Diodes Incorporated SDM1A40CSP-7

Overview

SDM1A40CSP-7 from Diodes Incorporated is a 40 V, 1 A Schottky barrier rectifier in chip-scale package (X3-WLB1006-2), featuring 0.46 V forward voltage at 1 A/25°C, 75 µA reverse leakage at 40 V/25°C, and 80 °C/W junction-to-ambient thermal resistance on 1-in² copper. It serves as a blocking or reverse protection diode in space-constrained portable power rails.

For engineers reviewing the SDM1A40CSP-7 datasheet, SDM1A40CSP-7 pinout, SDM1A40CSP-7 application, or SDM1A40CSP-7 equivalent, key selection criteria include low VF for efficiency, ultra-thin 0.275 mm profile for stacked PCBs, CSP thermal performance, and 150°C max operating temperature for high-density battery management systems.

Technical Context

This Schottky rectifier uses a planar metal–semiconductor junction optimized for minimal conduction loss and suppressed high-temperature leakage. Its 35 pF junction capacitance at 4 V enables fast switching in DC-DC boost stages up to several MHz.

The X3-WLB1006-2 package employs NiAu bumps for solder attachment and achieves 135 °C/W RθJA on minimal FR-4 pad layout-critical for thermally isolated USB-C PD input stages where board area is limited to <0.6 mm².

Key Specifications

Pinout & Package

Package: X3-WLB1006-2 chip-scale package with NiAu solder bumps, 0.275 mm height, 1.0 × 0.6 mm footprint, cathode marked by dot.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with RB050M-30TR and SS14-HF, SDM1A40CSP-7 delivers superior board-area efficiency and thermal performance in sealed, space-limited portable electronics-its 0.275 mm height and 80 °C/W RθJA enable 1 A operation where alternatives require derating or additional copper pours.

Availability

SDM1A40CSP-7 is available at Aetrix Electronics and suitable for USB-C power delivery modules, wireless charging transmitters, BLE sensor nodes, and industrial IoT edge devices requiring stable component supply with guaranteed long-term sourcing.

Supply support for SDM1A40CSP-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for consumer, industrial, and automotive markets.

The SDM1A40CSP-7 belongs to Diodes' CSP Schottky rectifier product line, engineered specifically for ultra-compact, thermally demanding portable power applications where traditional SMD packages cannot meet thickness or thermal resistance targets.

FAQ

What is the maximum allowable soldering temperature for SDM1A40CSP-7?

The SDM1A40CSP-7 uses NiAu bumps qualified for standard lead-free reflow profiles. Peak temperature must not exceed 260°C for ≤10 seconds, per J-STD-020 Level 1 moisture sensitivity. Preheat ramp rate should be ≤3°C/s to avoid bump fracture or delamination.

Does SDM1A40CSP-7 require a thermal pad or exposed copper pour?

No thermal pad is integrated into the X3-WLB1006-2 package. Thermal performance relies entirely on the two NiAu bumps and recommended 1-in² copper area per AP02001 layout. Adding extra copper beyond the specified pad does not improve RθJA due to the absence of bottom-side thermal vias or exposed die attach.

Can SDM1A40CSP-7 replace a standard 1N5819 in existing designs?

Only with layout revision: SDM1A40CSP-7 is a 2-bump CSP requiring micro-reflow and stencil-defined pads, whereas 1N5819 uses DO-41 through-hole or SMA SMD. Electrical specs are comparable (VF ~0.45 V, VRRM 40 V), but mechanical compatibility is zero without redesigning footprint and assembly process.

Is the cathode marking visible after reflow soldering?

Yes-the cathode dot is laser-marked on the silicon die surface and remains optically visible post-reflow under 10× magnification. It aligns with bump 2 per package drawing; automated optical inspection (AOI) systems can reliably detect orientation using this mark during SMT verification.