Diodes Incorporated S2K-13-F

Overview

S2K-13-F from Diodes Incorporated is a surface-mount, glass-passivated silicon rectifier diode rated for 800 V peak repetitive reverse voltage (VRRM), 1.5 A average forward current (I(AV)), and 50 A non-repetitive surge current (IFSM). It operates across –65 °C to +150 °C, features low 1.15 V forward voltage at 1.5 A, and is packaged in SMB with matte tin-plated terminals for automated assembly in power supply front-end rectification.

For engineers reviewing the S2K-13-F datasheet, S2K-13-F pinout, S2K-13-F application, or S2K-13-F equivalent, key selection criteria include its 800 V blocking capability, thermal resistance of 20 °C/W (junction-to-terminal), 20 pF junction capacitance at 1 MHz, 5 µA max reverse leakage at 25 °C, and RoHS-compliant green molding compound.

Technical Context

This SMB-packaged rectifier is designed for single-phase, half-wave AC-to-DC conversion under resistive or inductive loads at 60 Hz. Its glass-passivated die construction ensures stable reverse characteristics and high reliability under repeated surge stress up to 50 A (8.3 ms half-sine).

Thermal performance is defined with a 5.0 mm² copper pad as heatsink per JEDEC standards; derating begins above 25 °C ambient, reaching 1.5 A only at terminal temperature ≤100 °C. Reverse leakage rises to 125 µA at 125 °C, confirming suitability for industrial environments with elevated ambient temperatures.

Key Specifications

Pinout & Package

S2K-13-F is housed in an SMB (DO-214AA) surface-mount plastic package with cathode band polarity marking. The case meets UL 94V-0 flammability rating and moisture sensitivity level 1 per J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage rectifier applications.

Compared with MUR160 and VS-1N5408, S2K-13-F offers optimal balance of surge robustness, thermal resistance, and RoHS/green compliance for modern SMT-based industrial power supplies-without ultrafast timing overhead or through-hole constraints.

Availability

S2K-13-F is available at Aetrix Electronics and suitable for AC/DC power supply input stages, industrial motor drive front-ends, and LED driver bulk rectification requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.

Supply support for S2K-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

S2K-13-F belongs to the S2A–S2M series of general-purpose glass-passivated rectifiers engineered for cost-sensitive, high-reliability AC/DC conversion in industrial, lighting, and consumer power applications.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The S2K-13-F has a maximum junction temperature of +150 °C, but its average forward current rating of 1.5 A is specified only at terminal temperature ≤100 °C. Operation above this requires derating per Figure 1 in DS16004; sustained junction temperatures beyond 150 °C will cause irreversible degradation.

Is S2K-13-F suitable for use in a full-wave bridge configuration?

Yes-S2K-13-F is commonly used as one leg in discrete full-wave bridge rectifiers. Its 800 V VRRM and 50 A IFSM make it appropriate for standard 240 VAC inputs. Ensure matched devices are used for balanced current sharing and thermal distribution across all four legs.

Does the "-13-F" suffix indicate tape-and-reel packaging?

Yes-the "-13-F" suffix denotes SMB package in 3,000-piece tape-and-reel format per Diodes Incorporated's ordering nomenclature. The "F" confirms RoHS-compliant, lead-free finish; "13" refers to the standard reel size and packaging method defined in their internal logistics system.

How does the green molding compound affect PCB assembly?

The halogen- and antimony-free green compound eliminates corrosive gas emission during reflow, preventing solder joint oxidation and contact corrosion. It complies with IPC-4101D/126 and JEDEC J-STD-020, supporting standard Pb-free reflow profiles without requiring process adjustments.