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Diodes Incorporated SDM0230CSP-7
- Part No.:
- SDM0230CSP-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- 3-XFDFN
- Datasheet:
-
SDM0230CSP-7.pdf
- Description:
- DIODE SCHOT 200MA X3-WLCUS0603-3
- Quantity:
- Payment:
- Shipping:
Inventory:4,093
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Product details
Overview
SDM0230CSP from Diodes Incorporated is a 30 V, 0.2 A Schottky barrier diode in a chip-scale package (X3-WLCUS0603-3), optimized for low forward voltage (0.50 V max at 200 mA) and ultra-low leakage (50 µA max at 30 V, 25°C), enabling high-efficiency reverse protection and blocking in space-constrained portable power rails.
For engineers reviewing the SDM0230CSP datasheet, SDM0230CSP pinout, SDM0230CSP application, or SDM0230CSP equivalent, key selection criteria include its 0.18 mm² footprint, 0.3 mm profile, thermal resistance (261 °C/W), soft switching behavior, and cathode-dot polarity marking - all critical for battery-powered DC/DC and USB load-switch designs.
Technical Context
This Schottky diode uses a planar metal–semiconductor junction to achieve fast recovery (soft switching) and minimal forward conduction loss. Its low RθJA of 261 °C/W is achieved via direct die-attach on FR-4 with minimum pad layout per AP02001, supporting thermal integrity in dense layouts.
Electrical performance is specified across –55°C to +150°C: VF remains ≤0.50 V at 200 mA/25°C and ≤0.36 V at 200 mA/125°C; IR rises to only 1.5 mA at 30 V/125°C - confirming stable reverse blocking under elevated ambient conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 30 V - supports input rails up to 24 V nominal with 25% safety margin against transients |
| IO | 0.2 A continuous - suitable for low-power USB peripherals, sensor nodes, and bias rails |
| VF (max) | 0.50 V @ 200 mA, 25°C - reduces conduction loss to ≤100 mW, minimizing self-heating |
| IR (max) | 50 µA @ 30 V, 25°C - preserves battery runtime in always-on standby paths |
| CJ | 9 pF @ 15 V - enables clean switching in 1–10 MHz boost converters without excessive ringing |
| RθJA | 261 °C/W - allows ~100 mW dissipation with <26°C rise on standard FR-4, no heatsink needed |
Pinout & Package
Package: X3-WLCUS0603-3 chip-scale package (CSP), 0.30 mm × 0.21 mm body, 0.3 mm max height, cathode marked by dot. Two-terminal device with anode (Pin 1) and cathode (Pin 2) on bottom-side solder bumps.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Pin 1) | Current entry point under forward bias | Connected to higher-potential rail (e.g., battery+, USB VBUS); requires proper current-limiting design |
| Cathode (Pin 2) | Current exit point under forward bias; marked with dot | Connected to load or regulator input; polarity must be verified before reflow to prevent reverse connection |
Key Features
| Feature | Design Value |
|---|---|
| 0.18 mm² footprint | 70% smaller than DFN1006/SOD923 - enables routing under QFNs and saves >0.3 mm² per diode in wearables |
| 0.3 mm profile | 30% thinner than DFN1006 - accommodates ultra-thin enclosures (<8 mm total height) and stacked PCBs |
| Soft, fast switching | Low stored charge and absence of minority-carrier tail - minimizes EMI in 1–5 MHz DC/DC feedback paths |
| Lead-free & Green | Halogen- and antimony-free (<900 ppm Br/Cl, <1000 ppm Sb) - meets IPC-1752A Tier 1 reporting and EU SCIP requirements |
Applications
| USB Power Path Protection | Li-ion Battery Backup Switching |
|---|---|
Use Scenario: Preventing backfeed from USB VBUS into battery during charging or system sleep. IC Role / Device Role: Reverse-blocking diode in OR-ing configuration between USB and battery rails. Use Value: 50 µA max leakage at 25°C extends shelf life of coin-cell–backed RTCs by >3× versus standard silicon diodes. |
Use Scenario: Isolating main Li-ion battery from backup supercapacitor during normal operation. IC Role / Device Role: Low-VF blocking diode ensuring minimal voltage drop (<0.5 V) in backup path. Use Value: 0.50 V max VF at 200 mA maintains ≥3.2 V at backup load, preserving brownout margin for MCU retention. |
| Boost Converter Output Rectification | Low-Power Sensor Node Rail Clamp |
Use Scenario: Rectifying output of 3.3 V → 5 V boost converter in BLE module. IC Role / Device Role: High-frequency rectifier replacing synchronous MOSFET where gate drive complexity is prohibitive. Use Value: 9 pF junction capacitance limits switching node ringing, reducing need for snubbers in 2–3 MHz designs. |
Use Scenario: Clamping I²C or GPIO lines to 3.3 V rail in industrial sensor nodes exposed to ESD. IC Role / Device Role: Low-leakage clamp diode limiting transient overvoltage without loading idle bus. Use Value: Sub-µA leakage at 0.5 V reverse bias prevents false logic states on high-impedance microcontroller inputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB050M-30TR | Higher IO (0.5 A), larger SOD-523 package (0.6 × 0.3 mm), VF = 0.45 V @ 200 mA | Less board-area efficient; better suited for higher-current rails where thermal margin >150 mW is required | Select when >0.2 A average current or >100 mW dissipation is expected; avoid if footprint <0.2 mm² is mandatory |
| NSR0230P2T5G | Same CSP (0.3 × 0.2 mm), but VF = 0.42 V @ 200 mA, IR = 100 µA @ 30 V, 25°C | Higher leakage compromises battery hold-up time in always-on sensors | Acceptable for cost-sensitive consumer apps where 50 µA leakage is non-critical; not recommended for medical or long-life IoT |
Compared with RB050M-30TR and NSR0230P2T5G, SDM0230CSP uniquely balances ultra-compact size, lowest leakage, and thermally robust CSP construction - making it optimal for space- and battery-limited edge-node designs where every µA and µm matters.
Availability
SDM0230CSP is available at Aetrix Electronics and suitable for USB power management, wearable battery backup circuits, and low-power sensor node clamping requiring stable component supply and long-term lifecycle support despite its obsolete status.
Supply support for SDM0230CSP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for consumer, industrial, and automotive markets.
The SDM0230CSP belongs to Diodes' ultra-compact Schottky diode product line, engineered specifically for miniaturized portable electronics where board area, profile, and standby power are primary constraints.
FAQ
Is SDM0230CSP still in production?
No - Diodes Incorporated has discontinued SDM0230CSP (marked "OBSOLETE – PART DISCONTINUED" in DS35649 Rev. 8-4). Aetrix Electronics maintains legacy inventory with full traceability and offers qualified last-time-buy support, including extended warranty and documentation archives.
What is the cathode identification method on SDM0230CSP?
The cathode is identified by a laser-marked dot located adjacent to Pin 2 (cathode terminal) on the bottom die surface. The dot aligns with the "Cathode Dot" annotation in the mechanical drawing (DS35649 page 3), and must be oriented toward the lower-potential side of the circuit during placement.
Can SDM0230CSP replace SOD-923 Schottky diodes in existing layouts?
No - SDM0230CSP uses X3-WLCUS0603-3 (0.30 × 0.21 mm), while SOD-923 measures 1.0 × 0.6 mm. Pad layout, stencil aperture, and reflow profile differ significantly; direct replacement requires PCB redesign per AP02001 recommended pads and AP02002 outline dimensions.
What is the maximum allowable reflow peak temperature for SDM0230CSP?
SDM0230CSP is rated for Moisture Sensitivity Level 1 per J-STD-020, permitting unlimited floor life and standard Pb-free reflow with peak temperature up to 260°C for ≤30 seconds. No pre-bake is required, but board-level thermal profiling must ensure localized die temperature stays below 260°C.
SDM0230CSP-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 3-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- -
- Current - Average Rectified (Io):
- 200mA
- Voltage - Forward (Vf) (Max) @ If:
- 500 mV @ 200 mA
- Speed:
- Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 50 µA @ 30 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-WLCUS0603-3
- Operating Temperature - Junction:
- -55°C ~ 150°C
SDM0230CSP-7 FAQ
1.How can I place an order for SDM0230CSP-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for SDM0230CSP-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SDM0230CSP-7 reliable?
The price and inventory of SDM0230CSP-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SDM0230CSP-7 is usually 5 days.
3.What payment methods are accepted for SDM0230CSP-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SDM0230CSP-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SDM0230CSP-7?
SDM0230CSP-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SDM0230CSP-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SDM0230CSP-7?
For technical support, including SDM0230CSP-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SDM0230CSP-7 requirements.
6.How does Aetrix verify that SDM0230CSP-7 is sourced from the original manufacturer or authorized distributors?
All SDM0230CSP-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SDM0230CSP-7 meets industry standards.
7.What is the process for return or replacement of SDM0230CSP-7?
All SDM0230CSP-7 units undergo pre-shipment inspection (PSI). If there is an issue with SDM0230CSP-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SDM0230CSP-7 part is unused and in its original packaging.
Return procedure for SDM0230CSP-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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