discontinuous Conduction Mode (DCM) to improve light-load efficiency. The pin is internally pulled up to Reg5V (160 kΩ), so it may be left open or pulled up to VCIN if DCM is not needed. This feature is unique to the R2J20658NP among comparable DrMOS devices.

What thermal protection mechanisms are implemented in the R2J20658NP?

The R2J20658NP implements two independent thermal protections: (1) THWN open-drain output activates at 115°C (typ.) to warn the system controller, and (2) THDN internal latch-off shutdown triggers at 150°C, forcing GH/GL low and pulling DISBL# low. Both functions monitor the driver IC junction temperature directly-not ambient or case temperature-ensuring accurate, localized thermal response in the R2J20658NP.

Can the R2J20658NP operate with a 5 V VCIN supply?

Yes, the R2J20658NP supports VCIN operation at 4.5–5.5 V, provided VCIN is connected to the Reg5V pin (per Pin Connection diagram Fig. 1.2). In this configuration, the internal 5 V regulator is bypassed, and the driver is powered directly from the external 5 V source. This mode avoids UVLO dependency and simplifies power sequencing, making it suitable for systems where a clean, regulated 5 V rail is already available for the R2J20658NP.

R2J20658NP#G0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
-
Channel Type:
-
Number of Drivers:
-
Gate Type:
-
Voltage - Supply:
-
Logic Voltage - VIL, VIH:
-
Current - Peak Output (Source, Sink):
-
Input Type:
-
High Side Voltage - Max (Bootstrap):
-
Rise / Fall Time (Typ):
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

R2J20658NP#G0 FAQ

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6.How does Aetrix verify that R2J20658NP#G0 is sourced from the original manufacturer or authorized distributors?

All R2J20658NP#G0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R2J20658NP#G0 meets industry standards.

7.What is the process for return or replacement of R2J20658NP#G0?

All R2J20658NP#G0 units undergo pre-shipment inspection (PSI). If there is an issue with R2J20658NP#G0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R2J20658NP#G0 part is unused and in its original packaging.

Return procedure for R2J20658NP#G0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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