Diodes Incorporated S3A-13-F

Overview

S3A-13-F from Diodes Incorporated is a 3.0A, 50V peak repetitive reverse voltage (VRRM), glass passivated surface-mount rectifier in SMC package, featuring 1.15V forward voltage at 3.0A, 100A non-repetitive surge capability, and RoHS-compliant matte tin plating - used in AC/DC input stage rectification for industrial power supplies.

For engineers reviewing the S3A-13-F datasheet, S3A-13-F pinout, S3A-13-F application, or S3A-13-F equivalent, key selection criteria include VRRM rating, IF(AV) derating curve compliance at +75°C, thermal resistance (RθJT = 10°C/W), junction temperature range (–65°C to +150°C), and SMB/SMC package footprint compatibility.

Technical Context

This device operates as a single-phase, half-wave silicon rectifier with glass passivated die construction ensuring stable reverse leakage (<10 µA at 25°C, <250 µA at 125°C) and low forward conduction loss. Its 40 pF typical junction capacitance supports moderate-frequency switching up to ~1 MHz under reverse bias.

The SMC package provides higher thermal mass than SMB, enabling sustained 3.0A average output current when mounted on a 5.0 mm² copper pad (RθJT = 10°C/W). Derating begins above +75°C case temperature per Figure 1, with full current permitted only below that threshold.

Key Specifications

Pinout & Package

SMC package: molded plastic case (UL 94V-0), cathode indicated by band or notch, matte tin-plated terminals solderable per MIL-STD-202 Method 208.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar silicon rectifier applications.

Compared with MUR350 and VS-3A50, the S3A-13-F offers the highest surge tolerance (100A) and lowest forward drop (1.15 V), making it optimal for cost-sensitive, thermally constrained, line-frequency rectification where ultrafast recovery is unnecessary.

Availability

S3A-13-F is available at Aetrix Electronics and suitable for industrial AC/DC power supplies, LED driver input stages, and embedded system auxiliary power requiring stable component supply, RoHS/Green compliance, and SMC-package thermal reliability.

Supply support for S3A-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, serving industrial, computing, consumer, and communications markets since 1960.

The S3A/B series belongs to Diodes' general-purpose rectifier product line, engineered specifically for cost-effective, high-reliability AC/DC front-end conversion in space- and thermal-constrained applications.

FAQ

What is the maximum allowable junction temperature for S3A-13-F?

The absolute maximum junction temperature is +150°C, as specified in the Thermal Characteristics table. Operation beyond this limit risks permanent degradation of the glass passivation layer and increased reverse leakage. Derating curves assume terminal temperature (TT) ≤ +75°C for full 3.0A rating; actual TJ depends on RθJT, power dissipation, and heatsinking.

Can S3A-13-F be used in full-wave bridge configurations?

No - S3A-13-F is a single diode in SMC package and lacks internal bridge topology. It can serve as one leg of an external discrete bridge (e.g., four S3A units), but its pinout and thermal profile are not optimized for shared-heatsink bridge layouts. Dedicated bridge rectifiers like DB107S provide better thermal coupling and layout efficiency.

Is the S3A-13-F suitable for use with capacitive input filters?

Yes, but with current derating: the datasheet explicitly states "For capacitance load, derate current by 20%." At 3.0A rated average current, this means limiting IF(AV) to 2.4A when feeding a large reservoir capacitor to avoid excessive peak forward current stress during charging pulses.

How does the SMC package of S3A-13-F compare thermally to the SMB version (S3AB-13-F)?

The SMC package has higher thermal mass and larger copper pad area (per AP02001 layout), yielding lower RθJT (10°C/W vs. ~15°C/W for SMB). This allows S3A-13-F to sustain 3.0A at higher ambient temperatures or with less PCB copper, while S3AB-13-F requires stricter thermal design for equivalent performance.