Diodes Incorporated SBR15U50SP5-13

Overview

SBR15U50SP5 from Diodes Incorporated is a 15A Super Barrier Rectifier (SBR®) in PowerDI5 package, rated for 50V reverse voltage, with max forward voltage of 0.52V at 15A/125°C and max reverse leakage of 0.5mA at 50V/25°C. It serves as a high-efficiency rectifier, freewheeling diode, or polarity protection device in compact power supplies.

For engineers reviewing the SBR15U50SP5 datasheet, SBR15U50SP5 pinout, SBR15U50SP5 application, or SBR15U50SP5 equivalent, key selection criteria include low VF stability across temperature, avalanche energy rating (1600mJ @10A), thermal resistance (RθJL = 2.5°C/W), and compatibility with thin-profile DC/DC converters and AC/DC adapters.

Technical Context

This SBR uses patented Super Barrier Rectifier technology to achieve lower forward voltage than Schottky diodes while maintaining superior high-temperature reverse leakage stability. Its structure enables operation up to +150°C junction temperature with minimal IR drift.

The PowerDI5 package provides low thermal resistance (RθJL = 2.5°C/W) and ultra-low profile (<1.1mm), enabling direct thermal coupling to PCB copper. It supports high surge current handling (IFSM = 256A, 8.3ms) and robust avalanche capability (EAS = 1600mJ at 10A).

Key Specifications

Pinout & Package

Package: PowerDI5 - surface-mount, thermally enhanced, lead-free, halogen-free molded plastic package with 1.1mm max height and 0.093g mass. Cathode and anode terminals are exposed on bottom side for direct PCB thermal conduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar super barrier rectifier applications.

Compared with VS-15EWH05-M3 and SBRA15U50, the SBR15U50SP5 delivers the lowest thermal resistance (2.5°C/W), smallest profile (<1.1mm), and full automotive change control readiness - making it optimal for next-gen thin, high-reliability power stages.

Availability

SBR15U50SP5 is available at Aetrix Electronics and suitable for DC/DC converters, AC/DC adapters, and industrial power supplies requiring stable component supply, consistent thermal performance, and RoHS-compliant green packaging.

Supply support for SBR15U50SP5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The SBR® Super Barrier Rectifier product line targets high-efficiency, high-temperature power conversion applications where Schottky limitations in leakage and thermal stability must be overcome without resorting to slower, higher-VF PN diodes.

FAQ

What is the maximum junction temperature for continuous operation?

The SBR15U50SP5 is rated for continuous operation from –65°C to +150°C junction temperature. Derating begins above +25°C ambient per Figure 6; at TA = +85°C, IO is reduced to approximately 9.5A for D = 0.5 duty cycle, ensuring TJ stays within limit under typical PCB thermal conditions.

Is this diode suitable for automotive applications?

Yes - the SBR15U50SP5 is manufactured in IATF 16949 certified facilities and supports PPAP documentation. While not pre-qualified to AEC-Q101, Diodes Incorporated offers change-controlled automotive-grade versions upon request, including extended temperature screening and lot-level traceability.

How does its reverse recovery time compare to standard Schottky diodes?

The SBR15U50SP5 has tRR = 50ns, measured under IF = 0.5A, IR = 1A, IRR = 0.25A. This is comparable to mid-performance Schottkys and significantly faster than PN rectifiers (>500ns), enabling use in 300kHz–1MHz switching topologies without excessive switching loss or ringing.

What is the recommended PCB pad layout for thermal performance?

Per DS36167 Rev.6, the cathode pad should be 18.8mm × 14.4mm and the anode pad 5.6mm × 14.4mm on 2oz copper FR-4. This achieves RθJA = 39°C/W. Smaller pads increase thermal resistance proportionally; internal copper planes and thermal vias further improve dissipation in production layouts.