Diodes Incorporated SBRT10U50SP5-13D

Overview

SBRT10U50SP5-13D from Diodes Incorporated is a 10A, 50V Trench Super Barrier Rectifier (SBR) in the POWERDI®5 package, featuring ultra-low 0.45V max forward voltage at 10A/25°C and only 0.3mA max reverse leakage at 50V/125°C. It serves as a high-efficiency rectifier, freewheeling diode, or polarity protection device in compact AC/DC adapters and DC/DC converters.

For engineers reviewing the SBRT10U50SP5-13D datasheet, SBRT10U50SP5-13D pinout, SBRT10U50SP5-13D application, or SBRT10U50SP5-13D equivalent, key selection criteria include thermal resistance (RθJC = 2°C/W), low-profile 1.1mm height, AEC-Q101 qualification, RoHS/Green compliance, and junction-to-lead thermal path optimization for PCB-level heat dissipation.

Technical Context

This SBR leverages trench MOS-gated architecture to achieve lower VF than Schottky diodes while maintaining superior high-temperature IR stability-unlike conventional Schottkys, it sustains <0.3mA leakage at 125°C under full 50V blocking. Its RθJC of 2°C/W and RθJL of 4°C/W indicate direct thermal conduction through the cathode lead and exposed bottom-side heat sink.

The POWERDI®5 package integrates a thermally enhanced bottom-side copper pad with dual-side terminal connections (anode and cathode on left/right pins, electrically joined at PCB level), enabling efficient heat transfer to the board without requiring external heatsinks in ≤10W applications.

Key Specifications

Pinout & Package

Packaged in the surface-mount POWERDI®5 thermally enhanced outline (3.966mm × 6.504mm × 1.1mm max), with exposed bottom-side copper slug acting as primary thermal interface and electrical cathode connection.

Key Features

Applications

Availability

SBRT10U50SP5-13D is available at Aetrix Electronics and suitable for AC/DC adapters, DC/DC converters, and automotive body control modules requiring stable component supply, AEC-Q101 qualification, and high-temperature reliability.

Supply support for SBRT10U50SP5-13D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for industrial, computing, and automotive markets.

The Trench SBR product line delivers ultra-low VF rectifiers optimized for high-current, high-temperature switching power supplies-designed specifically to replace Schottky diodes where leakage and thermal stability limit performance.

FAQ

What is the thermal performance difference between SBRT10U50SP5-13D and standard Schottky diodes in the same package?

SBRT10U50SP5-13D achieves RθJC = 2°C/W and RθJL = 4°C/W due to its exposed bottom-side cathode slug, whereas typical Schottkys in POWERDI5 show RθJC ≥ 5°C/W. At 10A, this yields ~15°C lower junction temperature-critical for maintaining <0.3mA IR at 125°C where Schottkys exceed 10mA.

Can SBRT10U50SP5-13D be used as a direct replacement for SBRT10U45SP5-13D?

Yes-both share identical POWERDI5 package, pinout, and thermal design. The only difference is VRRM: 50V vs. 45V. SBRT10U50SP5-13D offers 5V higher blocking margin, making it safer in 36V nominal systems subject to transient overvoltage, with no change to layout or thermal management.

Does the "D" suffix in SBRT10U50SP5-13D affect electrical performance?

No-the "D" denotes 13-inch tape-and-reel packaging with 12mm tape width (per Diodes' ordering guide). Electrical specs, thermal behavior, and marking remain identical to SBRT10U50SP5-13. Both meet the same AEC-Q101, RoHS, and Green specifications.

How does the dual-pin cathode configuration impact PCB layout?

The right pin and bottom copper slug are both cathode terminals and must be shorted together on the PCB using a wide copper pour. This dual-path design lowers effective cathode resistance and inductance, reducing voltage spikes during fast switching-layout must include thermal vias under the slug and avoid narrow traces between pins.