Diodes Incorporated S2AA-13-F

Overview

S2AA-13-F from Diodes Incorporated is a glass passivated surface-mount silicon rectifier diode in SMA package, rated for 50 V peak repetitive reverse voltage (VRRM), 1.5 A average forward current (I(AV)), and 50 A non-repetitive surge current (IFSM). It delivers low 1.15 V forward voltage drop at 1.5 A and exhibits only 5.0 µA peak reverse current at 25°C, making it suitable for AC/DC input rectification in compact power supplies.

For engineers reviewing the S2AA-13-F datasheet, S2AA-13-F pinout, S2AA-13-F application, or S2AA-13-F equivalent, key selection considerations include its 50 V blocking rating, thermal resistance of 20 °C/W (junction-to-terminal), RMS reverse voltage of 35 V, 20 pF junction capacitance at 1 MHz, and compliance with RoHS and halogen-free requirements.

Technical Context

This device operates as a single-phase, half-wave rectifier under resistive or inductive loads at 60 Hz. Its glass passivated die construction ensures stable reverse leakage performance up to 125°C, where IRM rises to 125 µA, and enables robust surge handling per JEDEC standards.

The SMA package supports automated assembly and provides defined thermal pathing via 5.0 mm² copper pads, yielding a typical RθJT of 20 °C/W. Forward current derating begins at terminal temperatures above 25°C, reaching 1.5 A only at TT = 100°C per Fig. 1.

Key Specifications

Pinout & Package

The S2AA-13-F uses an SMA (DO-214AC) surface-mount package with cathode band polarity marking. The two-terminal configuration supports PCB-level rectification with standardized pad layout per Diodes Inc. outline drawing.

Key Features

Applications

Availability

S2AA-13-F is available at Aetrix Electronics and suitable for AC-DC wall adapters, industrial control power supplies, and LED driver input stages requiring stable component supply, RoHS compliance, and consistent thermal performance.

Supply support for S2AA-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, application-optimized components for power management and signal conditioning.

The S2A/A–S2M/A series targets cost-sensitive, high-volume rectification applications where thermal stability, surge robustness, and regulatory compliance are essential-especially in consumer and industrial off-line power supplies.

FAQ

What is the maximum junction temperature for S2AA-13-F?

The S2AA-13-F has an operating junction temperature range of –65°C to +150°C. Its thermal resistance (RθJT) is 20 °C/W when mounted on a 5.0 mm² copper pad, allowing calculation of actual TJ based on power dissipation and terminal temperature. Derating curves in DS16004 confirm safe operation up to 100°C terminal temperature at full 1.5 A load.

Is S2AA-13-F compatible with lead-free reflow processes?

Yes. S2AA-13-F features a matte tin lead-free finish compliant with RoHS Directive 2002/95/EC and is qualified per MIL-STD-202, Method 208. Its moisture sensitivity level is Level 1, meaning it can be processed directly in standard Pb-free reflow profiles without pre-baking.

How does S2AA-13-F differ from S2A-13-F?

S2AA-13-F uses the SMA (DO-214AC) package, while S2A-13-F uses the larger SMB (DO-214AA) package. Both share identical electrical specs (50 V VRRM, 1.5 A I(AV)), but SMA offers smaller footprint (2.29 × 4.00 mm vs. 3.30 × 4.06 mm) and lower weight (0.064 g vs. 0.093 g), enabling denser board layouts.

Can S2AA-13-F replace a 1N4001 in new designs?

No-S2AA-13-F (50 V VRRM) matches the 1N4001's voltage rating but differs in package (SMA vs. DO-41), surge rating (50 A vs. 30 A), and thermal performance (RθJT = 20 °C/W vs. ~65 °C/W). While electrically comparable for low-power use, its surface-mount form factor and higher surge capability require PCB redesign and may not be drop-in compatible.