Diodes Incorporated S2GA-13-F

Overview

S2GA-13-F from Diodes Incorporated is a surface-mount, glass-passivated general-purpose rectifier diode rated for 400 V peak repetitive reverse voltage (VRRM), 1.5 A average forward current (I(AV)), and 50 A non-repetitive surge current (IFSM). It features low 1.15 V forward voltage drop at 1.5 A and 5 µA peak reverse current at 25°C, used in AC/DC input stage rectification for industrial power supplies and consumer adapters.

For engineers reviewing the S2GA-13-F datasheet, S2GA-13-F pinout, S2GA-13-F application, or S2GA-13-F equivalent, key selection criteria include VRRM rating, thermal resistance (20 °C/W), junction-to-terminal thermal path, RoHS-compliant matte tin plating, and SMB package compatibility with automated SMT assembly.

Technical Context

This device operates as a single-phase, half-wave silicon rectifier optimized for resistive or inductive loads at 60 Hz. Its glass-passivated die construction ensures stable reverse leakage performance up to 125°C, where IRM rises to 125 µA under rated DC blocking voltage.

The SMB package provides a defined thermal interface with 20 °C/W junction-to-terminal resistance when mounted on 5.0 mm² copper pads. Forward current derating begins above 25°C ambient, reaching 1.5 A only at terminal temperature ≤100°C per Fig. 1.

Key Specifications

Pinout & Package

The S2GA-13-F is housed in an SMB (DO-214AA) plastic package with cathode band polarity marking. The two-terminal device has no internal connections beyond anode and cathode leads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar general-purpose rectifier applications.

Compared with MURS440T3G and VS-1N4007TR, S2GA-13-F delivers optimal balance of cost, thermal performance in SMB, and RoHS/Green compliance for standard 50/60 Hz rectification-without over-specifying speed or sacrificing manufacturability.

Availability

S2GA-13-F is available at Aetrix Electronics and suitable for AC-DC power adapters, industrial control power supplies, and LED driver input stages requiring stable component supply, consistent SMB footprint, and RoHS-compliant sourcing.

Supply support for S2GA-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, application-optimized components for power management, signal integrity, and protection.

S2GA-13-F belongs to the S2x/A series of general-purpose rectifiers designed specifically for cost-effective, robust AC/DC front-end conversion in industrial, consumer, and appliance applications.

FAQ

What is the maximum allowable junction temperature for S2GA-13-F?

The absolute maximum junction temperature is +150°C, but sustained operation requires limiting terminal temperature to ≤100°C to maintain 1.5 A average forward current. Derating curves in DS16004 show current drops to ~1.0 A at 125°C terminal temperature due to thermal resistance limitations.

Can S2GA-13-F replace S2JA-13-F in a design?

No-S2JA-13-F is rated for 600 V VRRM, while S2GA-13-F is rated for 400 V. Substituting it in a 600 V design risks reverse breakdown under transient overvoltage or line surges. Always verify VRRM margin against worst-case AC input and clamping levels.

Is S2GA-13-F suitable for use in a bridge rectifier configuration?

Yes-it can be used as one leg of a discrete bridge rectifier. Each diode sees only half the peak inverse voltage of the full bridge, so its 400 V VRRM supports up to ~280 V RMS AC input. Ensure matching thermal layout across all four devices for balanced current sharing.

Does S2GA-13-F require a heatsink in typical operation?

Not as a standalone component-but thermal performance depends on PCB copper area. With ≥5.0 mm² of 0.013 mm thick copper pad per terminal, junction-to-ambient rise is manageable at 1.5 A. For sustained >1 A in enclosed spaces, additional copper pour or thermal vias are recommended.