Diodes Incorporated SDM02M30CLP3-7B

Overview

SDM02M30CLP3-7B from Diodes Incorporated is a dual-anode, single-cathode Schottky barrier diode in X2-DFN1006-3 package, rated for 30 V peak reverse voltage, 200 mA average output current, and 0.70 V max forward voltage at 100 mA. It delivers ultra-low reverse leakage (0.4 µA at 30 V) and 2 ns reverse recovery time, enabling efficient clamping and freewheeling in space-constrained portable power rails.

For engineers reviewing the SDM02M30CLP3-7B datasheet, SDM02M30CLP3-7B pinout, SDM02M30CLP3-7B application, or SDM02M30CLP3-7B equivalent, key selection criteria include its DFN1006 footprint (1.0 × 0.6 mm), common-cathode dual-diode configuration, low thermal resistance (350 °C/W), and suitability for reverse polarity protection in battery-powered USB peripherals and display backlight circuits.

Technical Context

This dual-anode Schottky diode integrates two independent anodes sharing one cathode terminal, supporting parallel or independent signal paths with matched electrical characteristics. Its silicon epitaxial construction enables fast switching (t_RR = 2 ns) and low junction capacitance (3.3 pF at 5 V), critical for high-frequency clamp and flyback suppression.

The device operates across –55 °C to +150 °C with 350 mW total power dissipation on FR-4 PCB, leveraging its ultra-thin 0.37 mm profile and NiPdAu-plated copper leadframe for reliable thermal and solder-joint performance in reflow-processed mobile modules.

Key Specifications

Pinout & Package

Package: X2-DFN1006-3 - 1.0 mm × 0.6 mm × 0.37 mm leadless surface-mount package with exposed thermal pad (cathode-connected), UL 94V-0 molding compound, and NiPdAu finish on copper leadframe.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Compared with RB050M-30TE25 and NSR0230HT1G, SDM02M30CLP3-7B uniquely provides dual-anode integration in DFN1006, delivering 75% lower leakage than RB050M-30TE25 and eliminating inter-device mismatch in clamping response-critical for precision analog front-ends.

Availability

SDM02M30CLP3-7B is available at Aetrix Electronics and suitable for portable device power management, LCD backlighting circuits, and ESD-sensitive keypad interfaces requiring stable component supply and consistent DFN1006 assembly yield.

Supply support for SDM02M30CLP3-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.

The SDM02M30CLP3-7B belongs to Diodes' high-efficiency Schottky diode product line, engineered specifically for miniaturized battery-powered systems where low leakage, fast switching, and ultra-compact packaging are mandatory.

FAQ

What is the thermal pad connection requirement for SDM02M30CLP3-7B?

The exposed thermal pad on the underside of the X2-DFN1006-3 package must be soldered directly to a PCB copper pour tied to the cathode net. This connection reduces R_θJA by up to 40% and prevents thermal runaway during 200 mA continuous operation. No thermal vias are required for standard FR-4 layouts per Diodes' recommended pad dimensions.

Can SDM02M30CLP3-7B replace a single Schottky diode in existing designs?

Yes, but only when the circuit uses only one anode path and leaves the second anode unconnected. The unused anode must be left floating-not tied to GND or V_DD-to avoid parasitic conduction. Layout should retain both anode pads to maintain mechanical stability, even if one is unpopulated.

Is SDM02M30CLP3-7B suitable for automotive applications?

No. While it operates from –55 °C to +150 °C, SDM02M30CLP3-7B is not AEC-Q200 qualified and lacks automotive-grade traceability, lot control, and stress-test validation. For automotive body electronics, Diodes recommends the AEC-Q200-qualified SDM02M30Q3-7B variant with identical electrical specs and enhanced screening.

How does the cathode bar marking align with pin 1 identification?

The cathode bar on the top surface of SDM02M30CLP3-7B corresponds to the cathode terminal (C), which occupies the full width of the package's bottom edge. Pin 1 is defined as Anode 1 (A1), located adjacent to the cathode bar on the left side when the bar is oriented horizontally and viewed from the top; A2 is on the right. This matches JEDEC MO-229WEAC standard orientation.