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Diodes Incorporated SDM1A40CP3-7
- Part No.:
- SDM1A40CP3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- 2-XDFN
- Datasheet:
-
SDM1A40CP3-7.pdf
- Description:
- DIODE SCHOTT 40V 1A X3-DSN1006-2
- Quantity:
- Payment:
- Shipping:
Inventory:3,292
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Product details
Overview
SDM1A40CP3 from Diodes Incorporated is a 40 V, 1 A surface-mount Schottky barrier rectifier in X3-DSN1006-2 package, featuring VF = 0.56 V @ 1 A / 25°C, IR = 75 µA @ 40 V / 25°C, and RθJA = 60 °C/W on 1 in² copper. It serves as a blocking, boost, or reverse protection diode in space-constrained portable power rails.
For engineers reviewing the SDM1A40CP3 datasheet, SDM1A40CP3 pinout, SDM1A40CP3 application, or SDM1A40CP3 equivalent, key selection criteria include low-profile height (0.275 mm), thermal resistance under real PCB layout conditions, high-temperature leakage performance (9 mA @ 40 V / 125°C), and compatibility with automated SMT assembly for ultra-thin consumer electronics.
Technical Context
This Schottky rectifier uses a planar die structure with NiAu bump terminals to achieve low forward voltage and minimized junction capacitance (CT = 35 pF @ 4 V). Its thermal design targets board-level efficiency gains via reduced conduction loss and improved heat dissipation on standard FR-4 with 2 oz copper.
The device operates across –55°C to +150°C and exhibits controlled derating above 85°C ambient, with leakage current rising predictably to 9 mA at 125°C - critical for reverse-bias reliability in battery-powered DC/DC stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 40 V - Maximum repetitive reverse voltage before breakdown; sets safe operating margin for 12–24 V input rails. |
| IO | 1 A - Continuous average forward current rating; defines steady-state power delivery capability. |
| VF | 0.56 V @ 1 A / 25°C - Directly determines conduction loss (0.56 W per diode) and thermal load in boost converters. |
| IR | 75 µA @ 40 V / 25°C - Low leakage preserves battery standby time; rises to 9 mA @ 125°C for thermal failure analysis. |
| RθJA | 60 °C/W - Measured on 1 in² 2 oz copper; enables accurate junction temperature estimation in compact layouts. |
| CT | 35 pF @ 4 V / 1 MHz - Limits high-frequency switching noise and affects EMI filter design in SMPS. |
| Package | X3-DSN1006-2 - 1.0 × 0.6 mm footprint, 0.275 mm profile; fits sub-1 mm Z-height designs. |
Pinout & Package
Package: X3-DSN1006-2 - ultra-thin, two-terminal surface-mount package with cathode dot marking and NiAu bump terminations. Dimensions: 1.00 mm × 0.60 mm × 0.275 mm (L × W × H), 0.6 mm² board area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to source/switch node in boost or buck-boost topologies; requires low-inductance trace routing. |
| Cathode | Forward current exit / reverse voltage reference | Marked with dot; ties to output rail or ground return path; critical for reverse polarity protection integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low profile (0.275 mm) | Enables integration into <1 mm Z-height portable devices such as wearables and slim power banks. |
| Low VF (0.42–0.56 V) | Reduces conduction loss by ≥30% vs. comparable 1 A Si diodes, improving efficiency in 5–12 V DC/DC stages. |
| Controlled high-temp IR | Leakage remains predictable up to 125°C (9 mA), supporting thermal runaway mitigation in sealed enclosures. |
| Lead-free & halogen-free | Fully RoHS 3 and "Green" compliant (<900 ppm Br/Cl, <1000 ppm Sb); meets global environmental compliance mandates. |
Applications
| USB Power Delivery Input Protection | Wireless Charging Transmit Stage |
|---|---|
Use Scenario: Reverse polarity and overvoltage protection at USB-C PD input of portable battery packs. IC Role / Device Role / Timing Role: Reverse protection diode placed between input connector and buck converter input. Use Value: Prevents damage during hot-plug events while adding <0.56 V drop and occupying only 0.6 mm² board area. | Use Scenario: Boost diode in 5–20 W wireless charging transmitter power stage. IC Role / Device Role / Timing Role: High-frequency rectification in resonant LLC or boost converter feeding transmitter coil. Use Value: Low CT (35 pF) minimizes switching node ringing; low VF improves overall system efficiency by >1.2% at 1 A load. |
| Smartwatch Battery Management | Bluetooth Earbud Charging Case |
Use Scenario: Blocking diode isolating main Li-ion cell from auxiliary charging circuitry. IC Role / Device Role / Timing Role: Unidirectional current gate preventing backfeed during multi-path charging. Use Value: 75 µA leakage at 25°C extends shelf life; 0.275 mm height allows placement under display bezel. | Use Scenario: Output rectifier in miniature 5 V boost converter powering earbud charging contacts. IC Role / Device Role / Timing Role: Final-stage rectifier delivering regulated 5 V to contact pads. Use Value: Compact 1.0 × 0.6 mm footprint enables dual-diode layout in <10 mm² total area; NiAu bumps ensure solder joint reliability after repeated reflow cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB050M-30 | Higher VF (0.55 V min @ 1 A), larger SOD-123FL package (1.7 × 1.3 mm), RθJA ≈ 120 °C/W | Less suitable for ultra-thin designs; better for cost-sensitive industrial boards with relaxed height constraints | Select when board height > 0.4 mm and thermal budget allows higher junction rise |
| SS12 | Same VF spec but SMA package (4.5 × 2.7 mm), IO = 2 A, RθJA ≈ 100 °C/W, no halogen-free certification | Used in higher-current AC/DC adapters; incompatible with fine-pitch SMT lines due to size | Choose only if current headroom >1 A is required and RoHS 3 compliance is not mandated |
Compared with RB050M-30 and SS12, SDM1A40CP3 delivers superior board-area efficiency (0.6 mm² vs. ≥2.2 mm²), lower thermal resistance on optimized copper, and guaranteed halogen-free compliance - making it the sole choice for next-gen wearable and hearable power stages where Z-height and environmental specs are non-negotiable.
Availability
SDM1A40CP3 is available at Aetrix Electronics and suitable for USB-C power delivery modules, wireless charging transmitters, smartwatch battery management systems, and Bluetooth earbud charging cases requiring stable component supply and full RoHS 3 compliance.
Supply support for SDM1A40CP3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
The SDM1A40CP3 belongs to Diodes' advanced Schottky rectifier product line, engineered specifically for ultra-compact, high-efficiency power conversion in battery-powered portable electronics.
FAQ
What is the maximum allowable junction temperature for SDM1A40CP3?
The SDM1A40CP3 has an operating junction temperature range of –55°C to +150°C. Its absolute maximum TJ is 150°C, validated under rated current and specified thermal conditions. Derating begins above 85°C ambient, as shown in Figure 4 of DS38970 Rev. 4–2.
Is SDM1A40CP3 suitable for automotive applications?
No - SDM1A40CP3 is not AEC-Q101 qualified. Diodes Incorporated explicitly states that automotive-grade versions require PPAP capability and IATF 16949 manufacturing; this part is intended for commercial portable electronics only.
How does the NiAu bump termination affect soldering process compatibility?
The NiAu bump terminals meet MIL-STD-202 Method 208 for solderability and are compatible with standard lead-free reflow profiles (peak 260°C). They eliminate intermetallic formation issues common with SnPb finishes and support fine-pitch placement accuracy down to 0.65 mm pitch.
Can SDM1A40CP3 replace a standard 1N5819 in existing designs?
Only with layout revision: SDM1A40CP3 uses X3-DSN1006-2 (1.0 × 0.6 mm), while 1N5819 is DO-41 through-hole. Electrical replacement is viable (VRRM = 40 V, IO = 1 A), but board redesign is mandatory for footprint, thermal pad, and solder stencil changes.
SDM1A40CP3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 2-XDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 560 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 75 µA @ 40 V
- Capacitance @ Vr, F:
- 35pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-DSN1006-2
- Operating Temperature - Junction:
- -55°C ~ 150°C
SDM1A40CP3-7 FAQ
1.How can I place an order for SDM1A40CP3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for SDM1A40CP3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SDM1A40CP3-7 reliable?
The price and inventory of SDM1A40CP3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SDM1A40CP3-7 is usually 5 days.
3.What payment methods are accepted for SDM1A40CP3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SDM1A40CP3-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SDM1A40CP3-7?
SDM1A40CP3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SDM1A40CP3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SDM1A40CP3-7?
For technical support, including SDM1A40CP3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SDM1A40CP3-7 requirements.
6.How does Aetrix verify that SDM1A40CP3-7 is sourced from the original manufacturer or authorized distributors?
All SDM1A40CP3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SDM1A40CP3-7 meets industry standards.
7.What is the process for return or replacement of SDM1A40CP3-7?
All SDM1A40CP3-7 units undergo pre-shipment inspection (PSI). If there is an issue with SDM1A40CP3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SDM1A40CP3-7 part is unused and in its original packaging.
Return procedure for SDM1A40CP3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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Diodes Incorporated
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