Diodes Incorporated S2AA-13

Overview

S2AA-13 from Diodes Incorporated is a glass-passivated surface-mount silicon rectifier diode in SMA package, rated for 50 V peak repetitive reverse voltage (V_RRM), 1.5 A average forward current (I_AV), and 50 A non-repetitive surge current (I_FSM), designed for AC/DC conversion in compact power supplies and adapter circuits.

For engineers reviewing the S2AA-13 datasheet, S2AA-13 pinout, S2AA-13 application, or S2AA-13 equivalent, key selection criteria include its low 1.15 V forward voltage at 1.5 A, 20 pF junction capacitance, 20 °C/W thermal resistance, RoHS-compliant lead-free finish, and suitability for automated SMT assembly with JEDEC-standard half-sine surge rating.

Technical Context

This device operates as a single-phase, half-wave rectifier under 60 Hz line-frequency conditions with resistive or inductive loads; capacitive loads require 20% current derating. Its glass-passivated die construction ensures stable reverse leakage (<5 µA @ 25°C) and high-temperature reliability up to +150°C junction temperature.

Thermal performance is defined with the device mounted on a 5.0 mm² copper pad (0.013 mm thick); forward current derating begins at 100°C terminal temperature, reaching zero at 150°C. The SMA package enables high-density PCB layout while maintaining adequate thermal dissipation for low-to-medium power applications.

Key Specifications

Pinout & Package

Package: SMA (Surface-Mount Axial), molded plastic case per UL 94V-0, cathode identified by band marking. Approximate weight: 0.064 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar rectifier diode applications.

Compared with 1N4001-T and ES1J, S2AA-13 delivers optimal balance of low forward loss, SMT compatibility, and surge robustness specifically for 50 V-class AC/DC outputs-making it superior for high-volume, thermally constrained, automated manufacturing environments.

Availability

S2AA-13 is available at Aetrix Electronics and suitable for AC-DC wall adapters, USB power delivery accessories, and industrial control power supplies requiring stable component supply, consistent RoHS compliance, and JEDEC-qualified surge performance.

Supply support for S2AA-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.

S2AA-13 belongs to the S2A/A–S2M/A glass-passivated rectifier family, engineered for cost-effective, high-yield SMT production in low-to-medium power AC/DC front-end stages with emphasis on thermal stability and surge resilience.

FAQ

What is the maximum allowable junction temperature for S2AA-13?

The absolute maximum junction temperature (T_j) is +150°C, and the device is rated for continuous operation up to this limit when mounted on a 5.0 mm² copper pad per datasheet Note 2. Derating begins at 100°C terminal temperature, with I_AV falling linearly to zero at 150°C.

Can S2AA-13 be used in capacitive-load applications?

Yes, but with mandatory 20% derating of I_AV - i.e., maximum average current drops from 1.5 A to 1.2 A - due to increased peak current stress caused by capacitor charging transients. This requirement is explicitly stated in the datasheet's "Electrical Characteristics" section.

Is S2AA-13 pin-compatible with S2A-13?

No - S2AA-13 uses the SMA package (smaller footprint, 2.29–2.92 mm length), while S2A-13 uses SMB (3.30–3.94 mm length). Though both are cathode-band-marked axial diodes, their land patterns, thermal pads, and mechanical clearances differ and are not interchangeable without PCB redesign.

Does S2AA-13 meet RoHS requirements without exemptions?

It complies with RoHS Directive 2011/65/EU under Annexes V and VI exemptions for lead in high-melting-temperature solder (lead content ≤ 85 wt%) and glass in semiconductor devices (per EU Directive Annex Notes 5 and 7), as confirmed in DS16004 Rev. 9–2 footnote 3.