Diodes Incorporated S2BA-13-F

Overview

S2BA-13-F from Diodes Incorporated is a surface-mount, glass-passivated general-purpose rectifier diode in SMB package, rated for 100 V peak repetitive reverse voltage (VRRM), 1.5 A average forward current (I(AV)), and 50 A non-repetitive surge current (IFSM). It delivers low 1.15 V forward voltage drop at 1.5 A and exhibits only 5.0 µA peak reverse current at 25°C, making it suitable for AC/DC input stage rectification in compact power supplies.

For engineers reviewing the S2BA-13-F datasheet, S2BA-13-F pinout, S2BA-13-F application, or S2BA-13-F equivalent, key selection criteria include its SMB footprint compatibility, thermal resistance of 20 °C/W (junction-to-terminal), 100 V blocking capability, RoHS-compliant matte tin plating, and suitability for automated SMT assembly with moisture sensitivity level 1.

Technical Context

This device operates as a single-phase, half-wave silicon rectifier optimized for resistive or inductive loads at 60 Hz. Its glass passivation ensures stable junction characteristics under thermal cycling, while the molded plastic case meets UL 94V-0 flammability rating.

The diode's electrical behavior follows standard PN-junction conduction: forward conduction begins near 0.7 V, reaches 1.15 V at rated 1.5 A DC, and maintains <5 µA leakage up to 100 V reverse bias at room temperature - increasing to 125 µA at 125°C.

Key Specifications

Pinout & Package

Package: SMB (Surface Mount Body), molded plastic case per JEDEC DO-214AA outline; dimensions: 4.06–4.57 mm (L) × 3.30–3.94 mm (W) × 1.96–2.21 mm (H); cathode identified by band marking.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar general-purpose rectifier applications.

Compared with MURS120T3G and ES1B-E3/57T, S2BA-13-F offers superior surge robustness (50 A vs. 30–35 A) and lower thermal resistance (20 °C/W vs. ~25–30 °C/W), making it preferred for high-reliability, thermally constrained 50/60 Hz rectification where fast recovery is unnecessary.

Availability

S2BA-13-F is available at Aetrix Electronics and suitable for AC/DC adapters, industrial control power supplies, and LED driver input stages requiring stable component supply, consistent RoHS compliance, and long-term manufacturability.

Supply support for S2BA-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, cost-optimized components for power management, signal integrity, and protection.

S2BA-13-F belongs to the S2x/A series of general-purpose rectifiers designed for broad adoption in cost-sensitive, high-volume AC/DC conversion applications across consumer, industrial, and lighting markets.

FAQ

What is the maximum allowable junction temperature for S2BA-13-F?

The absolute maximum junction temperature is +150°C, and the device is rated for continuous operation up to this limit when average forward current is derated according to the published curve (Fig. 1). At terminal temperature (TT) = 100°C, the full 1.5 A I(AV) rating applies; above that, current must be reduced linearly to zero at 150°C.

Is S2BA-13-F suitable for use in a full-wave bridge configuration?

Yes - S2BA-13-F can be used as one leg of a discrete full-wave bridge rectifier. Four units provide 100 V PIV and 1.5 A DC output capability. Ensure matched thermal mounting for all four devices to prevent current imbalance, and verify total power dissipation does not exceed system thermal limits.

Does S2BA-13-F require pre-baking before reflow soldering?

No - S2BA-13-F has Moisture Sensitivity Level 1 per J-STD-020, meaning it may be stored indefinitely at ≤30°C/60% RH and placed directly into reflow without baking. This simplifies SMT line integration and eliminates moisture-related popcorning risk.

How does the green molding compound affect thermal performance?

The halogen- and antimony-free green compound has identical thermal conductivity and coefficient of expansion to standard FR-4-compatible molding compounds. No thermal derating is required; the 20 °C/W RθJT value remains valid, and UL 94V-0 flammability is fully retained.