Diodes Incorporated S3JB-13-F

Overview

S3JB-13-F from Diodes Incorporated is a 600 V, 3.0 A surface-mount glass passivated rectifier diode in SMB package, designed for AC/DC input stage rectification in power supplies and adapters, with 100 A non-repetitive surge capability and 1.15 V forward voltage at 3.0 A.

For engineers reviewing the S3JB-13-F datasheet, S3JB-13-F pinout, S3JB-13-F application, or S3JB-13-F equivalent, key selection criteria include peak reverse voltage (600 V), average forward current (3.0 A @ T_T = +75°C), thermal resistance (10 °C/W), and RoHS-compliant lead-free plating on SMB-qualified terminals.

Technical Context

This device operates as a single-phase, half-wave silicon rectifier optimized for high-efficiency, space-constrained AC/DC front-end conversion. Its glass passivated junction ensures stable reverse leakage (<250 µA at +125°C) and robust surge immunity (100 A, 8.3 ms sine wave).

The SMB package enables automated placement while delivering low thermal resistance (10 °C/W junction-to-terminal) when mounted on a 5.0 mm² copper pad. Its 40 pF typical junction capacitance supports moderate-frequency switching applications without excessive EMI generation.

Key Specifications

Pinout & Package

Package: SMB (Surface-Mount Small Outline), molded plastic case per UL 94V-0, cathode indicated by band on top surface. Terminal plating: matte tin, solderable per MIL-STD-202 Method 208.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar rectifier diode applications.

Compared with STTH3L06S and MBR360SFT1G, S3JB-13-F uniquely balances 600 V blocking, SMB footprint, and 100 A surge in a cost-optimized glass-passivated silicon rectifier-making it optimal for mainstream AC/DC adapters where size, reliability, and line-voltage compatibility are jointly constrained.

Availability

S3JB-13-F is available at Aetrix Electronics and suitable for AC/DC adapters, industrial power supplies, and LED driver front-end rectification requiring stable component supply, consistent SMB packaging, and RoHS/Green compliance across production lots.

Supply support for S3JB-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, application-optimized components for power management and signal integrity.

S3JB-13-F belongs to the S3x/B series of surface-mount rectifiers engineered for cost-sensitive, high-volume AC/DC conversion applications where thermal performance, surge robustness, and automated assembly compatibility are essential.

FAQ

What is the maximum allowable junction temperature for S3JB-13-F?

The absolute maximum junction temperature is +150°C, as specified in the Thermal Characteristics table. Operation above this limit risks permanent degradation of the passivated junction. Derating curves in Figure 1 show that average forward current must be reduced to 2.0 A at +100°C terminal temperature to maintain safe junction operation.

Is S3JB-13-F suitable for use in a full-wave bridge configuration?

No-S3JB-13-F is a single diode, not a bridge rectifier. It can be used as one leg of a discrete full-wave bridge (e.g., four S3JB-13-F units), but its SMB package lacks internal bridge topology. For integrated solutions, consider Diodes Inc.'s DB107S or GBU6K, which provide four-diode bridges in compact packages.

Does S3JB-13-F require a heatsink in typical 3 A operation?

A dedicated heatsink is not required if the PCB provides adequate copper area: the datasheet specifies thermal resistance of 10 °C/W junction-to-terminal when mounted on a 5.0 mm² (0.013 mm thick) copper pad. With 1.15 V forward drop at 3 A, power dissipation is ~3.45 W-resulting in ~34.5°C rise above terminal temperature under those conditions.

How does the SMB package of S3JB-13-F compare to SMC in terms of thermal performance?

The SMB package has lower thermal mass and slightly higher R_θJT than SMC variants (e.g., S3J-13-F). While both share identical electrical specs, the SMC version offers ~25% lower thermal resistance due to larger copper pad contact area and greater case volume-making it preferable for continuous 3 A operation above +85°C ambient, whereas SMB suits space-constrained designs with moderate thermal loads.