Diodes Incorporated SBR5E60P5-13

Overview

SBR5E60P5-13 from Diodes Incorporated is a 5A, 60V Super Barrier Rectifier (SBR®) in the POWERDI®5 package, featuring ultra-low forward voltage (0.52 V max at 5 A, 25°C), low reverse leakage (0.22 mA max at 60 V, 25°C), and rugged avalanche capability-designed for high-efficiency rectification in compact AC-DC adapters and DC-DC converters.

For engineers reviewing the SBR5E60P5-13 datasheet, SBR5E60P5-13 pinout, SBR5E60P5-13 application, or SBR5E60P5-13 equivalent, key selection criteria include thermal resistance (RθJC = 3 °C/W), high-temperature IR stability (50 mA at 125°C), and low-profile packaging (<1.1 mm height) for space-constrained power stages.

Technical Context

The SBR5E60P5-13 uses patented Super Barrier Rectifier technology to achieve Schottky-like VF with enhanced avalanche ruggedness-critical for handling transient overloads in offline and isolated DC-DC topologies. Its junction-to-case thermal resistance of 3 °C/W enables efficient heat transfer to PCB copper, supporting sustained 5 A operation under ambient temperatures up to +125°C.

It delivers stable reverse leakage across temperature: 0.22 mA at 25°C and 50 mA at 125°C under full 60 V blocking, outperforming standard Schottky diodes in high-temp reliability. The device is rated for non-repetitive surge current up to 170 A (8.3 ms), suitable for input rectification in systems with high inrush or line transients.

Key Specifications

Pinout & Package

Packaged in the thermally optimized POWERDI®5 surface-mount package (3.966 mm × 6.504 mm × <1.1 mm), featuring an exposed copper heat sink on the bottom side for direct PCB thermal coupling. Pins are arranged as left anode / right cathode, with both pins requiring PCB-level connection for mechanical and thermal integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar super barrier rectifier applications.

Compared with SBRT5A60-13 and MBR560F-TP, the SBR5E60P5-13 uniquely balances ultra-low VF, industry-leading thermal performance (RθJC = 3 °C/W), and proven avalanche ruggedness-making it the preferred choice for next-gen thin, high-efficiency, and thermally demanding power supplies.

Availability

SBR5E60P5-13 is available at Aetrix Electronics and suitable for AC-DC adapters, DC-DC converters, and polarity protection circuits requiring stable component supply, RoHS-compliant sourcing, and consistent thermal performance across production volumes.

Supply support for SBR5E60P5-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.

The SBR® Super Barrier Rectifier product line was engineered to replace Schottky diodes in high-efficiency, high-reliability power conversion-delivering lower VF than FRDs and superior ruggedness versus Schottkys in demanding thermal and surge environments.

FAQ

What is the maximum continuous forward current for SBR5E60P5-13 at 100°C ambient?

At 100°C ambient, the SBR5E60P5-13 supports approximately 3.7 A average forward current, based on its derating curve (Figure 4). This assumes mounting on a 2″×2″ aluminum board with adequate copper area; actual current depends on PCB layout and airflow.

Is the POWERDI®5 package lead-free and RoHS compliant?

Yes-the SBR5E60P5-13 features a lead-free finish and complies with EU RoHS Directive 2011/65/EU. It is also halogen- and antimony-free ("Green" per Diodes' definition), containing <900 ppm bromine, <900 ppm chlorine, and <1000 ppm antimony compounds.

Can SBR5E60P5-13 replace a standard Schottky diode in a 5 A, 60 V application?

Yes-its 0.52 V VF max at 5 A and 25°C is significantly lower than typical 60 V Schottkys (0.7–0.85 V), reducing conduction loss. Crucially, it adds avalanche ruggedness absent in Schottkys, making it safer for surge-prone inputs like offline rectification.

How should the exposed thermal pad on the bottom of the POWERDI®5 package be handled in PCB layout?

The exposed pad must be soldered to a minimum 100 mm² copper pour connected to ground or thermal plane using ≥4 thermal vias (0.3 mm diameter, spaced ≤2 mm apart). This achieves the specified RθJA of 22 °C/W; insufficient copper or vias will cause thermal derating and premature failure.