Diodes Incorporated RDBF2510-13

Overview

RDBF2510-13 from Diodes Incorporated is a surface-mount fast bridge rectifier with 1000 V peak repetitive reverse voltage (V_RRM), 2.5 A average output current (I_O), 1.3 V forward voltage drop at 2.5 A, and 150 ns reverse recovery time - designed for AC-to-DC full-wave rectification in offline SMPS and LED driver power stages.

For engineers reviewing the RDBF2510-13 datasheet, RDBF2510-13 pinout, RDBF2510-13 application, or RDBF2510-13 equivalent, key selection criteria include V_RRM margin for surge tolerance, thermal resistance (R_θJC = 7.8 °C/W), low-leakage performance (I_R = 5 µA @ 25°C), and DBF package compatibility with high-density SMT layouts.

Technical Context

This device integrates four fast-switching silicon diodes in a single-phase bridge configuration with glass-passivated junctions. Its 150 ns reverse recovery time enables efficient operation in 50–100 kHz switching power supplies, while the 75 A non-repetitive surge rating supports transient line-voltage events without failure.

The DBF package features a compact 8.5 mm × 6.45 mm footprint with exposed thermal pad geometry optimized for PCB copper pour heat sinking. Junction-to-case thermal resistance of 7.8 °C/W allows sustained 2.5 A conduction at T_C = +110°C when mounted per JEDEC-standard layout guidelines.

Key Specifications

Pinout & Package

Package: DBF - Surface-mount, 4-terminal molded plastic package (UL 94V-0), 8.50–8.90 mm length × 6.45–6.85 mm width × 1.30–1.50 mm height, with polarity marking on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with RDBF2510-13, MSB30TM offers higher current capacity and lower losses for next-generation designs, while GBU6K provides mechanical ruggedness and derated thermal performance in legacy through-hole assemblies - both require layout revision but retain identical voltage rating and functional bridge topology.

Availability

RDBF2510-13 is available at Aetrix Electronics and suitable for LED lighting drivers, universal-input AC/DC adapters, and home appliance SMPS requiring stable component supply despite its obsolete status and controlled end-of-life distribution.

Supply support for RDBF2510-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.

The RDBF2510-13 belongs to Diodes' fast bridge rectifier product line, engineered for high-efficiency AC/DC conversion in space-constrained, thermally demanding power supplies - emphasizing low V_F, fast t_RR, and robust surge handling.

FAQ

Is RDBF2510-13 still in active production?

No - Diodes Incorporated has officially discontinued RDBF2510-13 and marked it obsolete per DS39411 Rev. 4. It is available only from authorized distributors holding remaining inventory, with no future manufacturing planned. Customers are directed to migrate to the MSB30TM as the designated replacement.

What is the maximum operating temperature for RDBF2510-13?

The RDBF2510-13 has an operating junction temperature range of –55°C to +150°C. Its 2.5 A average output current rating is specified at case temperature T_C = +110°C, requiring adequate PCB copper area or thermal vias to maintain safe junction temperatures under continuous load.

Can RDBF2510-13 be used in automotive applications?

RDBF2510-13 is not AEC-Q200 qualified and lacks PPAP documentation or IATF 16949-certified manufacturing traceability. While its –55°C to +150°C rating meets ambient temperature requirements, Diodes explicitly states that automotive use requires contacting their representative for qualified alternatives like the MSB30TM-A or other AEC-compliant bridges.

How does the DBF package compare to SMB or GBU packages in thermal performance?

The DBF package achieves R_θJC = 7.8 °C/W - significantly better than SMB (≈25 °C/W) and competitive with GBU (≈6–8 °C/W) - due to its larger copper-exposed base and optimized internal die attach. Unlike SMB, DBF supports 2.5 A continuously; unlike GBU, it enables automated SMT assembly without wave-soldering constraints.