Diodes Incorporated SDM05U20CSP-7

Overview

SDM05U20CSP from Diodes Incorporated is a 20 V, 0.5 A Schottky barrier rectifier in a chip-scale package (X3-WLB1006-2), featuring 0.43 V max forward voltage at 0.5 A, 55 µA max reverse leakage at 20 V, and 95 °C/W typical junction-to-ambient thermal resistance. It serves as a compact, low-loss blocking or reverse protection diode in space-constrained portable power rails.

For engineers reviewing the SDM05U20CSP datasheet, SDM05U20CSP pinout, SDM05U20CSP application, or SDM05U20CSP equivalent, key selection criteria include its ultra-thin 0.275 mm profile, low VF conduction loss, high-temperature IR stability, and CSP solderability with NiAu bumps - critical for battery-powered DC/DC and USB power-path designs.

Technical Context

This Schottky rectifier uses a planar metal-semiconductor junction optimized for minimal forward voltage and suppressed high-temperature leakage. Its 46 pF junction capacitance at 4 V reverse bias and 0.29 V VF at 0.5 A and +125°C enable stable switching in boost converters and load-switching circuits up to 1 MHz.

The X3-WLB1006-2 package integrates two terminals (anode/cathode) on a silicon die with wafer-level bumping, achieving 0.6 mm² board area and 0.001 g mass. Thermal performance depends on PCB copper area: RθJA drops from 155 °C/W (minimum pad) to 95 °C/W (1 in² copper), directly impacting continuous current derating.

Key Specifications

Pinout & Package

Package: X3-WLB1006-2 chip-scale package (CSP), 0.95 × 0.55 mm outline, 0.275 mm height, NiAu solderable bumps, cathode marked by dot.

Key Features

Applications

Availability

SDM05U20CSP is available at Aetrix Electronics and suitable for portable medical devices, USB-C power accessories, battery management subsystems, and compact LED drivers requiring stable component supply and long-term lifecycle support.

Supply support for SDM05U20CSP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.

The SDM05U20CSP belongs to Diodes' ultra-compact Schottky rectifier product line, engineered specifically for space- and efficiency-critical DC/DC conversion and power-path protection in battery-powered consumer and industrial electronics.

FAQ

What is the maximum continuous current rating for SDM05U20CSP at +85°C ambient?

At +85°C ambient with 1 in² copper on FR-4 PCB, the SDM05U20CSP supports ~0.4 A continuous current. This is derived from its 95 °C/W RθJA, 150°C max junction temperature, and 0.43 V VF - resulting in ~170 mW power dissipation and 65°C junction rise above ambient.

Does SDM05U20CSP have a specified reverse recovery time (trr)?

No - as a Schottky barrier rectifier, SDM05U20CSP has no minority-carrier storage delay and exhibits negligible reverse recovery time. Its operation relies on majority-carrier conduction, making it inherently faster than PN-junction diodes, with effective trr < 10 ns under typical conditions.

Can SDM05U20CSP be used in place of a standard SOD-123 or DFN1006 Schottky?

Yes, but only with layout adaptation: SDM05U20CSP uses wafer-level bumps instead of gull-wing leads, requiring revised stencil design, reflow profile tuning, and pad geometry per AP02001. Its 0.275 mm height and 0.6 mm² footprint offer mechanical advantages but demand tighter process control.

Is the cathode marking visible after reflow soldering?

Yes - the cathode is indicated by a laser-marked dot on the silicon die surface, positioned adjacent to the cathode bump. This mark remains clearly visible post-reflow under 20× magnification and is aligned to the package corner per Diodes' X3-WLB1006-2 orientation standard.