Diodes Incorporated S1G-13-F

Overview

S1G-13-F from Diodes Incorporated is a 1.0A surface-mount glass passivated silicon rectifier diode in SMA package, rated for 400V peak repetitive reverse voltage (VRRM), 1.1V maximum forward voltage at 1.0A, and 30A non-repetitive surge current. It serves as a primary AC/DC input rectifier in offline power supplies for consumer adapters and industrial SMPS.

For engineers reviewing the S1G-13-F datasheet, S1G-13-F pinout, S1G-13-F application, or S1G-13-F equivalent, key selection criteria include its 400V blocking capability, 1.0A average forward current at 100°C terminal temperature, 3.0μs max reverse recovery time, and RoHS-compliant lead-free matte tin plating compatible with automated reflow assembly.

Technical Context

This device operates as a unidirectional, single-phase, half-wave rectifier under resistive or inductive loads at 60Hz. Its glass passivated die construction ensures stable junction integrity and high reliability against moisture and thermal cycling.

The diode exhibits low 10pF typical junction capacitance at 1MHz/4V reverse bias and a thermal resistance of 30°C/W (junction-to-terminal) when mounted on 5.0mm² copper pads-enabling effective heat dissipation in compact board layouts without auxiliary heatsinking.

Key Specifications

Pinout & Package

Package: SMA (DO-214AC), molded plastic case with UL 94V-0 flammability rating, cathode indicated by band on body. Terminal plating: matte tin, solderable per MIL-STD-202 Method 208.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar silicon rectifier applications.

Compared with MUR140 and 1N4007, S1G-13-F delivers optimal balance of surge robustness, RoHS compliance, and mid-speed recovery for mainstream 50–100kHz AC/DC front-ends-making it preferred for volume production with automated SMT lines.

Availability

S1G-13-F is available at Aetrix Electronics and suitable for AC/DC wall adapters, industrial SMPS inputs, and LED driver power stages requiring stable component supply, consistent parametric performance across batches, and full traceability to Diodes Incorporated wafer lots.

Supply support for S1G-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the US.

S1G-13-F belongs to the S1x-13-F series of general-purpose surface-mount rectifiers engineered for cost-sensitive, high-volume power conversion applications where reliability, manufacturability, and regulatory compliance are prioritized over ultrafast switching.

FAQ

What is the maximum allowable PCB pad temperature for continuous operation?

The S1G-13-F is rated for 1.0A average forward current at a terminal temperature (TT) of +100°C. This corresponds to a measured PCB copper pad temperature-not ambient-so thermal design must ensure the SMA package's metal tab reaches ≤100°C under worst-case load and airflow conditions. Derating begins above this point per Figure 1 in DS16003.

Is S1G-13-F suitable for use in a full-wave bridge configuration?

Yes, S1G-13-F can be used in discrete full-wave bridge configurations (e.g., four units). Each device must be individually rated for the peak inverse voltage seen across it-400V VRRM supports up to ~280VAC RMS input in standard bridge arrangements. Ensure matched thermal mounting for balanced current sharing and avoid mixing with diodes of differing trr or VFM.

Does the "-13-F" suffix indicate tape-and-reel packaging?

Yes. The "-13-F" suffix denotes commercial-grade qualification, SMA package, and packaging in 5,000-piece tape-and-reel format per EIA-481 standards. The "F" specifically indicates lead-free, halogen-free, RoHS-compliant finish; "13" refers to Diodes Incorporated's internal package and processing code for this variant.

How does the 30°C/W thermal resistance translate to real-world PCB layout?

RθJT = 30°C/W assumes mounting on 5.0mm² (0.013mm thick) copper pads acting as thermal planes. To achieve this, designers must provide ≥5mm² exposed copper connected to the anode/cathode pads via multiple thermal vias to inner or backside ground planes. Reducing pad area or omitting vias increases effective RθJT and risks exceeding 100°C terminal temperature at full load.