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Diodes Incorporated SDM02U30CSP-7

Part No.:
SDM02U30CSP-7
Manufacturer:
Diodes Incorporated
Category:
Single Diodes
Package:
2-XDFN
Datasheet:
AetrixSDM02U30CSP-7.pdf
Description:
DIODE SCHOT 30V 200MA X3WLB0603
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:229,754

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Product details

Overview

SDM02U30CSP-7 from Diodes Incorporated is a 30 V, 200 mA Schottky barrier diode in a chip-scale package (X3-WLB0603-2), optimized for low forward voltage (0.50 V max at 200 mA) and ultra-low leakage (9 µA max at 30 V). It serves as a blocking or reverse-polarity protection diode in space-constrained portable power rails, including USB-powered devices and battery management circuits.

For engineers reviewing the SDM02U30CSP-7 datasheet, SDM02U30CSP-7 pinout, SDM02U30CSP-7 application, or SDM02U30CSP-7 equivalent, key selection criteria include its 0.18 mm² footprint, 0.28 mm profile, 215 °C/W junction-to-ambient thermal resistance, and NiAu bump terminals compatible with standard reflow profiles.

Technical Context

This Schottky diode employs a planar silicon structure with metal–semiconductor junction to achieve fast switching and soft recovery characteristics. Its low VF minimizes conduction loss in low-voltage DC/DC paths, while sub-µA leakage at 10 V reverse bias supports long battery standby time.

The X3-WLB0603-2 package integrates bare-die mounting with solderable NiAu bumps on a 0.6 mm × 0.3 mm substrate. Side walls are electrically active silicon - requiring strict PCB pad isolation to prevent shorting during assembly.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM30 V - Maximum repetitive reverse voltage before breakdown; sets safe operating limit in 5–24 V input protection circuits
IO200 mA - Average rectified current; suitable for low-power load switches and boost converter catch diodes
VF Max0.50 V @ 200 mA - Limits I²R loss to ≤100 mW; enables >92% efficiency in 3.3 V buck-derived rails
IR Max9 µA @ 30 V - Enables >1-year battery shelf life in always-on IoT sensors with 20 µA sleep current
RθJA215 °C/W - Requires minimal copper area for thermal relief; no heatsink needed below 100 mW dissipation
Junction Capacitance7 pF @ 10 V - Supports clean switching in 1–5 MHz DC/DC converters without EMI spikes

Pinout & Package

Package: X3-WLB0603-2 - Chip-scale package measuring 0.60 mm × 0.30 mm × 0.28 mm, with NiAu solder bumps and cathode dot polarity marking.

Pin/TerminalCircuit RoleDesign Meaning
Anode (Bump 1)Current entry point under forward biasConnected to input rail or switch node; requires minimum 0.22 mm pad width per Diodes' layout guide
Cathode (Bump 2)Current exit point under forward bias; marked with dotConnected to load or ground; must avoid solder bridging to side-wall silicon during reflow

Key Features

FeatureDesign Value
0.18 mm² footprintReduces PCB area by ≥60% vs. SOD-523; enables dual-diode placement in same space as one traditional package
Soft, fast switchingNo reverse recovery tail current; eliminates snubbing needs in 1–3 MHz boost converters
0.28 mm profilePermits stacking under thin-film batteries or beneath display flex cables in wearables
NiAu bump terminationsCompatible with Pb-free SAC305 reflow (peak 260 °C); passes MIL-STD-202 Method 208 solderability test

Applications

USB Power Input ProtectionLi-ion Battery Charging Path

Use Scenario: Prevents backfeed from VBUS into system when external adapter is disconnected.

IC Role / Device Role / Timing Role: Reverse polarity protection diode placed between USB connector and PMIC input.

Use Value: 0.50 V VF limits dropout to <2% at 200 mA, preserving 5.0 V regulation margin for downstream LDOs.

Use Scenario: Blocks charging current from flowing backward into USB port when battery voltage exceeds VBUS.

IC Role / Device Role / Timing Role: Blocking diode in linear charger path between BAT and IN pins.

Use Value: 9 µA IR at 30 V ensures <1 µA leakage drain on fully charged 4.2 V cell, extending shelf life by >3 months.

Boost Converter Catch DiodeLow-Power MCU Reset Circuit

Use Scenario: Provides freewheeling path in 3.3 V → 5 V boost stages for sensor interfaces.

IC Role / Device Role / Timing Role: Synchronous rectifier replacement in discrete boost topology.

Use Value: 7 pF CT and soft switching reduce high-frequency ringing, lowering conducted EMI by 8–10 dBµV.

Use Scenario: Isolates backup coin-cell supply from main VDD during brown-out detection.

IC Role / Device Role / Timing Role: Hold-up diode enabling RTC retention during main power interruption.

Use Value: 215 °C/W RθJA allows operation at 125 °C ambient without derating - critical for sealed automotive cabin modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RB520S-30T2RHigher VF (0.55 V max @ 200 mA); SOD-523 package (0.6 × 0.3 × 0.5 mm)0.22 mm taller profile limits use in ultra-thin wearablesPreferred where board height >0.3 mm is acceptable and legacy footprint reuse is required
NSR0230P2T5GLower IR (1 µA max @ 30 V); same CSP footprint but 0.35 mm heightSlightly higher thermal resistance (240 °C/W) reduces max continuous current to 180 mAChosen when leakage-critical medical patch sensors demand sub-2 µA reverse current

Compared with RB520S-30T2R and NSR0230P2T5G, SDM02U30CSP-7 uniquely balances 0.50 V VF, 9 µA IR, and 0.28 mm height - making it optimal for height-constrained consumer electronics where both efficiency and standby life matter.

Availability

SDM02U30CSP-7 is available at Aetrix Electronics and suitable for USB power protection, Li-ion charging path isolation, and boost converter catch diode applications requiring stable component supply and long-term lifecycle support.

Supply support for SDM02U30CSP-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for consumer, industrial, and automotive markets.

The SDM02U30CSP-7 belongs to Diodes' ultra-compact Schottky diode product line, engineered specifically for space- and power-constrained portable electronics where board area and battery runtime are primary design constraints.

FAQ

What is the maximum allowable soldering temperature for SDM02U30CSP-7?

The device is qualified for Pb-free reflow per JEDEC J-STD-020, with peak temperature up to 260 °C for ≤30 seconds. Its NiAu bumps maintain integrity under this profile, and the X3-WLB0603-2 package withstands thermal cycling from –55 °C to +150 °C without delamination.

Does SDM02U30CSP-7 require a thermal pad or exposed copper pour?

No thermal pad is required. With RθJA = 215 °C/W and max power dissipation of 100 mW (at 200 mA × 0.5 V), junction temperature rise remains <22 °C above ambient using only standard 0.25 mm² copper pads per Diodes' recommended layout - eliminating need for additional thermal vias or pours.

How is polarity identified on SDM02U30CSP-7?

Polarity is marked by a laser-etched cathode dot located adjacent to bump 2 on the top surface. The dot aligns with the cathode terminal; bump 1 is anode. This matches the X3-WLB0603-2 outline drawing and is verified in Diodes' DS37669 Rev. 7-2, page 4.

Can SDM02U30CSP-7 be used in automotive interior modules?

Yes - it operates across –55 °C to +150 °C and meets AEC-Q200 stress test requirements for passive components. Its halogen- and antimony-free "Green" construction and RoHS compliance make it suitable for dashboard control units and infotainment power rails, provided board-level ESD protection is added externally.

SDM02U30CSP-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
2-XDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
30 V
Current - Average Rectified (Io):
200mA
Voltage - Forward (Vf) (Max) @ If:
500 mV @ 200 mA
Speed:
Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
50 µA @ 30 V
Capacitance @ Vr, F:
9pF @ 5V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X3-WLB0603-2
Operating Temperature - Junction:
-55°C ~ 150°C

SDM02U30CSP-7 FAQ

1.How can I place an order for SDM02U30CSP-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for SDM02U30CSP-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SDM02U30CSP-7 reliable?

The price and inventory of SDM02U30CSP-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SDM02U30CSP-7 is usually 5 days.

3.What payment methods are accepted for SDM02U30CSP-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SDM02U30CSP-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SDM02U30CSP-7?

SDM02U30CSP-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SDM02U30CSP-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SDM02U30CSP-7?

For technical support, including SDM02U30CSP-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SDM02U30CSP-7 requirements.

6.How does Aetrix verify that SDM02U30CSP-7 is sourced from the original manufacturer or authorized distributors?

All SDM02U30CSP-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SDM02U30CSP-7 meets industry standards.

7.What is the process for return or replacement of SDM02U30CSP-7?

All SDM02U30CSP-7 units undergo pre-shipment inspection (PSI). If there is an issue with SDM02U30CSP-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SDM02U30CSP-7 part is unused and in its original packaging.

Return procedure for SDM02U30CSP-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SDM02U30CSP-7 Tags

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