Nexperia USA Inc. RB521CS30L,315
- Part No.:
- RB521CS30L,315
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SOD-882
- Datasheet:
-
RB521CS30L,315.pdf
- Description:
- DIODE SCHOTT 30V 100MA DFN1006-2
- Quantity:
- Payment:

- Shipping:

Inventory:91
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
RB521CS30L from Nexperia is a planar Schottky barrier rectifier with integrated guard ring for stress protection, designed for low-voltage, high-efficiency DC-to-DC conversion and reverse polarity protection. It delivers 100 mA average forward current, 30 V reverse voltage rating, and ultra-low 280–350 mV forward voltage at 10 mA - enabling compact, thermally efficient power management in space-constrained portable electronics.
For engineers reviewing the RB521CS30L datasheet, RB521CS30L pinout, RB521CS30L application, or RB521CS30L equivalent, key selection criteria include its 0.65 mm pitch DFN1006-2 (SOD882) package, 10 µA max reverse leakage at 10 V, 8 pF diode capacitance, and reflow-only soldering requirement - all critical for miniaturized battery-powered designs requiring low conduction loss and robust thermal performance.
Technical Context
This Schottky diode uses a planar silicon structure with an integrated guard ring to suppress edge breakdown and improve reliability under transient stress. Its low VF stems from optimized metal-semiconductor contact and thin epitaxial layer design, minimizing conduction losses in continuous and pulsed operation up to 100 mA average current.
Thermal performance is defined by junction-to-solder-point resistance of 220 K/W (cathode pad) and junction-to-ambient of 395 K/W on standard FR4 - making thermal pad layout and cathode-side copper area essential for sustained 100 mA operation at elevated ambient temperatures.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IF(AV) | 100 mA average forward current - supports continuous low-power rectification without derating on standard FR4 PCB with 1 cm² cathode pad. |
| VR | 30 V reverse voltage - suitable for 24 V rail clamping and 12 V/5 V SMPS secondary-side rectification. |
| VF @ 10 mA | 280–350 mV - reduces conduction loss by >40% vs. standard PN diodes, improving efficiency in low-voltage buck converters. |
| IR @ 10 V | 2–10 µA - ensures minimal standby leakage in always-on battery circuits and reverse-polarity protection paths. |
| Cd @ 1 V | 8 pF - enables fast switching with low capacitive loading in high-frequency (>1 MHz) DC-DC topologies. |
| Rth(j-sp) | 220 K/W - defines thermal bottleneck at cathode solder point; requires ≥1 cm² copper pour for full 100 mA rating. |
| Ptot @ 25 °C | 315 mW - limits maximum dissipation without forced cooling; aligns with 0.1 A × 0.35 V = 35 mW typical loss at rated current. |
Pinout & Package
Encapsulated in a leadless DFN1006-2 (SOD882) plastic package measuring 1.0 mm × 0.6 mm × 0.48 mm with 0.65 mm pitch, the device features a transparent top view and cathode-marking bar on the surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Primary current exit path; connects to ground or negative rail; marking bar identifies this terminal; requires thermal pad for heat dissipation. |
| 2 | Anode (A) | Current entry point; connects to input voltage source or switching node; no thermal pad connection; electrically isolated from cathode pad. |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring integration | Suppresses edge leakage and improves voltage standoff consistency across temperature and process variation. |
| Ultra-low VF profile | 280 mV typ. at 10 mA enables >95% efficiency in 3.3 V → 2.5 V LDO-assisted buck stages. |
| Reflow-only assembly | Validated only for reflow soldering per JEDEC J-STD-020; eliminates risk of thermal damage during hand-soldering. |
| 100 % solderability tested | Guarantees reliable wetting on SnPb and Pb-free pastes, critical for automated placement in high-yield SMT lines. |
| Non-automotive qualification | Rated for industrial and consumer applications; not qualified to AEC-Q200 - excludes automotive use without additional validation. |
Applications
| USB Power Delivery Protection | Wearable Device Charging Circuit |
|---|---|
|
Use Scenario: Reverse polarity protection at USB-C port input to prevent damage from misinserted cables or field-reversed adapters. IC Role / Device Role / Timing Role: Unidirectional current gate placed between connector and PMIC input; conducts only when VIN > VOUT + VF. Use Value: 350 mV max VF minimizes voltage drop across protection path, preserving ≥4.85 V at PMIC input under 500 mA load. |
Use Scenario: Output rectification in miniature 3.7 V Li-ion charging circuit using synchronous buck topology. IC Role / Device Role / Timing Role: Freewheeling diode replacing high-side MOSFET body diode during low-side switch off-time. Use Value: 8 pF capacitance and 10 µA IR reduce switching losses and standby drain, extending battery runtime by 8–12% vs. standard Schottky alternatives. |
| IoT Sensor Node Power Rail | Low-Power BLE Module Supply |
|
Use Scenario: Input rectification for energy-harvesting circuit powered by piezoelectric or solar micro-sources (<100 µW). IC Role / Device Role / Timing Role: AC-to-DC converter front-end; operates in sub-mA forward bias region with minimal leakage-induced discharge. Use Value: 2 µA typ. IR at 10 V prevents >0.5% daily self-discharge in supercapacitor-buffered nodes, enabling multi-month maintenance-free operation. |
Use Scenario: Reverse current blocking between dual power sources (coin cell + USB) in Bluetooth Low Energy peripheral. IC Role / Device Role / Timing Role: OR-ing diode isolating backup battery from main supply during USB enumeration and firmware update. Use Value: 280 mV typ. VF ensures <10 mV dropout at 10 mA sleep current, maintaining stable 3.0 V rail for BLE radio wake-up timing accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Diodes Inc. AP1002CTG | Same SOD882 package, 30 V VR, but VF = 450 mV min at 10 mA - 100 mV higher than RB521CS30L. | Higher conduction loss reduces efficiency in <5 V systems; acceptable where thermal margin exists. | Select if legacy footprint compatibility is required and 150 mV VF penalty is tolerable for cost-sensitive production. |
| Vishay SS12 | SOD-123 package (larger: 2.7 mm × 1.6 mm), 20 V VR, 1 A IF(AV); VF = 500 mV @ 1 A - not directly comparable in size or voltage class. | Requires PCB redesign; suited for higher-current 12 V applications, not ultra-compact 3–5 V designs. | Choose only when board space allows larger footprint and system demands >100 mA average current with 20 V tolerance. |
Compared with AP1002CTG and SS12, RB521CS30L uniquely balances ultra-small size, 30 V rating, and sub-350 mV VF - making it optimal for space-constrained, low-voltage, low-leakage applications where thermal pad utilization and reflow reliability are mandatory.
Availability
RB521CS30L is available at Aetrix Electronics and suitable for USB power protection, wearable charging circuits, IoT sensor node power rails, and low-power BLE module supply requiring stable component supply and consistent SOD882 packaging.
Supply support for RB521CS30L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, discrete, and MOSFET solutions, headquartered in Nijmegen, Netherlands.
This device belongs to Nexperia's Schottky Rectifier product line, engineered specifically for ultra-compact, low-loss power management in portable and battery-operated electronics - emphasizing thermal efficiency, solderability, and parametric consistency.
FAQ
Is RB521CS30L qualified for automotive applications?
No. The datasheet explicitly states this part is non-automotive qualified and lacks AEC-Q200 certification. It is intended for industrial and consumer use only. Automotive designs must select Nexperia's -Q qualified equivalents such as RB521CS30L-Q, which undergo extended temperature cycling and humidity testing.
What is the recommended PCB footprint for RB521CS30L?
The official reflow footprint (Fig. 13) specifies two 0.3 mm × 0.9 mm solder pads spaced 0.65 mm apart, with 0.7 mm × 0.4 mm solder resist openings and 0.05 mm radius corners. A 1 cm² copper pour under the cathode pad is required to achieve rated 100 mA current and 220 K/W Rth(j-sp).
Can RB521CS30L be hand-soldered?
No. The datasheet mandates reflow soldering only (Section 8, Note [4]). Hand-soldering risks thermal damage due to localized overheating beyond the 260 °C peak limit and violates the qualified assembly process - potentially causing intermetallic degradation or delamination in the DFN1006-2 package.
How does the guard ring affect electrical performance?
The integrated guard ring reduces electric field crowding at the die edge, suppressing premature avalanche and lowering IR drift over temperature. Measured data shows <10% increase in IR from –40 °C to 125 °C - versus >50% drift in non-guarded Schottky diodes - ensuring stable reverse blocking in wide-temperature environments.
RB521CS30L,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOD-882
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 100mA
- Voltage - Forward (Vf) (Max) @ If:
- 350 mV @ 10 mA
- Speed:
- Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 10 µA @ 10 V
- Capacitance @ Vr, F:
- 8pF @ 1V, 1MHz
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006-2
- Operating Temperature - Junction:
- 150°C (Max)
RB521CS30L,315 FAQ
1.How can I place an order for RB521CS30L,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for RB521CS30L,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RB521CS30L,315 reliable?
The price and inventory of RB521CS30L,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RB521CS30L,315 is usually 5 days.
3.What payment methods are accepted for RB521CS30L,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RB521CS30L,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RB521CS30L,315?
RB521CS30L,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RB521CS30L,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RB521CS30L,315?
For technical support, including RB521CS30L,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RB521CS30L,315 requirements.
6.How does Aetrix verify that RB521CS30L,315 is sourced from the original manufacturer or authorized distributors?
All RB521CS30L,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RB521CS30L,315 meets industry standards.
7.What is the process for return or replacement of RB521CS30L,315?
All RB521CS30L,315 units undergo pre-shipment inspection (PSI). If there is an issue with RB521CS30L,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RB521CS30L,315 part is unused and in its original packaging.
Return procedure for RB521CS30L,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
RB521CS30L,315 Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

