Diodes Incorporated SBR30A100CTE-G

Overview

SBR30A100CTE-G from Diodes Incorporated is a 30A dual common-cathode super barrier rectifier in TO-262 package, rated for 100V peak reverse voltage, with typical forward voltage of 0.67V at 15A/125°C and 250A non-repetitive surge capability - deployed in high-efficiency AC/DC front-end and DC-DC secondary-side rectification.

For engineers reviewing the SBR30A100CTE-G datasheet, SBR30A100CTE-G pinout, SBR30A100CTE-G application, or SBR30A100CTE-G equivalent, key selection criteria include forward voltage drop at elevated temperature, thermal resistance (RθJC = 3°C/W), soft-switching behavior, RoHS-compliant matte tin terminations, and TO-262 mechanical compatibility with high-current PCB layouts.

Technical Context

This dual-element rectifier integrates two independent 15A-rated super barrier diodes sharing a common cathode terminal, enabling synchronous-like low-loss operation without gate drive. Its patented super barrier structure replaces traditional PN junctions with metal-semiconductor interfaces to suppress minority-carrier injection and reduce stored charge.

Designed for operation up to +175°C junction temperature, it delivers stable VF and IR performance across automotive under-hood and industrial power supply environments. The TO-262 package supports direct heatsink mounting via the exposed drain tab, leveraging its 3°C/W junction-to-case thermal path for high-power density designs.

Key Specifications

Pinout & Package

TO-262 package with 3-terminal configuration: Pin 1 (Anode 1), Pin 2 (Cathode Common), Pin 3 (Anode 2). Exposed metal tab (Pin 2) serves as both electrical cathode connection and primary thermal path to heatsink.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar super barrier rectifier applications.

Compared with SBRT30A100CT, SBR30A100CTE-G offers 25% lower thermal resistance and direct heatsink interface; versus MBR30100CTG, it delivers 0.18V lower VF at 125°C and verified soft recovery - critical for high-frequency, high-reliability power conversion.

Availability

SBR30A100CTE-G is available at Aetrix Electronics and suitable for server power supplies, industrial motor drives, telecom rectifiers, and automotive on-board chargers requiring stable component supply and long-term production continuity.

Supply support for SBR30A100CTE-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The SBR® Super Barrier Rectifier product line was developed to replace conventional Schottky and fast recovery diodes in high-current, high-efficiency power conversion systems where low VF, soft switching, and high-temperature reliability are mandatory.

FAQ

What is the maximum junction temperature rating for SBR30A100CTE-G?

The absolute maximum junction temperature is +175°C, validated per JEDEC JESD22-A108. This rating is supported by measured thermal resistance (RθJC = 3°C/W) and confirmed leakage current stability up to 125°C ambient in the datasheet's Figure 3. Operation beyond 175°C risks permanent degradation of the super barrier interface.

Is SBR30A100CTE-G pin-compatible with standard TO-262 dual-diode rectifiers?

Yes - it uses the industry-standard TO-262-3 (I²PAK) outline with identical 2.54mm lead pitch and mechanical dimensions per DS31872 page 3. Pin 1 (Anode 1), Pin 2 (Common Cathode Tab), and Pin 3 (Anode 2) match JEDEC TO-262 pinout conventions, enabling direct replacement in existing layouts.

Does SBR30A100CTE-G require a thermal pad or solder mask opening on the PCB?

Yes - the exposed metal tab (Pin 2) must be soldered directly to a large copper pour or thermal pad on the PCB, or mounted to an external heatsink using thermally conductive adhesive or mechanical clamp. A solder mask opening matching the tab outline (8.64–9.65mm × 9.65–10.29mm) is required for reliable thermal transfer.

How does the soft switching behavior of SBR30A100CTE-G reduce EMI in high-frequency converters?

Its super barrier architecture eliminates minority carrier storage, resulting in near-zero reverse recovery charge (Qrr) and absence of current snap-off. Measured waveforms show monotonic reverse current decay without voltage overshoot - directly lowering high-frequency spectral content in buck, LLC, and phase-shifted full-bridge topologies operating above 200kHz.