Nexperia USA Inc. RB520CS30L,315
- Part No.:
- RB520CS30L,315
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SOD-882
- Datasheet:
-
RB520CS30L,315.pdf
- Description:
- DIODE SCHOTT 30V 100MA DFN1006-2
- Quantity:
- Payment:

- Shipping:

Inventory:29,468
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
RB520CS30L,315 from Nexperia is a planar Schottky barrier rectifier with integrated guard ring for stress protection, designed for low-current, high-efficiency rectification in space-constrained PCBs. It delivers 100 mA average forward current, 30 V reverse voltage rating, and ultra-low 330 mV typical forward voltage at 10 mA - enabling high-efficiency DC-DC conversion in automotive and portable power rails.
For engineers reviewing the RB520CS30L,315 datasheet, RB520CS30L,315 pinout, RB520CS30L,315 application, or RB520CS30L,315 equivalent, key selection criteria include its AEC-Q101 qualification, SOD882 leadless package footprint, sub-0.5 μA reverse leakage at 10 V, and thermal resistance of 220 K/W on FR4 with cathode pad - critical for thermally sensitive low-power designs.
Technical Context
This MEGA Schottky diode employs a planar silicon structure with an integrated guard ring to suppress edge breakdown and improve reliability under transient stress. Its low VF stems from optimized metal-semiconductor interface engineering, not barrier height reduction alone - preserving low IR while minimizing conduction loss.
Thermal performance is defined by mounting-dependent Rth(j-a): 395 K/W (free air), 220 K/W (FR4, 1 cm² cathode pad), or 145 K/W (Al₂O₃ ceramic). Junction temperature must be limited to 150 °C, and reflow soldering is the only qualified assembly method per Nexperia's process specification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IF(AV) | 100 mA - maximum continuous forward current at ≤135 °C ambient or ≤145 °C solder point, enabling stable operation in compact power rails |
| VR | 30 V - peak repetitive reverse voltage; suitable for 24 V automotive systems with margin against load-dump transients |
| VF @ 10 mA | 330–450 mV - low conduction loss improves efficiency in battery-powered DC-DC stages and reverse polarity protection |
| IR @ 10 V | 0.14–0.5 μA - minimal leakage preserves battery life in always-on circuits and low-power sensor nodes |
| Cd @ 1 V | 10 pF - low junction capacitance supports fast switching in high-frequency SMPS (≥1 MHz) without excessive ringing |
| Rth(j-sp) | 70 K/W - thermal resistance from junction to cathode solder point, critical for thermal design when using copper pour |
| AEC-Q101 | Qualified - validated for automotive applications including engine control modules and body electronics |
Pinout & Package
Encapsulated in a leadless SOD882 plastic package (1.0 × 0.6 × 0.5 mm), the RB520CS30L,315 uses a two-terminal surface-mount configuration with cathode identified by a marking bar on the top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode | Output terminal for forward conduction; requires dedicated thermal pad (1 cm² minimum) on PCB for rated IF(AV) |
| 2 | Anode | Input terminal; connects to source side of rectification path; no thermal pad requirement |
Key Features
| Feature | Design Value |
|---|---|
| MEGA Schottky architecture | Planar die with integrated guard ring - prevents premature edge breakdown under voltage stress, improving long-term reliability in automotive environments |
| Ultra-low VF | 330 mV typ. at 10 mA - reduces power loss by >40% vs. standard Schottkys in 3.3 V/5 V rail clamping and reverse protection |
| SOD882 package | 1.0 × 0.6 mm footprint - saves >60% board area vs. SOD323, enabling dense power management in wearables and ECUs |
| AEC-Q101 qualification | Stress-tested per automotive discrete standard - ensures robustness across −40 °C to +125 °C operating range with thermal cycling and HTRB validation |
| Reflow-only assembly | Validated for JEDEC J-STD-020D reflow profile - eliminates risk of voiding or delamination during automated PCB assembly |
Applications
| Automotive Body Control Module (BCM) | USB-C Power Delivery Clamp |
|---|---|
|
Use Scenario: Reverse polarity protection on 12 V supply input to microcontroller-based door module. IC Role / Device Role / Timing Role: Unidirectional blocking diode preventing damage during battery jump-start misconnection. Use Value: 0.45 V max VF limits voltage drop to <1.5% at 100 mA, preserving brown-out margin for 5 V LDO regulator input. |
Use Scenario: Output clamp in 5 V/3 A USB-C PD sink circuit to prevent backfeed into upstream controller during hot-plug. IC Role / Device Role / Timing Role: Fast-recovery Schottky rectifier isolating VBUS path during state transitions. Use Value: 10 pF junction capacitance minimizes signal integrity impact on CC line communication timing. |
| Industrial Sensor Node Power Rail | Low-Power IoT Wireless Transceiver |
|
Use Scenario: Input rectification for energy-harvesting circuit powered by piezoelectric transducer (peak 50 mA, 20 V). IC Role / Device Role / Timing Role: AC-to-DC converter front-end with minimal quiescent loss. Use Value: 0.14 μA typ. IR at 10 V extends battery-less operation time by >200 hours per μJ harvested. |
Use Scenario: Reverse current isolation between coin-cell battery and buck-boost PMIC in BLE beacon. IC Role / Device Role / Timing Role: Leakage-suppressing diode in battery backup path. Use Value: Sub-0.5 μA IR prevents >1.2 μA parasitic drain - extending shelf life beyond 5 years at 25 °C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB520S30T2R | Same die, but in SOD-523 package (1.2 × 0.8 mm); VF identical, but Rth(j-a) = 420 K/W on FR4 | Less thermal margin in high-density layouts; unsuitable for sustained 100 mA without copper pour | Select when board area allows larger footprint and thermal constraints are relaxed |
| NSR0230HT1G | 0.2 A IF(AV), 30 V VR, VF = 370 mV @ 10 mA; 12 pF Cd; AEC-Q101 qualified; SOD-923 (1.0 × 0.6 mm) | Higher current rating enables shared use across multiple rails; slightly higher VF increases conduction loss by ~12% | Choose when future-proofing for 150–200 mA loads or multi-rail consolidation is required |
Compared with RB520S30T2R, the RB520CS30L,315 offers superior thermal performance on FR4 via its optimized SOD882 cathode pad layout; versus NSR0230HT1G, it trades 200 mA capability for lower VF and tighter leakage - favoring ultra-low-power over headroom.
Availability
RB520CS30L,315 is available at Aetrix Electronics and suitable for automotive body electronics, USB-C power delivery clamps, industrial sensor nodes, and low-power IoT wireless transceivers requiring stable component supply with AEC-Q101 assurance.
Supply support for RB520CS30L,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors - delivering discrete, logic, and MOSFET solutions engineered for automotive, industrial, and mobile applications.
The RB520CS30L,315 belongs to Nexperia's MEGA Schottky rectifier product line, designed specifically for space-constrained, high-efficiency power management in automotive and portable electronics where low VF and AEC-Q101 compliance are mandatory.
FAQ
Is RB520CS30L,315 suitable for reflow soldering only?
Yes - Nexperia explicitly qualifies RB520CS30L,315 for reflow soldering per JEDEC J-STD-020D only. Wave soldering, hand soldering, or infrared methods are not validated and may cause delamination or interfacial failure due to thermal mismatch in the SOD882 leadless structure.
What is the maximum allowable junction temperature during operation?
The absolute maximum junction temperature is 150 °C. Operation above this limit risks irreversible degradation of the Schottky barrier. Derating curves in the datasheet show that at 100 mA IF(AV), ambient temperature must remain ≤135 °C on FR4 with 1 cm² cathode pad to maintain Tj ≤150 °C.
How does the guard ring affect reliability in automotive applications?
The integrated guard ring mitigates electric field crowding at the die edge, raising the effective breakdown voltage under mechanical stress (e.g., thermal cycling, vibration). This directly improves long-term stability in AEC-Q101 tests like HTRB and TC1000, reducing infant mortality in BCM and lighting modules.
Can RB520CS30L,315 replace RB520S30 in existing designs?
No - RB520S30 uses SOD-323 packaging (1.7 × 1.25 mm) with different thermal pad geometry and solder land pattern. While electrical specs overlap, the SOD882 footprint of RB520CS30L,315 requires PCB redesign; direct replacement would cause solder joint voiding and thermal derating.
RB520CS30L,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOD-882
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 100mA
- Voltage - Forward (Vf) (Max) @ If:
- 450 mV @ 10 mA
- Speed:
- Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 nA @ 10 V
- Capacitance @ Vr, F:
- 10pF @ 1V, 1MHz
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006-2
- Operating Temperature - Junction:
- 150°C (Max)
RB520CS30L,315 FAQ
1.How can I place an order for RB520CS30L,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for RB520CS30L,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RB520CS30L,315 reliable?
The price and inventory of RB520CS30L,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RB520CS30L,315 is usually 5 days.
3.What payment methods are accepted for RB520CS30L,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RB520CS30L,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RB520CS30L,315?
RB520CS30L,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RB520CS30L,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RB520CS30L,315?
For technical support, including RB520CS30L,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RB520CS30L,315 requirements.
6.How does Aetrix verify that RB520CS30L,315 is sourced from the original manufacturer or authorized distributors?
All RB520CS30L,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RB520CS30L,315 meets industry standards.
7.What is the process for return or replacement of RB520CS30L,315?
All RB520CS30L,315 units undergo pre-shipment inspection (PSI). If there is an issue with RB520CS30L,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RB520CS30L,315 part is unused and in its original packaging.
Return procedure for RB520CS30L,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
RB520CS30L,315 Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

